JPS6312838U - - Google Patents
Info
- Publication number
- JPS6312838U JPS6312838U JP1986074848U JP7484886U JPS6312838U JP S6312838 U JPS6312838 U JP S6312838U JP 1986074848 U JP1986074848 U JP 1986074848U JP 7484886 U JP7484886 U JP 7484886U JP S6312838 U JPS6312838 U JP S6312838U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating layer
- internal wiring
- bonding pad
- polysilicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/536—
-
- H10W72/59—
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074848U JPS6312838U (enExample) | 1986-05-19 | 1986-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074848U JPS6312838U (enExample) | 1986-05-19 | 1986-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6312838U true JPS6312838U (enExample) | 1988-01-27 |
Family
ID=30920446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986074848U Pending JPS6312838U (enExample) | 1986-05-19 | 1986-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6312838U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999065075A1 (en) * | 1998-06-12 | 1999-12-16 | Hitachi, Ltd. | Semiconductor device and method for manufacturing the same |
-
1986
- 1986-05-19 JP JP1986074848U patent/JPS6312838U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999065075A1 (en) * | 1998-06-12 | 1999-12-16 | Hitachi, Ltd. | Semiconductor device and method for manufacturing the same |