JPS6312837U - - Google Patents
Info
- Publication number
- JPS6312837U JPS6312837U JP1986074847U JP7484786U JPS6312837U JP S6312837 U JPS6312837 U JP S6312837U JP 1986074847 U JP1986074847 U JP 1986074847U JP 7484786 U JP7484786 U JP 7484786U JP S6312837 U JPS6312837 U JP S6312837U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pad
- metal wiring
- internal metal
- insulating layer
- wiring layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/536—
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- H10W72/59—
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- H10W72/983—
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074847U JPS6312837U (enExample) | 1986-05-19 | 1986-05-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986074847U JPS6312837U (enExample) | 1986-05-19 | 1986-05-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6312837U true JPS6312837U (enExample) | 1988-01-27 |
Family
ID=30920444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986074847U Pending JPS6312837U (enExample) | 1986-05-19 | 1986-05-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6312837U (enExample) |
-
1986
- 1986-05-19 JP JP1986074847U patent/JPS6312837U/ja active Pending