JPS6312834U - - Google Patents

Info

Publication number
JPS6312834U
JPS6312834U JP10706986U JP10706986U JPS6312834U JP S6312834 U JPS6312834 U JP S6312834U JP 10706986 U JP10706986 U JP 10706986U JP 10706986 U JP10706986 U JP 10706986U JP S6312834 U JPS6312834 U JP S6312834U
Authority
JP
Japan
Prior art keywords
semiconductor element
plunger
resin sealing
output
reciprocating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10706986U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10706986U priority Critical patent/JPS6312834U/ja
Priority to US07/056,764 priority patent/US4735563A/en
Publication of JPS6312834U publication Critical patent/JPS6312834U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の一実施例を示す断面図、第
２図はその駆動系を示す構成図、第３図はこの考
案の動作状態を示す断面図、第４図は従来装置の
側面図である。図中、７は上金型、１６はタブレ
ツト、３３はボールねじ軸、３９はナツト、４０
はロツド、４１はチエーン、４２はピン、４３は
プランジヤ、４５は内部下金型、４６は外部下金
型である。なお、各図中同一符号は、同一又は相
当部分を示す。 Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is a configuration diagram showing its drive system, Fig. 3 is a sectional view showing the operating state of this invention, and Fig. 4 is a side view of a conventional device. It is. In the figure, 7 is the upper mold, 16 is the tablet, 33 is the ball screw shaft, 39 is the nut, 40
41 is a chain, 42 is a pin, 43 is a plunger, 45 is an internal lower mold, and 46 is an external lower mold. Note that the same reference numerals in each figure indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】 (1) 半導体素子を収納する上金型と下金型、上
記半導体素子を封止すべく上記上金型と下金型内
に樹脂を圧入するプランジヤ、このプランジヤを
往復動し得る出力部を有する往復動手段、この往
復動手段の出力部と上記プランジヤとを連結して
上記出力部の往復駆動力を上記プランジヤに伝達
する可撓性の伝達部材及び上記出力部と上記伝達
部材とを連結し、上記伝達部材が反出力側へ最も
移動した位置にて上記上金型又は上記下金型から
露出する連結ピンを備えた半導体素子用樹脂封止
装置。 (2) 上記往復動手段は、ボールねじからなる出
力部と、この出力部を駆動するサーボモータとで
構成されていることを特徴とする実用新案登録請
求の範囲第１項記載の半導体素子用樹脂封止装置
。 (3) 上記伝達部材は、チエーンで構成されてい
ることを特徴とする実用新案登録請求の範囲第１
項記載の半導体素子用樹脂封止装置。 (4) 上記伝達部材は、ワイヤで構成されている
ことを特徴とする実用新案登録請求の範囲第１項
記載の半導体素子用樹脂封止装置。[Scope of Claim for Utility Model Registration] (1) An upper mold and a lower mold that house a semiconductor element, a plunger that press-fits resin into the upper mold and the lower mold to seal the semiconductor element, and this plunger. reciprocating means having an output part capable of reciprocating the reciprocating means; a flexible transmission member that connects the output part of the reciprocating means with the plunger to transmit the reciprocating driving force of the output part to the plunger; and the output. A resin sealing device for a semiconductor element, comprising a connecting pin that connects the transmitting member and the transmitting member, and is exposed from the upper mold or the lower mold at a position where the transmitting member moves farthest toward the opposite output side. (2) The semiconductor device according to claim 1, wherein the reciprocating means is composed of an output section made of a ball screw and a servo motor that drives the output section. Resin sealing equipment. (3) Utility model registration claim 1, characterized in that the transmission member is composed of a chain.
A resin sealing device for a semiconductor element as described in 1. (4) The resin sealing device for a semiconductor element according to claim 1, wherein the transmission member is composed of a wire.
JP10706986U 1986-06-05 1986-07-10 Pending JPS6312834U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10706986U JPS6312834U (en) 1986-07-10 1986-07-10
US07/056,764 US4735563A (en) 1986-06-05 1987-06-02 Apparatus for sealing a semiconductor element in a resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10706986U JPS6312834U (en) 1986-07-10 1986-07-10

Publications (1)

Publication Number Publication Date
JPS6312834U true JPS6312834U (en) 1988-01-27

Family

ID=30983006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10706986U Pending JPS6312834U (en) 1986-06-05 1986-07-10

Country Status (1)

Country Link
JP (1) JPS6312834U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0889421A (en) * 1994-09-26 1996-04-09 Kaijirushi Hamono Kaihatsu Center:Kk Food molding device
JPH0889422A (en) * 1994-09-26 1996-04-09 Kaijirushi Hamono Kaihatsu Center:Kk Cutter for cookies

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0889421A (en) * 1994-09-26 1996-04-09 Kaijirushi Hamono Kaihatsu Center:Kk Food molding device
JPH0889422A (en) * 1994-09-26 1996-04-09 Kaijirushi Hamono Kaihatsu Center:Kk Cutter for cookies

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