JPS63127182A - Method for detecting omission of loading parts - Google Patents
Method for detecting omission of loading partsInfo
- Publication number
- JPS63127182A JPS63127182A JP61271815A JP27181586A JPS63127182A JP S63127182 A JPS63127182 A JP S63127182A JP 61271815 A JP61271815 A JP 61271815A JP 27181586 A JP27181586 A JP 27181586A JP S63127182 A JPS63127182 A JP S63127182A
- Authority
- JP
- Japan
- Prior art keywords
- light
- thick film
- omission
- film hybrid
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 230000001678 irradiating effect Effects 0.000 claims abstract 2
- 238000007689 inspection Methods 0.000 abstract description 15
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000000919 ceramic Substances 0.000 abstract description 5
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003909 pattern recognition Methods 0.000 description 1
- 238000012567 pattern recognition method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Geophysics And Detection Of Objects (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子機器の小型化に適合した厚膜混成ＩＣに
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thick film hybrid IC suitable for downsizing of electronic equipment.
従来の厚膜混成ＩＣは、搭載部品下面に対向する基板に
貫通孔がなく、回路の基本機能に直接間らない搭載部品
の欠品の検出し易さの点については配慮されていない構
造となっており、目視検査あるいはパターン認識手法に
よる検査装置に頼っていた。この種の実装検査について
は、日刊工業新聞社、ハイブリッドテクノロジーの基礎
Ｑ＆Ａ９５例、昭和６０年３月２９日、第１４７頁がら
第１５０頁において論じられている。なお、この種の実
装構造として関連するものとしては例えば特開昭５９−
４８９８６号が挙げられる。Conventional thick-film hybrid ICs have a structure that does not have through holes in the substrate facing the bottom of the mounted components, and does not take into account the ease of detecting missing components that are not directly connected to the basic functions of the circuit. , and relied on inspection equipment that uses visual inspection or pattern recognition techniques. This type of mounting inspection is discussed in Nikkan Kogyo Shimbun, 95 Basic Q&A Examples of Hybrid Technology, March 29, 1985, pages 147 to 150. Note that related mounting structures of this type include, for example, Japanese Unexamined Patent Application Publication No. 1986-
No. 48986 is mentioned.
上記従来の厚１摸混成ＩＣの搭載部品欠品を目視により
検査するのでは、検査能率は低く、見逃し率は高いとい
う問題があった。また、パターン認識手法による検査装
置は特注品が多く高価であるという問題があった。Visually inspecting the conventional one-thickness hybrid IC for missing components has a problem in that the inspection efficiency is low and the failure rate is high. In addition, there is a problem in that many of the inspection devices using the pattern recognition method are custom-made and expensive.
本発明の目的は、搭載部品の欠品が検査し易い厚膜混成
ＩＣの構造を提供し、信頼性が高く安価な検査方法を提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a structure for a thick film hybrid IC that allows easy inspection for missing components, and to provide a highly reliable and inexpensive inspection method.
上記目的は、厚膜混成ＩＣの構造を、搭載部品下面に対
向する基板の一部に貫通孔を設けた構造とし、前記厚膜
混成ＩＣの片面の側より光を照射し、もう一方の面の側
に透過する光を検出する検査方法により達成される
〔作 用〕
本来あるべき搭載部品が欠落した厚膜混成ＩＣの場合、
厚膜混成ＩＣの片方の側から光を照射すれば、光は基板
に設けた貫通孔を通りもう一方の側に透過するので、そ
の透過光を検出することにより、簡単に搭載部品の欠品
を検知することができる。これに対し、搭載部品が欠落
していない場合は、光は貫通孔を通り抜けることができ
るものの、搭載部品により遮断され、透過光は検出され
ず、搭載部品が欠落していないことがわかる。The above purpose is to provide a thick film hybrid IC with a structure in which a through hole is provided in a part of the substrate facing the lower surface of the mounted component, so that light is irradiated from one side of the thick film hybrid IC and the other side is irradiated with light. [Function] This is achieved by an inspection method that detects light transmitted to the side of the IC.
If light is irradiated from one side of the thick film hybrid IC, the light will pass through the through hole provided in the board and be transmitted to the other side. By detecting the transmitted light, it is easy to detect missing components. can be detected. On the other hand, when no mounted component is missing, although the light can pass through the through hole, it is blocked by the mounted component and no transmitted light is detected, indicating that no mounted component is missing.
、”′）以下、本発明の一実施例を図面を参照して説明
する。,"') Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図において、セラミック基板６上に形成した導体ラ
ンド６と搭載部品３の電極４とを半円５により接続して
おり、搭載部品３の下面に対向するセラミック基板１の
一部に貫通孔２を設けた。In FIG. 1, a conductor land 6 formed on a ceramic substrate 6 and an electrode 4 of a mounted component 3 are connected by a semicircle 5, and a through hole is formed in a part of the ceramic substrate 1 facing the lower surface of the mounted component 3. 2 was established.
第２図においては、第１図における搭載部品３は欠落し
ている。このような構造としたので、セラミンク基板１
の下方より光を照射すれば、第１図の場合１貫通孔２を
通過した光は搭載部品３により遮断されるが、第２図の
場合、搭載部品が欠落しているため光は厚膜混成ＩＣの
上方まで透過する。したがって、本実施例によれば、厚
膜混成ＩＣの搭載部品の欠品検出が容易になる。In FIG. 2, the mounted parts 3 in FIG. 1 are missing. With this structure, the ceramic substrate 1
If light is irradiated from below, in the case of Figure 1, the light passing through the through hole 2 will be blocked by the mounted component 3, but in the case of Figure 2, the mounted component is missing, so the light will be blocked by the thick film. Transmits up to the top of the hybrid IC. Therefore, according to this embodiment, it becomes easy to detect missing parts of the thick film hybrid IC.
吹に、搭載部品の欠品検出方法について説明する。第３
図において、まず、厚膜混成ＩＣを検査位置に搬送９位
置決めしたのち、厚膜混成ＩＣの下方より光を照射し、
上方に透過する光を検出する。このとき、透過光が有れ
ば、第２図で説明の通り、搭載部品が欠落しており、部
品欠品表示を行い、厚膜混成ＩＣを着脱位置に搬送して
終了する。透過光が無ければ、第１図で説明の通り、搭
載部品は欠落しておらず、厚膜混成ＩＣを着脱位置に搬
送して終了する。First, we will explain the method for detecting missing parts. Third
In the figure, first, after transporting and positioning the thick film hybrid IC to the inspection position, light is irradiated from below the thick film hybrid IC.
Detects light that passes upward. At this time, if there is transmitted light, as explained in FIG. 2, it means that a mounted component is missing, a missing component is displayed, and the thick film hybrid IC is transported to the attachment/detachment position and the process ends. If there is no transmitted light, as explained in FIG. 1, no mounted component is missing, and the process ends by transporting the thick film hybrid IC to the attachment/detachment position.
したがって、本実施例によれば、厚膜混成ＩＣの搭載部
品欠品検査において、検査能率が高く。Therefore, according to this embodiment, the inspection efficiency is high in the inspection of missing parts on components mounted on thick film hybrid ICs.
見逃し率の低い、安価な検査工程が構築できるという効
果がある。This has the effect of creating an inexpensive inspection process with a low oversight rate.
本発明によれば、透過光の検出により簡単に搭載部品の
欠品を検知でき、能率が高く誤りの少ない検査工程を安
価で構築することができる。According to the present invention, missing parts of mounted components can be easily detected by detecting transmitted light, and an inspection process with high efficiency and fewer errors can be constructed at low cost.
第１図、第２図は本発明の一実施例を示す厚膜混成ＩＣ
の実装断面図で、第１図は搭載部品のあるもの、第２図
は搭載部品のないもの。第３図は本発明の一実施例であ
る搭載部品欠品検査方法を示すフローチャートである。
１・・・セラミック基板、２・・・貫通孔、３・・・搭
載部品、４・・・部品電極、５・・・半田、６・・・導
体ランド。
代理人弁理士 小 川 勝 男４
驕
第１図 第２図1 and 2 are thick film hybrid ICs showing one embodiment of the present invention.
Figure 1 is the one with mounted parts, and Figure 2 is the one without mounted parts. FIG. 3 is a flowchart showing a mounting component missing item inspection method according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Ceramic board, 2...Through hole, 3...Mounted component, 4...Component electrode, 5...Solder, 6...Conductor land. Representative Patent Attorney Masao Ogawa 4 Figure 1 Figure 2
Claims (1)
前記厚膜混成ＩＣに向けて光を照射し、裏面側あるいは
表面側より光が透過するか否かを判定することにより、
搭載すべき電子部品の欠落を検出することを特徴とする
搭載部品の欠品検出方法。1. In the thick film hybrid IC, by irradiating light toward the thick film hybrid IC from the front side or the back side and determining whether the light is transmitted from the back side or the front side,
A method for detecting missing parts for mounted parts, characterized by detecting missing electronic parts to be mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61271815A JPS63127182A (en) | 1986-11-17 | 1986-11-17 | Method for detecting omission of loading parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61271815A JPS63127182A (en) | 1986-11-17 | 1986-11-17 | Method for detecting omission of loading parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63127182A true JPS63127182A (en) | 1988-05-31 |
Family
ID=17505232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61271815A Pending JPS63127182A (en) | 1986-11-17 | 1986-11-17 | Method for detecting omission of loading parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63127182A (en) |
-
1986
- 1986-11-17 JP JP61271815A patent/JPS63127182A/en active Pending
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