JPS63127141U - - Google Patents
Info
- Publication number
- JPS63127141U JPS63127141U JP1987019078U JP1907887U JPS63127141U JP S63127141 U JPS63127141 U JP S63127141U JP 1987019078 U JP1987019078 U JP 1987019078U JP 1907887 U JP1907887 U JP 1907887U JP S63127141 U JPS63127141 U JP S63127141U
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- center line
- external leads
- group
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987019078U JPH0412689Y2 (cg-RX-API-DMAC7.html) | 1987-02-12 | 1987-02-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987019078U JPH0412689Y2 (cg-RX-API-DMAC7.html) | 1987-02-12 | 1987-02-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63127141U true JPS63127141U (cg-RX-API-DMAC7.html) | 1988-08-19 |
| JPH0412689Y2 JPH0412689Y2 (cg-RX-API-DMAC7.html) | 1992-03-26 |
Family
ID=30813349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987019078U Expired JPH0412689Y2 (cg-RX-API-DMAC7.html) | 1987-02-12 | 1987-02-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0412689Y2 (cg-RX-API-DMAC7.html) |
-
1987
- 1987-02-12 JP JP1987019078U patent/JPH0412689Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0412689Y2 (cg-RX-API-DMAC7.html) | 1992-03-26 |