JPS63127130U - - Google Patents

Info

Publication number
JPS63127130U
JPS63127130U JP1987019690U JP1969087U JPS63127130U JP S63127130 U JPS63127130 U JP S63127130U JP 1987019690 U JP1987019690 U JP 1987019690U JP 1969087 U JP1969087 U JP 1969087U JP S63127130 U JPS63127130 U JP S63127130U
Authority
JP
Japan
Prior art keywords
conductive adhesive
drying
lead frame
stem
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987019690U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0635469Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987019690U priority Critical patent/JPH0635469Y2/ja
Publication of JPS63127130U publication Critical patent/JPS63127130U/ja
Application granted granted Critical
Publication of JPH0635469Y2 publication Critical patent/JPH0635469Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1987019690U 1987-02-12 1987-02-12 導電性接着剤乾燥装置 Expired - Lifetime JPH0635469Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987019690U JPH0635469Y2 (ja) 1987-02-12 1987-02-12 導電性接着剤乾燥装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987019690U JPH0635469Y2 (ja) 1987-02-12 1987-02-12 導電性接着剤乾燥装置

Publications (2)

Publication Number Publication Date
JPS63127130U true JPS63127130U (enExample) 1988-08-19
JPH0635469Y2 JPH0635469Y2 (ja) 1994-09-14

Family

ID=30814515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987019690U Expired - Lifetime JPH0635469Y2 (ja) 1987-02-12 1987-02-12 導電性接着剤乾燥装置

Country Status (1)

Country Link
JP (1) JPH0635469Y2 (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS57109344A (en) * 1980-12-26 1982-07-07 Hitachi Ltd Manufacture and its apparatus for semiconductor device
JPS57138335U (enExample) * 1981-02-23 1982-08-30

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS57109344A (en) * 1980-12-26 1982-07-07 Hitachi Ltd Manufacture and its apparatus for semiconductor device
JPS57138335U (enExample) * 1981-02-23 1982-08-30

Also Published As

Publication number Publication date
JPH0635469Y2 (ja) 1994-09-14

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