JPS63125647A - Production of beryllium copper alloy - Google Patents
Production of beryllium copper alloyInfo
- Publication number
- JPS63125647A JPS63125647A JP61268743A JP26874386A JPS63125647A JP S63125647 A JPS63125647 A JP S63125647A JP 61268743 A JP61268743 A JP 61268743A JP 26874386 A JP26874386 A JP 26874386A JP S63125647 A JPS63125647 A JP S63125647A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- temperature
- subjected
- strength
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 21
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 22
- 238000000137 annealing Methods 0.000 claims abstract description 13
- 238000003483 aging Methods 0.000 claims abstract description 8
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000011159 matrix material Substances 0.000 abstract description 7
- 238000005482 strain hardening Methods 0.000 abstract description 7
- 229910052790 beryllium Inorganic materials 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 3
- 229910017532 Cu-Be Inorganic materials 0.000 abstract 3
- 238000010438 heat treatment Methods 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 21
- 239000002244 precipitate Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 description 3
- -1 helium copper Chemical compound 0.000 description 3
- 229910000765 intermetallic Inorganic materials 0.000 description 3
- 238000000879 optical micrograph Methods 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000007670 refining Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、高導電率と高強度を有し、コネクター、リレ
ー等に用いられるベリリウム銅合金に関し、さらに詳し
くは、未固溶析出粒が微細に分散して存在するために、
強度、加工性に優れるベリリウム銅合金の製法に関する
ものである。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a beryllium copper alloy that has high electrical conductivity and high strength and is used for connectors, relays, etc. Because it exists in finely dispersed form,
The present invention relates to a method for producing beryllium copper alloys that have excellent strength and workability.
（従来の技術）
従来、種々のベリリウム銅合金がその高導電率、高強度
の特性を生かして電子部品の展伸材等として広く使用さ
れている。これらのへリリウム銅合金を製造するにあた
っては、第３図にそのフローチャートを示すように、所
定のＣｕ、 Ｂｅ、その他の副成分からなる鋳塊を得た
後、例えば７５０〜９５０℃で溶体化処理を行なって冷
間加工を施した後、さらに時効硬化処理を実施して所望
のベリリウム銅合金を得ていた。(Prior Art) Various beryllium-copper alloys have been widely used as wrought materials for electronic parts, etc., due to their high electrical conductivity and high strength properties. In manufacturing these helium copper alloys, as shown in the flowchart in Figure 3, after obtaining an ingot consisting of predetermined Cu, Be, and other subcomponents, it is solution-treated at, for example, 750 to 950°C. After the treatment and cold working, the desired beryllium copper alloy was obtained by further performing an age hardening treatment.
（発明が解決しようとする問題点）
しかしながら、上述した従来の合金の製造法においては
、溶体化処理をＢｅと副添加成分との間で生じる未固溶
の金属間化合物により強度および加工性を改善するため
に実施しているが、この溶体化処理後のベリリウム銅合
金には例えば０．３μｍ以上の粗大な未固溶析出粒が多
く認められ、強度、加工性を十分に改善できない問題点
があった。(Problems to be Solved by the Invention) However, in the conventional alloy manufacturing method described above, strength and workability are improved by solution treatment due to undissolved intermetallic compounds generated between Be and sub-additional components. However, after this solution treatment, many coarse undissolved precipitated grains of 0.3 μm or more are observed in the beryllium copper alloy, which is a problem in which the strength and workability cannot be sufficiently improved. was there.
また、このとき単に溶体化温度を上げることにより未固
溶析出物の一部を固溶させて強度を向上させることもで
きるが、同時に基地の粒径の粗大化を招き、加工性に大
きな問題が生じる欠点もあった。At this time, it is also possible to improve the strength by simply increasing the solution temperature to dissolve some of the undissolved precipitates into solid solution, but at the same time, this leads to coarsening of the grain size of the matrix, which poses a serious problem in workability. There were also some drawbacks.
本発明の目的は上述した不具合を解消して、従来粗大で
あった未固溶析出粒の多くを０．３μｍ以下に微細化す
るとともに基地中に分散させることにより、均質性を向
上し、高い強度及び加工性を有する合金を得ることがで
きるベリリウム銅合金の製法を提供しようとするもので
ある。The purpose of the present invention is to eliminate the above-mentioned problems, to improve homogeneity and to improve the homogeneity by refining most of the conventionally coarse undissolved precipitated grains to 0.3 μm or less and dispersing them in the matrix. It is an object of the present invention to provide a method for producing a beryllium-copper alloy that can yield an alloy having strength and workability.
さらに本発明の目的は、均一微細に分散した未固溶析出
粒により焼鈍時の粒成長を抑制して高い強度及び加工性
を達成可能なベリリウム銅合金の製法を提供しようとす
るものである。A further object of the present invention is to provide a method for producing a beryllium-copper alloy that can achieve high strength and workability by suppressing grain growth during annealing using undissolved precipitated grains that are uniformly and finely dispersed.
（問題点を解決するための手段）
本発明のベリリウム銅合金の製法は、Ｂｅ ０．０５〜
２，０重量％、ＣＯおよびＮｉの少なくとも１種０．１
〜１０．０重量％、残部実質的にＣｕよりなる合金を溶
解して鋳塊を得、この鋳塊に対して８００〜１０００°
Ｃの温度で溶体化処理を行い、冷間加工を加えた後時効
硬化処理前に、７５０〜９５０℃の範囲内の溶体化温度
よりも低い温度で焼鈍することを特徴とするものである
。(Means for Solving the Problems) The method for producing the beryllium copper alloy of the present invention includes Be 0.05 to
2.0% by weight, at least one of CO and Ni 0.1
An alloy consisting of ~10.0% by weight and the remainder substantially Cu is melted to obtain an ingot, and the ingot is heated at 800 to 1000°.
It is characterized by performing solution treatment at a temperature of C, cold working, and then annealing at a temperature lower than the solution temperature within the range of 750 to 950° C. before age hardening treatment.
（作 用）
上述したＢｅとＣＯあるいはＮｉとの金属間化合物の析
出を主な強化機構とする本発明においては、まず８００
〜１０００℃の従来より高温で溶体化することにより、
大きな析出粒を基地中に固溶させ、冷間加工を加えて析
出核発生を容易にしている。その後、７５０〜９５０℃
の溶体化温度より低い温度、好ましくはその差が２０〜
２００°Ｃとなる温度で焼鈍することにより、溶質の一
部が析出した結果析出粒が例えば０．３μｍ以下の粒径
で４０％以上が分散した状態の合金を得ている。(Function) In the present invention whose main strengthening mechanism is the precipitation of the intermetallic compound of Be and CO or Ni described above, first, 800
By solutionizing at a higher temperature than conventional methods of ~1000℃,
Large precipitate grains are dissolved in the matrix, and cold working is added to facilitate the generation of precipitate nuclei. After that, 750-950℃
temperature lower than the solution temperature of , preferably the difference is 20 to
By annealing at a temperature of 200°C, a part of the solute precipitates, resulting in an alloy in which 40% or more of the precipitated grains have a grain size of 0.3 μm or less and are dispersed.
なお、本発明合金において、Ｂｅの添加量を０．０５〜
２．０重量％と限定した理由は、０．０５重量％未満で
は添加効果が得られず２．０重量％を超えると強度向上
の割にコストが高くなるためで、０．１〜０．７重量％
の添加がさらに好ましい。また、ＣＯおよびＮｉの少な
くとも１種０．１〜１０．０重量％と限定した理由は、
０．１重量％未満では添加効果が得られず１０．０重量
％を超えると加工性が悪くなり特性の向上も望めないた
めで、０．２〜４．０重量％の添加がさらに好ましい。In addition, in the alloy of the present invention, the amount of Be added is 0.05~
The reason why it is limited to 2.0% by weight is that if it is less than 0.05% by weight, no effect can be obtained, and if it exceeds 2.0% by weight, the cost will be high despite the improvement in strength. 7% by weight
It is more preferable to add. In addition, the reason why at least one of CO and Ni is limited to 0.1 to 10.0% by weight is as follows.
If it is less than 0.1% by weight, no effect can be obtained, and if it exceeds 10.0% by weight, processability deteriorates and no improvement in properties can be expected. Therefore, addition of 0.2 to 4.0% by weight is more preferable.
さらに、溶体化処理温度を８００〜１０００℃と限定し
た理由は、８００℃未満の溶体化温度では析出粒の固溶
が進まず、１０００℃を超えると融点に近くあるいは融
点以上となり生産が困難となるためである。また、焼鈍
温度は溶体化温度及び要求される強度、結晶粒径により
異なるが、７５０℃未満では焼鈍時の析出量が多くなり
時効硬化後の強度が低下するとともに、９５０℃を超え
ると析出量が少なくなり基地の結晶粒の微細化効果が失
われるため、７５０〜９５０°Ｃと限定した。Furthermore, the reason why the solution treatment temperature was limited to 800 to 1000°C is that if the solution temperature is less than 800°C, the solid solution of the precipitated grains will not proceed, and if it exceeds 1000°C, the temperature will be close to or above the melting point, making production difficult. This is to become. The annealing temperature varies depending on the solution temperature, required strength, and grain size, but if it is less than 750°C, the amount of precipitation during annealing will increase and the strength after age hardening will decrease, and if it exceeds 950°C, the amount of precipitation will increase. The temperature was limited to 750 to 950°C because the effect of refining the base crystal grains would be lost.
（実施例）
第１図は本発明のベリリウム銅合金の製法の一例を示す
フローチャートである。本実施例において、まずＢｅ
０．０５〜２．０重量％、ＣｏおよびＮｉの少なくとも
１種０．１〜１０．０重量％、残部Ｃυより成る合金を
鋳造して鋳塊を得る。得られた鋳塊に必要に応じ熱間鍛
造、冷間圧延、焼鈍を繰り返し調質して素材を得た後、
この素材に８００〜１０００℃の間の所定の温度で溶体
化処理を施す。その後、冷間加工を行ない所定の形状に
した後、７５０〜９５０℃の間の溶体化温度よりも好ま
しくは２０〜２００°Ｃ低い温度で好ましくは１〜５分
間焼鈍を行なう。最後に通常の時効硬化処理を実施して
、本発明の緒特性を有するベリリウム銅合金材を得てい
る。(Example) FIG. 1 is a flowchart showing an example of the method for producing a beryllium copper alloy of the present invention. In this example, first Be
An ingot is obtained by casting an alloy consisting of 0.05 to 2.0% by weight, 0.1 to 10.0% by weight of at least one of Co and Ni, and the balance Cυ. After refining the resulting ingot by repeatedly subjecting it to hot forging, cold rolling, and annealing as necessary, the material is obtained.
This material is subjected to solution treatment at a predetermined temperature between 800 and 1000°C. Thereafter, after performing cold working to form a predetermined shape, annealing is performed for preferably 1 to 5 minutes at a temperature that is preferably 20 to 200°C lower than the solution temperature of 750 to 950°C. Finally, a normal age hardening treatment is performed to obtain a beryllium copper alloy material having the characteristics of the present invention.
以下、実際の例について説明する。An actual example will be explained below.
大旌餌上
第１表に示す種々の組成を有する合金を鋳造後熱間鍛造
を加え、さらに冷間圧延、焼鈍を繰り返した後３等分し
た。その後、それぞれ５分間、１つは本発明の工程に準
じ第１表に示す温度で溶体化処理しくｍｌ−９）、１つ
は従来工程に準じ第１表に示す通常の溶体化温度で溶体
化処理しく隘１０〜１８）、もう１つは溶体化処理のみ
を本発明と同じ第１表に示す温度で実施した（ＮＬＸ１
９〜２７）。Alloys having various compositions shown in Table 1 were cast, hot forged, cold rolled and annealed repeatedly, and then divided into three equal parts. Thereafter, one solution treatment was carried out for 5 minutes each at the temperature shown in Table 1 according to the process of the present invention (ml-9), and the other was subjected to solution treatment at the usual solution temperature shown in Table 1 according to the conventional process. In the other case, only solution treatment was carried out at the same temperature shown in Table 1 as in the present invention (NLX1).
9-27).
本発明合金（陽１〜９）については、さらに第１表に示
す温度で焼鈍した後、各試料に３０％の冷間加工を施し
た。The alloys of the present invention (positive numbers 1 to 9) were further annealed at the temperatures shown in Table 1, and then each sample was subjected to 30% cold working.
その後、各試料に対して安全曲げ係数として、圧延方向
に対し直角方向においてクランクを生ずることなく９０
°曲げを行うことができる最小曲率半径Ｒを板厚ｔで割
った値Ｒ／ｌを求めた。After that, the safe bending factor for each sample was set to 90 without cranking in the direction perpendicular to the rolling direction.
A value R/l was calculated by dividing the minimum radius of curvature R that allows bending by the plate thickness t.
さらに、本発明合金（階１〜９）と従来工程の通常溶体
化材（ＰＪｃＬｌＯ〜１８）については、通常の時効硬
化処理後引張強さと疲労強さく応力６０ｋｇ／ｍｍ２）
をそれぞれ測定した。Furthermore, for the alloys of the present invention (grades 1 to 9) and conventional solution-treated materials (PJcLlO to 18), the tensile strength and fatigue strength after normal age hardening treatment were 60 kg/mm2).
were measured respectively.
また、本発明における焼鈍温度の影響を調べるため、従
来合金として焼鈍温度が本発明の範囲外の合金について
本発明と同様の第１表に示す温度の処理を行なって（Ｎ
ａ２８．２９） 、同様に各種緒特性を測定した。結果
を第１表に示す。なお、第１表において、基地の粒径と
０．３μｍ以下の析出粒のパーセントは、同一倍率の光
学顕微鏡写真から目視により求めた。In addition, in order to investigate the influence of annealing temperature on the present invention, conventional alloys whose annealing temperatures were outside the range of the present invention were subjected to the same treatment as in the present invention at the temperatures shown in Table 1 (N
a28, 29), the characteristics of each material were measured in the same manner. The results are shown in Table 1. In Table 1, the grain size of the matrix and the percentage of precipitated grains of 0.3 μm or less were determined visually from optical micrographs at the same magnification.
第１表の結果から明らかなように、８００〜１０００℃
の温度で溶体化処理を行ない、冷間加工を加えた後時効
硬化処理前に７５０〜９５０℃の範囲内の溶体化温度よ
りも低い温度で焼鈍した本発明合金（隘１〜９）は、他
の従来合金に比べて基地の粒径が小さいとともに０．３
μｍ以下の析出粒の割合が４０％以上となり、その結果
良好な引張強さ、成形性さらには疲労強さを得られるこ
とがわかった。As is clear from the results in Table 1, 800-1000℃
The alloys of the present invention (divisions 1 to 9) were subjected to solution treatment at a temperature of , cold worked, and then annealed at a temperature lower than the solution temperature within the range of 750 to 950 °C before age hardening treatment. Compared to other conventional alloys, the grain size of the matrix is smaller and 0.3
It was found that the proportion of precipitated particles of μm or less was 40% or more, and as a result, good tensile strength, formability, and fatigue strength were obtained.
第２図（ａ） 、 （ｂ）はそれぞれ従来方法および本
発明方法で製造したＣｕ−０，４Ｂｅ−２，ＯＮ＋から
なるベリリウム銅合金の金属組織を示す光学顕微鏡写真
である。第２図（ａ） 、 （ｂ）から明らかなように
、本発明の合金は基地の結晶粒が微細であるとともに金
属間化合物からなる析出粒も微細に分散している。FIGS. 2(a) and 2(b) are optical micrographs showing the metal structures of beryllium copper alloys made of Cu-0, 4Be-2, ON+ produced by the conventional method and the method of the present invention, respectively. As is clear from FIGS. 2(a) and 2(b), in the alloy of the present invention, the base crystal grains are fine, and the precipitated grains made of intermetallic compounds are also finely dispersed.
（発明の効果）
以上詳細に説明したところから明らかなように、本発明
のへリリウム銅合金の製法によれば、所定組成の合金に
対し８００〜１０００℃の従来より高い温度で溶体化処
理し、大きな析出粒を基地中に固溶させ冷間加工を加え
て析出核発生を容易にし、その後７５０〜９５０℃の溶
体化温度より低い温度、好ましくはその差が２０〜２０
０℃となる温度で焼鈍することにより、溶質の一部が析
出した結果析出粒が例えば０．３μｍ以下の粒径で４０
％以上が分散した状態の合金を得ることができる。(Effects of the Invention) As is clear from the detailed explanation above, according to the method for producing a helium copper alloy of the present invention, an alloy of a predetermined composition can be solution-treated at a temperature of 800 to 1000°C, which is higher than the conventional temperature. , large precipitate grains are dissolved in the matrix and subjected to cold working to facilitate the generation of precipitate nuclei, and then heated at a temperature lower than the solution temperature of 750 to 950 °C, preferably with a difference of 20 to 20 °C.
By annealing at a temperature of 0°C, part of the solute precipitates, resulting in precipitated grains with a particle size of, for example, 0.3 μm or less.
It is possible to obtain an alloy in which % or more is dispersed.
その結果、本発明の製法により得られた合金は、引張強
さ、成形性および疲労強度が向上し、高い導電率と強度
を必要とするばね材、コネクタ等の電子部品として好適
なベリリウム銅合金を得ることができる。As a result, the alloy obtained by the manufacturing method of the present invention has improved tensile strength, formability, and fatigue strength, and is a beryllium copper alloy suitable for electronic parts such as spring materials and connectors that require high conductivity and strength. can be obtained.
第１図は本発明のベリリウム銅合金の製法の一例を示す
フローチャート、
第２図（ａ）、（ｂ）はそれぞれ従来方法および本発明
方法で製造したベリリウム銅合金の金属組織を示す光学
顕微鏡写真、
第３図は従来のへリリウム銅合金の製法の一例を示すフ
ローチャートである。
第１図
第２図
（ａ）
（ｂ）Figure 1 is a flowchart showing an example of the method for producing beryllium copper alloy of the present invention, and Figures 2 (a) and (b) are optical micrographs showing the metal structures of beryllium copper alloys produced by the conventional method and the method of the present invention, respectively. , FIG. 3 is a flowchart showing an example of a conventional method for producing a helium copper alloy. Figure 1 Figure 2 (a) (b)
Claims (1)
なくとも１種０．１〜１０．０重量％、残部実質的にＣ
ｕよりなる合金を溶解して鋳塊を得、この鋳塊に対して
８００〜１０００℃の温度で溶体化処理を行い、冷間加
工を加えた後時効硬化処理前に、７５０〜９５０℃の範
囲内の溶体化温度よりも低い温度で焼鈍することを特徴
とするベリリウム銅合金の製法。 ２、前記溶体化温度と焼鈍温度との温度差が２０〜２０
０℃である特許請求の範囲第１項記載のベリリウム銅合
金の製法。[Claims] 1. 0.05 to 2.0% by weight of Be, 0.1 to 10.0% by weight of at least one of Co and Ni, the balance being substantially C
An ingot is obtained by melting an alloy consisting of u, and this ingot is subjected to solution treatment at a temperature of 800 to 1000 °C, cold worked, and then treated at a temperature of 750 to 950 °C before age hardening treatment. A process for producing beryllium-copper alloys characterized by annealing at a temperature lower than the solution temperature within a range. 2. The temperature difference between the solution temperature and annealing temperature is 20 to 20
A method for producing a beryllium copper alloy according to claim 1, wherein the temperature is 0°C.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61268743A JPS63125647A (en) | 1986-11-13 | 1986-11-13 | Production of beryllium copper alloy |
| EP87309945A EP0271991B1 (en) | 1986-11-13 | 1987-11-11 | Production of copper-beryllium alloys |
| DE8787309945T DE3773470D1 (en) | 1986-11-13 | 1987-11-11 | PRODUCTION OF COPPER-BERYLLIUM ALLOYS. |
| KR1019870012754A KR910009877B1 (en) | 1986-11-13 | 1987-11-12 | Production of beryllium-copper alloys and alloys produced therby |
| US07/120,543 US4792365A (en) | 1986-11-13 | 1987-11-13 | Production of beryllium-copper alloys and alloys produced thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61268743A JPS63125647A (en) | 1986-11-13 | 1986-11-13 | Production of beryllium copper alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63125647A true JPS63125647A (en) | 1988-05-28 |
| JPS647148B2 JPS647148B2 (en) | 1989-02-07 |
Family
ID=17462723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61268743A Granted JPS63125647A (en) | 1986-11-13 | 1986-11-13 | Production of beryllium copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63125647A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02243748A (en) * | 1989-03-15 | 1990-09-27 | Ngk Insulators Ltd | Method for hot forming beryllium-copper alloy and hot formed product |
| WO2020231674A1 (en) | 2019-05-10 | 2020-11-19 | Materion Corporation | Copper-beryllium alloy with high strength |
-
1986
- 1986-11-13 JP JP61268743A patent/JPS63125647A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02243748A (en) * | 1989-03-15 | 1990-09-27 | Ngk Insulators Ltd | Method for hot forming beryllium-copper alloy and hot formed product |
| WO2020231674A1 (en) | 2019-05-10 | 2020-11-19 | Materion Corporation | Copper-beryllium alloy with high strength |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS647148B2 (en) | 1989-02-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |