JPS6312485A - Tray - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technology for storing components, and particularly to a technology that is effective for use in storage trays for electronic components.

[Conventional technology]

A storage container (tray) for electronic components (semiconductor devices) is described in Japanese Patent Laid-Open No. 59-32155.

The approximate cost is a storage container for semiconductor devices that has a plurality of storage sections, including a protruding stackable frame that defines the periphery of the storage section, and a bottom section for semiconductor devices to be stored in the bottom of the storage section. The device is provided with a protruding portion of the support container, and a pressing portion that protrudes downward from the bottom of the storage portion and that presses the upper portion of the semiconductor device located at the bottom with a predetermined force when stacked. be.

[Problem that the invention seeks to solve]

The inventor of the present invention is a storage container (hereinafter referred to as storage tray)
When we used a similar storage tray to transport electronic components, we found the following problems.

In other words, when the storage trays are stacked, the movement of the electronic components is restricted, reducing unnecessary movement of the electronic components within the tray and reducing lead bending, etc. However, if the storage trays are separated individually In some cases, since the electronic components cannot be held down from above, the electronic components may move within the storage tray due to impact, causing problems such as deformation of the leads.

In addition, if the tray is shared and electronic components of different sizes are used, for example electronic components that are much smaller than the electronic component storage area of the storage tray, the movement of the electronic components within the storage tray may be large. The problem is that the leads are often bent, making it difficult to share storage trays.

An object of the present invention is to provide an electronic component storage tray that can reduce lead bending.

Another object of the present invention is to provide an electronic component storage tray that allows the tray to be shared even for electronic components of different sizes.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the inter-Zhao point]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the part where the electronic component is stored (hereinafter referred to as the storage part) is formed into a concave shape that almost matches the outer periphery of the side surface of the largest electronic component to be stored, and the part on which the electronic component is placed is formed in the concave shape. Provide a convex part in the center of the part.

Although the convex portion is smaller than the electronic component, it is formed to be slightly smaller than the inner portion of the lead. Furthermore, a recess into which a lead of a smaller electronic component can be inserted is formed in the convex portion.

[For production]

According to the above-described means, when the largest electronic component to be stored is first placed, the electronic component is supported by the convex portion and its movement in the horizontal direction is restricted by the side walls of the concave portion. Therefore, the lead of the electronic component is less likely to be subjected to impact within the electronic component storage tray, and lead bending can be reduced.

Furthermore, when an item smaller than the largest electronic component is stored, the convex portion restricts the movement of the electronic component inside the lead and restricts movement in the horizontal direction. This reduces impact received within the tray and reduces lead bending.

Furthermore, even in the case of even smaller electronic components, the leads fit into the recesses provided in the convex portions and their movement is restricted, so that bending can be similarly reduced.

From the above, the same electronic component storage tray can be used for three types of electronic components, and lead bending can be reduced.

〔Example〕

FIG. 1 is a partially exploded perspective view showing an electronic component storage tray according to an embodiment of the present invention.

FIG. 2 is a perspective view showing electronic components stored in an electronic component storage tray according to an embodiment of the present invention.

FIG. 3 is a sectional view when the largest electronic component is stored in an electronic component storage tray according to an embodiment of the present invention.

FIG. 4 is a sectional view of the second largest electronic component to be stored in an electronic component storage tray according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view when the smallest electronic component to be stored is stored in an electronic component storage tray according to an embodiment of the present invention.

In FIG. 1, 1 is an electronic component storage tray (hereinafter referred to as tray 1) as a component storage tray, for example, C
It is made of vinyl chloride containing (carbon). 2
3 is a storage part, and 3 is a side wall formed in a concave shape as a bent part on the outer periphery of the side surface of the largest electronic component, and has a similar size. 4 is a tray bottom. 5 is a first convex part as a bent part, which is large enough to fit inside the lead of the second largest electronic component, which will be described later, and has a rectangular frame. The lead of the second largest electronic component, which will be described later, has its movement regulated.
This is a concave portion as a bent portion, which is formed between the first convex portion 5 and a second convex portion to be described later, and has a size large enough to accommodate the lead of the smallest electronic component to be described later. Its movement can now be determined by the lead of the electronic component that is the most delicate. Reference numeral 7 denotes a second convex portion as a bent portion, which, together with the first convex portion 5, can support a pan cage of an electronic component, which will be described later.

Note that the first convex portion 5 and the second convex portion 7 protrude to such an extent that the leads of the electronic component do not hit the tray bottom 4 when supporting an electronic component to be described later.

In Figure 2, 8 is the largest electronic component (hereinafter referred to as the first I).
C8). 9 is a package. 10 is a lead that protrudes from the west side of the package 90 (only two directions are shown), and its tip extends toward the back surface of the pan cage 9 in a "Jn" shape. 11 is the second largest electronic lead. Components (hereinafter referred to as second ICI 1): 12 is a package; 13 is a lead;
It protrudes from the west side of the pan cage 12 (only two directions are shown), and its tip extends toward the back surface of the package 12.
It extends in a U-shape. 14 is the smallest electronic component (
Hereinafter referred to as the third IC 14). 15 is a package. 16 is a lead, and the package 150
It protrudes from the west side (only two directions are shown), and its tip is
The pan cage 150 extends in a J” shape toward the rising surface.

In FIG. 3, a first IC 8 is mounted on a tray 1, its package 9 is supported by the first convex portion 5 and the second convex portion 7, and there are some gaps between the leads 11 and the side wall 3 of the tray. It is stored with some work left.

In FIG. 4, the second ICII is placed in tray 1.
The package 12# is housed with its surface supported by the first convex portion 5 and the second convex portion 7, and the inside of the lead 13 hooked on the second convex portion 7.

In FIG. 5, the third IC 14 is placed on the tray 1, the back surface of its package 15 is supported by the second protrusion 7, the leads 16 enter the recess 6, and the third ICI 4 regulates the movement. has been done.

An embodiment of the present invention having the above-mentioned configuration will be explained below.
Ru.

First, as shown in FIG. 3, when the first IC 8 is stored, there is only a small gap between the lead 10 of the first IC 8 and the side wall 3, allowing the first IC 8 to move horizontally. The range is defined. Therefore, due to external force, tray 1
Even if the first IC 8 moves within the first IC 8, it is less likely to hit the side wall 3 with a large acceleration, so the impact is small, and deformation of the first IC 8 and the first IC 8 can be reduced.

Next, as shown in FIG. 4, when the second IC 11 is stored, the movable range of the lead 13 of the second ICI 1 is defined by the first convex portion 5. Therefore, even if the second ICII moves within the tray 1 due to an external force, the lead 13 will be less likely to hit the side wall 3, and even if the lead 13 hits the first protrusion 5, the acceleration will be reduced. Therefore, the impact can be reduced and deformation of the door 13 can be reduced.

As shown in FIG. 5, when the third IC 14 is stored, the lead 16 of the third IC 14 enters the recess 6, and the third IC 14 is regulated for transportation. Even if the third ICI 4 moves within the tray 1 due to an external force and the lead 16 hits the first convex part 5 and the second convex part 7, the acceleration is reduced, so the impact can be reduced and the lead is Deformation is reduced.

In addition to the configuration described above, the tray may have various shapes, such as, for example, if the package has a convex portion on the back surface, the tray may be provided with a concave portion corresponding to the convex portion. That is, any structure may be used as long as it forms a bent portion in accordance with the shape of the electronic component to be stored and regulates the movement of the electronic component.

From the above, (1) by providing the tray with a bent portion that approximately matches the size of the lead or package portion of the electronic component to be stored, the movement of the electronic component can be restricted to a small size. Then, even if the electronic component moves within the tray due to an external force, it will move with a small acceleration, so even if the electronic component hits the side wall of the tray, the impact will be small, resulting in the effect of reducing lead deformation.

(2) Leads for multiple electronic components to be stored in the tray;
By providing a plurality of bent portions that closely match the size of the package portion, the movement of any electronic component can be defined to be small. Then, even if the electronic components move within the tray due to external force, they will move with a small acceleration, so even if the electronic components hit the side wall of the tray, the impact will be small, reducing deformation of the leads and making it possible to share the tray. You can get the effect that you can.

(3) Since trays can be shared, it is possible to reduce the need to adjust the device depending on the type of electronic component in a device that uses a tray to process electronic components.

(4) Since electronic component storage trays can be shared, there are fewer molds for manufacturing electronic component storage trays compared to manufacturing electronic component storage trays for individual electronic components. This has the effect of making the storage tray inexpensive.

Although the invention made by the present inventor has been specifically explained above based on examples, it is to be understood that the present invention is not limited to the above-mentioned examples, and can be modified at will without departing from the gist thereof. Not even.

In the above explanation, the invention made by the present inventor was mainly applied to a storage tray for electronic components, which is the background field of application, but the invention is not limited to that (storage trays for various components). It can be applied to technology, etc.

〔Effect of the invention〕

A brief explanation of the effects obtained by representative invention K among the inventions disclosed in this application is as follows.

That is, when electronic components are stored in a tray, the tray can be shared even if the electronic components are of different sizes.

Furthermore, lead deformation of electronic components can be reduced.

In addition, it is not necessary to make trays according to the parts (it is possible to reduce the cost of the trays).

[Brief explanation of drawings]

FIG. 1 is a partially exploded perspective view showing an electronic component storage tray that is an embodiment of the present invention. FIG. 2 is a partially exploded perspective view of an electronic component storage tray that is an embodiment of the present invention. The perspective view and FIG. 3 are cross-sectional views when the largest electronic components are stored in an electronic component storage tray according to an embodiment of the present invention. FIG. FIG. 5 is a cross-sectional view of the second largest electronic component to be stored in the electronic component storage tray, which is an embodiment of the present invention. It is a sectional view when the smallest electronic component is stored among the electronic components to be stored. DESCRIPTION OF SYMBOLS 1... Electronic component storage tray (tray), 2... Storage part, 3... Side wall, 4... Tray bottom, 5... First convex part, 6... Recessed part, 7... - Second convex portion, 8... Electronic component (first IC), 9... Pan cage, 10... Lead, 11... Electronic component (second IC), 12...
Pan cage, 13...Lead, 14...Electronic component (
3rd IC), 15...Package, 16...Lead.

Claims (1)

[Claims] 1. A tray for storing parts, characterized in that a bent part for storing a first part and a bent part for storing a second part are formed. Tray to do. 2. The tray according to claim 1, wherein the component is an electronic component.