JPS63124754U - - Google Patents

Info

Publication number
JPS63124754U
JPS63124754U JP1502287U JP1502287U JPS63124754U JP S63124754 U JPS63124754 U JP S63124754U JP 1502287 U JP1502287 U JP 1502287U JP 1502287 U JP1502287 U JP 1502287U JP S63124754 U JPS63124754 U JP S63124754U
Authority
JP
Japan
Prior art keywords
resin
lead frame
semiconductor chip
sealed
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1502287U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1502287U priority Critical patent/JPS63124754U/ja
Publication of JPS63124754U publication Critical patent/JPS63124754U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1502287U 1987-02-04 1987-02-04 Pending JPS63124754U (US20030220297A1-20031127-C00033.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1502287U JPS63124754U (US20030220297A1-20031127-C00033.png) 1987-02-04 1987-02-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1502287U JPS63124754U (US20030220297A1-20031127-C00033.png) 1987-02-04 1987-02-04

Publications (1)

Publication Number Publication Date
JPS63124754U true JPS63124754U (US20030220297A1-20031127-C00033.png) 1988-08-15

Family

ID=30805564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1502287U Pending JPS63124754U (US20030220297A1-20031127-C00033.png) 1987-02-04 1987-02-04

Country Status (1)

Country Link
JP (1) JPS63124754U (US20030220297A1-20031127-C00033.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0258360A (ja) * 1988-08-24 1990-02-27 Yamada Seisakusho:Kk ダイパットサポート切断装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54107261A (en) * 1978-02-10 1979-08-22 Hitachi Ltd Production of resin seal-type semiconductor device and lead frame used in this production

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54107261A (en) * 1978-02-10 1979-08-22 Hitachi Ltd Production of resin seal-type semiconductor device and lead frame used in this production

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0258360A (ja) * 1988-08-24 1990-02-27 Yamada Seisakusho:Kk ダイパットサポート切断装置

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