JPS63123566A - Vapor phase type soldering device - Google Patents
Vapor phase type soldering deviceInfo
- Publication number
- JPS63123566A JPS63123566A JP27072386A JP27072386A JPS63123566A JP S63123566 A JPS63123566 A JP S63123566A JP 27072386 A JP27072386 A JP 27072386A JP 27072386 A JP27072386 A JP 27072386A JP S63123566 A JPS63123566 A JP S63123566A
- Authority
- JP
- Japan
- Prior art keywords
- vapor phase
- liquid reservoir
- saturated vapor
- saturated
- movable plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012808 vapor phase Substances 0.000 title claims abstract description 53
- 238000005476 soldering Methods 0.000 title claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 37
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 32
- 238000009834 vaporization Methods 0.000 claims description 4
- 230000008016 vaporization Effects 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 235000011962 puddings Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明は、気相式はんだ付け装置に関するものである。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a vapor phase soldering device.
（従来の技術）
第２図に示されるように、気相式はんだ付け装置は、蒸
気槽１１の底部の液溜部１２に収容された液（フッ素系
不活性溶剤）１３がヒータ１４によって加熱され蒸発さ
れることにより、蒸気槽１１の内部に飽和蒸気相１５が
形成され、この飽和蒸気相１５の気化潜熱によって、コ
ンベヤ１６にて蒸気槽１１内に搬入されたワークとして
のプリント配線基板１７とその搭載部品１８との間のペ
ーストはんだ（クリームはんだ）がリフローされ、基板
１７に部品１８がリフローはんだ付けされるものである
。前記蒸気槽１１の一側にワーク搬入口部２１が設けら
れるとともに他側にワーク搬出口部２２が設けられ、そ
の搬入口部２１と搬出口部２２とに冷却コイル２３．２
４が配置され、この冷却コイル２３．２４によって前記
搬入口部２１内および搬出口部２２内が冷却されること
により、前記飽和蒸気相１５の領域が限定されるととも
に、この飽和蒸気相１５の周囲に浮遊し外部に漏出しよ
うとする不飽和蒸気のほとんどが凝縮液化され、前記液
溜部１２に回収される。(Prior Art) As shown in FIG. 2, in a vapor phase soldering apparatus, a liquid (fluorine-based inert solvent) 13 contained in a liquid reservoir 12 at the bottom of a steam tank 11 is heated by a heater 14. As a result, a saturated vapor phase 15 is formed inside the steam tank 11, and the latent heat of vaporization of this saturated vapor phase 15 causes a printed wiring board 17 as a workpiece to be carried into the steam tank 11 by a conveyor 16. The paste solder (cream solder) between the board 17 and the mounted component 18 is reflow soldered, and the component 18 is reflow soldered to the board 17. A workpiece inlet 21 is provided on one side of the steam tank 11, and a workpiece outlet 22 is provided on the other side, and cooling coils 23.2 are provided at the inlet 21 and the outlet 22.
4 is disposed, and the inside of the inlet port 21 and the inlet port 22 are cooled by the cooling coils 23 and 24, thereby limiting the area of the saturated vapor phase 15 and reducing the amount of the saturated vapor phase 15. Most of the unsaturated vapor floating around and attempting to leak outside is condensed and liquefied, and collected into the liquid reservoir 12.
従来は、このような気相式はんだ付け装置において、前
記液溜部１２の上側空間のほぼ全域にわたって前記飽和
蒸気相１５が形成されている。Conventionally, in such a vapor phase soldering apparatus, the saturated vapor phase 15 is formed over almost the entire area above the liquid reservoir 12.
（発明が解決しようとする問題点）
しかし、この従来の気相式はんだ付け装置は、どのよう
なワークも、等しく大きな飽和蒸気相１５に挿入されて
いるので、その蒸気相の熱効率が悪く、無駄が多い。例
えば、前記基板１７および部品１８が小形であってその
熱容量が小さい場合は、はんだ付けに使用されない蒸気
相が多くなり、その分だけ余剰蒸気相が前記搬入口部２
１および搬出口部２２から外部に漏出しやすい問題があ
るし、またこのような場合は、ワークが直ぐに必要温度
（２１５℃）に達し、その後の高温蒸気相中に曝される
時間が長いため、基板搭載部品１８に過剰な加熱がなさ
れる問題もある。(Problems to be Solved by the Invention) However, in this conventional vapor phase soldering device, any workpiece is inserted into the equally large saturated vapor phase 15, so the thermal efficiency of the vapor phase is poor. There is a lot of waste. For example, if the board 17 and the component 18 are small and have a small heat capacity, there will be a large amount of vapor phase that is not used for soldering, and that excess vapor phase will be transferred to the loading port section.
There is a problem that the workpiece easily leaks to the outside from the port 1 and the outlet 22, and in such a case, the workpiece quickly reaches the required temperature (215°C) and is then exposed to the high-temperature vapor phase for a long time. There is also the problem that the board-mounted components 18 are overheated.
本・発明の目的は、ワークに応じて飽和蒸気相の領域幅
を調整できるようにし、ワークに応じた熱効率の良い気
相式はんだ付け運転を行うことにある。An object of the present invention is to enable the width of the saturated vapor phase region to be adjusted depending on the workpiece, and to perform vapor phase soldering operation with good thermal efficiency depending on the workpiece.
（問題点を解決するための手段）
第１番目の本発明は、蒸気槽１１の下部に設けられた液
溜部１２に収容された液１３が蒸発気化され、前記蒸気
槽１１の内部に飽和蒸気相１５が形成され、この飽和蒸
気相１５中を経て搬送されるワーク１７゜１８が飽和蒸
気相１５の気化潜熱によってリフローはんだ付けされる
気相式はんだ付け装置において、前記液溜部１２の上部
に、前記蒸気槽１１の内部に形成される前記飽和蒸気相
１５の領域幅を可変調整するための耐熱性蛇腹体３５が
伸縮自在に設けられたものである。(Means for Solving Problems) In the first aspect of the present invention, the liquid 13 contained in the liquid reservoir 12 provided at the lower part of the steam tank 11 is evaporated and vaporized, and the inside of the steam tank 11 is saturated. In a vapor phase soldering apparatus in which a vapor phase 15 is formed and a workpiece 17 or 18 transferred through this saturated vapor phase 15 is reflow soldered by the latent heat of vaporization of the saturated vapor phase 15, the liquid reservoir section 12 is A heat-resistant bellows body 35 for variably adjusting the width of the region of the saturated vapor phase 15 formed inside the steam tank 11 is provided on the upper part so as to be expandable and retractable.
第２番目の本発明は、前記気相式はんだ付け装置におい
て、前記液溜部１２の上部に、液溜部１２の一側部から
他側部にわたって送りねじ３３が回動自在に設けられ、
この送りねじ３３に可動板３４が螺合され、この可動板
３４に前記蒸気槽１１の内部に形成される前記飽和蒸気
相１５の領域幅を可変調整するための耐熱性蛇腹体３５
の一端部が接続され、この蛇腹体３５の他端部は液溜部
１２の内壁に固定され、前記送りねじ３３は前記液溜部
１２の外部に設けられたモータ４１の回転軸４２に接続
され、このモータ４１′の正逆転により前記蛇腹体３５
が伸縮されるものである。In the second aspect of the present invention, in the vapor phase soldering apparatus, a feed screw 33 is rotatably provided at the upper part of the liquid reservoir 12 from one side to the other side of the liquid reservoir 12,
A movable plate 34 is screwed onto the feed screw 33, and a heat-resistant bellows body 35 is attached to the movable plate 34 to variably adjust the width of the region of the saturated steam phase 15 formed inside the steam tank 11.
One end of the bellows body 35 is connected, the other end of the bellows body 35 is fixed to the inner wall of the liquid reservoir 12, and the feed screw 33 is connected to a rotating shaft 42 of a motor 41 provided outside the liquid reservoir 12. The bellows body 35 is rotated in the forward and reverse directions of the motor 41'.
is expanded and contracted.
（作用）
第１番目の発明は、前記蛇腹体３５が伸張された場合は
、相対的に液溜部１２の上部開口の面積が狭められ、そ
の開口上に形成される飽和蒸気相１５の領域幅も狭めら
れるから、小さなワーク１７．１８の気相式はんだ付け
に適する。また前記蛇腹体３５が収縮されると、前記液
溜部１２上の開口面積が広がるので、飽和蒸気相１５の
領域幅も拡大し、大きなワークに対応できる。(Function) The first aspect of the invention is that when the bellows body 35 is extended, the area of the upper opening of the liquid reservoir 12 is relatively narrowed, and a region of the saturated vapor phase 15 is formed on the opening. Since the width can be narrowed, it is suitable for vapor phase soldering of small workpieces 17 and 18. Furthermore, when the bellows body 35 is contracted, the opening area above the liquid reservoir 12 is expanded, so that the width of the region of the saturated vapor phase 15 is also expanded, making it possible to handle large workpieces.
第２番目の本発明によれば、外部のモータ４１によって
送りねじ３３の回転数がυ制御され、その回転数に応じ
た距離だけこのねじ３３と螺合する可動板３４が・移動
され、この可動板３４によって蛇腹体３５が前記のよう
にワークに応じて伸縮調整される。According to the second aspect of the invention, the rotation speed of the feed screw 33 is controlled by the external motor 41, and the movable plate 34 that is threadedly engaged with the screw 33 is moved by a distance corresponding to the rotation speed. The bellows body 35 is adjusted to expand and contract according to the workpiece as described above by the movable plate 34.
（実施例）
以下、本発明を第１図に示される一実施例を参照して詳
細に説明する。なお、第２図に示された従来例と同一の
部分には同一符号を付して、その説明を省略する。(Example) Hereinafter, the present invention will be explained in detail with reference to an example shown in FIG. Note that the same parts as in the conventional example shown in FIG. 2 are given the same reference numerals, and their explanations will be omitted.
前記蒸気槽１１の液溜部１２の上部に、液溜部１２の・
−側部軸受３１から他側部軸受３２にわたって送りねじ
としてのボールねじ３３が回動自在に設けられ、このボ
ールねじ３３に可動板３４の雌ねじ部３４ａが螺合され
、この可動板３４に前記蒸気槽１１の内部に形成される
飽和蒸気相１５の領域幅を可変調整するための耐熱性蛇
腹体３５の一端部が接続され、この蛇腹体３５の他端部
は液溜部１２の内壁に取付板３６を介して固定されてい
る。At the upper part of the liquid reservoir part 12 of the steam tank 11, the liquid reservoir part 12 is
- A ball screw 33 as a feed screw is rotatably provided from the side bearing 31 to the other side bearing 32, and the female threaded portion 34a of the movable plate 34 is screwed onto this ball screw 33. One end of a heat-resistant bellows body 35 for variably adjusting the region width of the saturated vapor phase 15 formed inside the steam tank 11 is connected, and the other end of this bellows body 35 is connected to the inner wall of the liquid reservoir 12. It is fixed via a mounting plate 36.
前記可動板３４は、前記ボールねじ３３と平行に設けら
れた２木のガイドロッド（図示せず）の案内で移動され
る。The movable plate 34 is guided by two guide rods (not shown) installed parallel to the ball screw 33.
前記耐熱性蛇腹体３５の材料は、ポリテトラフロロエヂ
レン（商品名テフロン）によってコーティングされたガ
ラス繊維によって形成されている。The heat-resistant bellows body 35 is made of glass fiber coated with polytetrafluoroethylene (trade name: Teflon).
またこの蛇腹体３５の第１図紙面に対し直角方向の全幅
寸法は、蒸気ｅｆｆ１１の同方向の内壁面間幅に形成さ
れている。Further, the total width of the bellows body 35 in the direction perpendicular to the plane of the first drawing is set to the width between the inner wall surfaces of the steam eff 11 in the same direction.
前記ボールねじ３３は、前記液溜部１２の外部に取付板
４０を介して設けられたサーボモータ４１０回転軸４２
にカップリング４３を介して接続される。The ball screw 33 connects to a rotating shaft 42 of a servo motor 410 provided outside the liquid reservoir 12 via a mounting plate 40.
via a coupling 43.
そうして、サーボモータ４１によって正逆転される送り
ねじ３３の回転数が制御され、その回転数に応じた距離
だけこのねじ３３と螺合する可動板３４が移動され、こ
の可動板３４によって蛇腹体３５がプリント配線基板１
７の大ぎざや搭載部品１８の実装密度に応じて伸縮調整
される。Then, the number of revolutions of the feed screw 33, which is rotated forward and backward, is controlled by the servo motor 41, and the movable plate 34, which is threaded with this screw 33, is moved by a distance corresponding to the number of revolutions, and the movable plate 34 causes the bellows The body 35 is the printed wiring board 1
7 and the mounting density of the mounted components 18.
前記蛇腹体３５が伸張された場合は、相対的に液溜部１
２の上部開口の面積が狭められ、その開口上に形成され
る飽和蒸気相１５の領域幅も狭められるから、熱容量の
小さなワーク１７．１８の気相式はんだ付けに適する。When the bellows body 35 is extended, the liquid reservoir 1
Since the area of the upper opening 2 is narrowed and the width of the region of the saturated vapor phase 15 formed above the opening is also narrowed, it is suitable for vapor phase soldering of works 17 and 18 having a small heat capacity.
その場合、電熱ヒータ１４への通電量も少なく制御され
、消費電力が節約される。In that case, the amount of electricity supplied to the electric heater 14 is also controlled to be small, thereby saving power consumption.
ま−た舶記蛇腹体３５が収縮されると、前記液溜部１２
上の開口面積が広がるので、飽和蒸気相１５の領域幅も
拡大し、熱容量の大きなワークに対応できる。Also, when the bellows body 35 is contracted, the liquid reservoir 12
Since the area of the upper opening is expanded, the width of the region of the saturated vapor phase 15 is also expanded, making it possible to handle a workpiece with a large heat capacity.
ワーク１７．１８の種類が頻繁に変更されるような場合
は、前記サーボモータ４１の制御回路にワーク１７．１
８の変更に対応する回転数設定値を予めプログラミング
しておくとよい。If the type of work 17.18 is changed frequently, the control circuit of the servo motor 41 may
It is preferable to program the rotational speed setting value corresponding to the change of 8 in advance.
第１番目の本発明によれば、蒸気槽の液溜部の上部に、
蒸気槽の内部に形成される飽和蒸気相の領域幅を可変調
整するための耐熱性蛇腹体が伸縮自在に設けられたから
、この蛇腹体により液溜部上の開口面積を可変調整する
ことで、ワークの熱容量に応じて飽和蒸気相の領域幅を
調整でき、ワークに応じた熱効率の良い気相式はんだ付
け運転を行うことができ、無駄がない。熱容量の小さな
ワークに対しては小形の蒸気槽として機能するとも言え
る。According to the first invention, in the upper part of the liquid reservoir part of the steam tank,
Since the heat-resistant bellows body for variably adjusting the width of the region of the saturated vapor phase formed inside the steam tank is provided in a telescopic manner, the opening area above the liquid reservoir can be variably adjusted by this bellows body. The region width of the saturated vapor phase can be adjusted according to the heat capacity of the workpiece, and vapor phase soldering operation can be performed with good thermal efficiency depending on the workpiece, with no waste. It can be said that it functions as a small steam tank for workpieces with small heat capacity.
第２番目の本発明によれば、前記液溜部の上部に、液溜
部の一側部から他側部にわたって送りねじが回動自在に
設けられ、この送りねじに可動板が螺合され、この可動
板に前記蒸気槽の内部に形成される飽和蒸気相の領域幅
を可変調整するための耐熱性蛇腹体の一端部が接続され
、この蛇腹体の他９一部は液溜部の内壁に固定され、前
記送りねじは前記液溜部の外部に設けられたモータの回
転軸に接続され、このモータの正逆転により前記蛇腹体
が伸縮されるようにしたから、前記蛇腹体による可変調
整を自動的に行うことができ、ワークの変更に容易に対
応できる。According to the second invention, a feed screw is rotatably provided at the upper part of the liquid reservoir from one side to the other side of the liquid reservoir, and the movable plate is screwed to the feed screw. One end of a heat-resistant bellows body for variably adjusting the region width of the saturated vapor phase formed inside the steam tank is connected to this movable plate, and the other nine parts of the bellows body are connected to the liquid reservoir section. The feed screw is fixed to the inner wall, and the feed screw is connected to the rotating shaft of a motor provided outside the liquid reservoir, and the bellows body is expanded and contracted by forward and reverse rotation of the motor. Adjustments can be made automatically and changes in workpieces can be easily accommodated.
第１図は本発明の気相式はんだ付け装置の一実茄例を示
す断面図、第２図は従来の気相式はんだ付け装置の断面
図である。
１１・・蒸気槽、１２・・液溜部、１３・・液、１５・
・飽和蒸気相、１７．１８・・ワークとしてのプリン］
・配線基板および搭載部品、３３・・送りねじとしての
ボールねじ、３４・・可動板、３５・・耐熱性蛇腹体、
４１・・モータ、４２・・回転軸。FIG. 1 is a sectional view showing an example of a vapor phase soldering apparatus according to the present invention, and FIG. 2 is a sectional view of a conventional vapor phase soldering apparatus. 11. Steam tank, 12. Liquid reservoir, 13. Liquid, 15.
・Saturated vapor phase, 17.18...pudding as work]
・Wiring board and mounted parts, 33. Ball screw as feed screw, 34. Movable plate, 35. Heat resistant bellows body,
41...Motor, 42...Rotating shaft.
Claims (2)
が蒸発気化され、前記蒸気槽の内部に飽和蒸気相が形成
され、この飽和蒸気相中を経て搬送されるワークが飽和
蒸気相の気化潜熱によつてリフローはんだ付けされる気
相式はんだ付け装置において、前記液溜部の上部に、前
記蒸気槽の内部に形成される前記飽和蒸気相の領域幅を
可変調整するための耐熱性蛇腹体が伸縮自在に設けられ
たことを特徴とする気相式はんだ付け装置。(1) The liquid contained in the liquid reservoir provided at the bottom of the steam tank is evaporated and vaporized, a saturated vapor phase is formed inside the steam tank, and the workpiece conveyed through this saturated vapor phase becomes saturated. In a vapor phase soldering apparatus that performs reflow soldering using latent heat of vaporization of a vapor phase, for variably adjusting the width of a region of the saturated vapor phase formed inside the vapor tank above the liquid reservoir. A vapor phase soldering device characterized in that a heat-resistant bellows body is provided in a manner that is expandable and retractable.
が蒸発気化され、前記蒸気槽の内部に飽和蒸気相が形成
され、この飽和蒸気相中を経て搬送されるワークが飽和
蒸気相の気化潜熱によつてリフローはんだ付けされる気
相式はんだ付け装置において、前記液溜部の上部に、液
溜部の一側部から他側部にわたって送りねじが回動自在
に設けられ、この送りねじに可動板が螺合され、この可
動板に前記蒸気槽の内部に形成される前記飽和蒸気相の
領域幅を可変調整するための耐熱性蛇腹体の一端部が接
続され、この蛇腹体の他端部は液溜部の内壁に固定され
、前記送りねじは前記液溜部の外部に設けられたモータ
の回転軸に接続され、このモータの正逆転により前記蛇
腹体が伸縮されることを特徴とする気相式はんだ付け装
置。(2) The liquid contained in the liquid reservoir provided at the bottom of the steam tank is evaporated, a saturated vapor phase is formed inside the steam tank, and the workpiece transported through this saturated vapor phase becomes saturated. In a vapor phase soldering device that performs reflow soldering using latent heat of vaporization in a vapor phase, a feed screw is rotatably provided above the liquid reservoir from one side of the liquid reservoir to the other side. A movable plate is screwed to the feed screw, and one end of a heat-resistant bellows body for variably adjusting the width of the region of the saturated vapor phase formed inside the steam tank is connected to the movable plate. The other end of the bellows body is fixed to the inner wall of the liquid reservoir, the feed screw is connected to a rotating shaft of a motor provided outside the liquid reservoir, and the bellows body is expanded and contracted by forward and reverse rotation of the motor. A vapor phase soldering device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27072386A JPS63123566A (en) | 1986-11-13 | 1986-11-13 | Vapor phase type soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27072386A JPS63123566A (en) | 1986-11-13 | 1986-11-13 | Vapor phase type soldering device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63123566A true JPS63123566A (en) | 1988-05-27 |
| JPH0245947B2 JPH0245947B2 (en) | 1990-10-12 |
Family
ID=17490061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27072386A Granted JPS63123566A (en) | 1986-11-13 | 1986-11-13 | Vapor phase type soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63123566A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02155565A (en) * | 1988-12-09 | 1990-06-14 | Hitachi Techno Eng Co Ltd | Vapor reflow type soldering device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735332U (en) * | 1993-12-15 | 1995-06-27 | 大介 五家 | Container with calorie display scale |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6264474A (en) * | 1985-09-17 | 1987-03-23 | Kenji Kondo | Soldering device |
-
1986
- 1986-11-13 JP JP27072386A patent/JPS63123566A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6264474A (en) * | 1985-09-17 | 1987-03-23 | Kenji Kondo | Soldering device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02155565A (en) * | 1988-12-09 | 1990-06-14 | Hitachi Techno Eng Co Ltd | Vapor reflow type soldering device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0245947B2 (en) | 1990-10-12 |
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