JPS62107862A - Gaseous phase type soldering device - Google Patents

Gaseous phase type soldering device

Info

Publication number
JPS62107862A
JPS62107862A JP24773485A JP24773485A JPS62107862A JP S62107862 A JPS62107862 A JP S62107862A JP 24773485 A JP24773485 A JP 24773485A JP 24773485 A JP24773485 A JP 24773485A JP S62107862 A JPS62107862 A JP S62107862A
Authority
JP
Japan
Prior art keywords
unit
vapor phase
board
cream solder
supply unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24773485A
Other languages
Japanese (ja)
Inventor
Nobuhide Abe
阿部 宣英
Takao Takahashi
孝夫 高橋
Yoshinobu Abe
可伸 安部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Priority to JP24773485A priority Critical patent/JPS62107862A/en
Publication of JPS62107862A publication Critical patent/JPS62107862A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/012Soldering with the use of hot gas
    • B23K1/015Vapour-condensation soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To heat adequately parts having a different heat capacity by providing in series a soldering unit for parts having a large heat capacity, and a unit for parts having a small heat capacity. CONSTITUTION:The first gaseous phase type soldering unit 23 for on-board parts having a large heat capacity is provided with the first cream solder feed ing unit 21 and the first parts feeding unit 22. Also, on the downstream side of this unit 21, the second unit 26 for on-board parts having a small heat capac ity, of the same constitution is placed in series. Accordingly, a sufficient heating time is secured for large parts, and also, an excessive heating can be prevented as for small parts. In this regard, it does not occur that which has been solidi fied by the unit 23 is remelted by the unit 26.

Description

【発明の詳細な説明】 〔産業上の利用分野] 本発明は、蒸気相の気化潜熱を利用してはんだ付けを行
う気相式はんだ付け装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vapor phase soldering device that performs soldering using latent heat of vaporization in the vapor phase.

〔従来の技術〕[Conventional technology]

従来は、第2図に示されるように、クリームはんだ供給
ユニット1と、部品供給ユニット2と、気相式はんだ付
けユニット3とを一連に1絹だけ配置し、クリームはん
だ供給ユニット1にJ3いてディスペンFすによりプリ
ント配線基板W上の多点にクリームはんだを供給し、さ
らに部品供給ユニット2において前記プリント配線基板
Wのクリームはんだ上に大小各種のIC等の電子部品P
1. P2を搭載し、この部品搭載基板を気相式はんだ
付けユニツ1へ3の内部に搬入して、はんだ付(プを行
っている。
Conventionally, as shown in FIG. 2, a cream solder supply unit 1, a component supply unit 2, and a vapor phase soldering unit 3 are arranged in series, and only one solder is connected to the cream solder supply unit 1. A dispenser F supplies cream solder to multiple points on the printed wiring board W, and a component supply unit 2 supplies electronic components P such as ICs of various sizes onto the cream solder of the printed wiring board W.
1. P2 is mounted, and this component-mounted board is carried into the vapor phase soldering unit 1 and 3, where soldering is performed.

前記気相式はんだ付けユニット3は、装置本体基板の下
部に設けられた液槽12の内部の不活竹液体13を電熱
ヒ〜り14により加熱して蒸発させることにより、前記
装置本体基板の内部に蒸気相15を形成し、この蒸気相
内に搬入した部品搭載基板Wを前記蒸気相15が有する
気化潜熱により加熱し、そのプリント配線lj板Wとそ
の搭載部品P1. P2との間にあるクリームはんだを
溶融して両者をはんだ付けするようにしている。
The vapor phase soldering unit 3 heats and evaporates the inert bamboo liquid 13 in the liquid tank 12 provided at the lower part of the device main body board with an electric heat 14, thereby soldering the device main body board. A vapor phase 15 is formed inside, and the component mounting board W carried into this vapor phase is heated by the vaporization latent heat of the vapor phase 15, and the printed wiring lj board W and its mounted components P1. The cream solder between P2 and P2 is melted to solder both.

このように従来は、1枚のプリント配線雄板Wにλjし
、熱容ωの異なる大小の部品P1、P2を前記部品供給
ユニット2にて一度に搭載し、そして、前記気相式はん
だ付けユニツ1〜3でその大小部品Pl、 P2を同時
にプリント配線基板Wにはんだ付けするようにしている
。その場合、はんだ付け時間は、熱容量の大きな大部品
P1を基準にして設定し、全ての1ハ戟部品のはんだ付
けに必要な十分のはんだ付け時間を確保している。
In this way, conventionally, components P1 and P2 of different sizes and heat capacities ω are mounted on one printed wiring male board W at the same time by the component supply unit 2, and then the vapor phase soldering is carried out. Units 1 to 3 solder the large and small parts Pl and P2 to the printed wiring board W at the same time. In this case, the soldering time is set based on the large component P1 having a large heat capacity, and sufficient soldering time necessary for soldering all the 1-cut components is ensured.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、このような従来のものでは、熱容量の小さイ【
小部品P2にとっては過剰な加熱時間どなる場合があり
、小部品と接触するクリームはんだ中のフラックスが蒸
発してはんだ付け特性を1Ωうおそれや、小部品P2が
過剰の加熱作用を受けて品質を1nうおそれがあった。
However, such conventional ones have a small heat capacity [
For the small part P2, excessive heating time may occur, and the flux in the cream solder that comes into contact with the small part may evaporate and deteriorate the soldering characteristics by 1Ω, or the small part P2 may be subjected to excessive heating and the quality may deteriorate. There was a risk of 1n.

本発明の目的は、気相式はんだ付けにおいて、大部品に
ス・]シては十分な加熱時間を確保できるとともに、小
部品に対しては過剰な加熱を防止できるようにすること
にある。
An object of the present invention is to ensure sufficient heating time for large components in vapor phase soldering, and to prevent excessive heating of small components.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、被はんだ付け基板にクリームはんだを供給す
るクリームはんだ供給ユニツ1〜と、flfflff−
ムはんだ上に基板搭載部品を供給づ−る部品供給ユニッ
1−と、その部品搭載基板に付着されているクリームは
んだを蒸気相が有する気化潜熱により溶融して被はんだ
Nけ基板に搭載部品をはんだ付けする気相式はんだ付(
Jユニツ1へとを有する気相式はんだ付け装置に関する
ものである。
The present invention includes cream solder supply units 1 to 1 for supplying cream solder to soldered boards, and flffflff-
A component supply unit 1- supplies components to be mounted on a circuit board onto a solder board, and a component supply unit 1- which supplies components to be mounted on a circuit board onto a solder board, and a component supply unit 1- which supplies components to be mounted on a board to be soldered by melting the cream solder attached to the component mounting circuit board by the latent heat of vaporization of the vapor phase and placing the components to be mounted on N number of boards to be soldered. Vapor phase soldering (
The present invention relates to a vapor phase soldering device having a J unit 1.

すなわち、熱容量の大きな搭載部品用の第1のクリーム
はんだ供給ユニット21と、第1の部品供給ユニット2
2と、第1の気相式はんだ付けユニット23とを順次配
列し、この熱容Φの大きな搭載部品用の第1の気相式は
んだ付けユニット23の後に、熱容量の小さな搭載部品
用の第2のクリームはんだ供給ユニット24と、第2の
部品供給ユニット25と、第2の気相式はんだ付けユニ
ット26とを順次配ケ1したものである。
That is, the first cream solder supply unit 21 for mounting components with large heat capacity, and the first component supply unit 2.
2 and a first vapor phase soldering unit 23 are arranged in sequence, and after this first vapor phase soldering unit 23 for mounted components with a large heat capacity Φ, a first vapor phase soldering unit 23 for mounted components with a small heat capacity Φ is arranged. A second cream solder supply unit 24, a second component supply unit 25, and a second vapor phase soldering unit 26 are arranged in sequence.

〔作用〕[Effect]

本発明は、先ず、被はんだ付け基板W上の大部品対応部
分に第1のクリームはんだ供給ユニット21にてクリー
ムはんだを供給し、そのクリームはんだ上に第1の部品
供給ユニット22にて熱容量の太きくZ大部品P1を搭
載し、この大部品搭載基板Wを第1の気相式はんだ付け
ユニット23にて加熱して被はんだ付け基板Wに大部品
P1をはんだ付けする。
In the present invention, first, the first cream solder supply unit 21 supplies cream solder to a large component corresponding portion on the board W to be soldered, and then the first component supply unit 22 supplies the cream solder with heat capacity. A thick Z large component P1 is mounted, and the large component mounting board W is heated in a first vapor phase soldering unit 23 to solder the large component P1 to the soldering target board W.

次に、被はんだ付け基板W上の小部品対応部分に第2の
クリームはんだ供給ユニット24にてクリームはんだを
供給し、そのクリームはんだ上に第2の部品供給ユニツ
]へ25にて熱容量の小ざな小部品P2を搭載し、この
小部品搭載基板Wを第2の気相式はんだ付(づユニツI
〜2Gにて加熱して被はんだ付け基板Wに小部品P2を
はんだ付けする。
Next, the second cream solder supply unit 24 supplies cream solder to the part corresponding to small parts on the board W to be soldered. A small component P2 is mounted on the small component mounting board W, and this small component mounting board W is subjected to a second vapor phase soldering process.
The small component P2 is soldered to the soldering board W by heating at ~2G.

この第2の気相式はんだ付けユニット26は、熱容ωの
小さな小部品P2をはんだ溶F!i温度まで温度上昇さ
せるが、熱容量の大きな大部品P1をはんだ溶融温度ま
で温度上昇させることはない。
This second vapor phase soldering unit 26 melts the small part P2 with a small heat capacity ω by soldering F! Although the temperature is raised to temperature i, the temperature of the large component P1 with a large heat capacity is not raised to the solder melting temperature.

〔実施例〕〔Example〕

以下、本発明を第1図に示す一実施例を参照して詳細に
説明する。
Hereinafter, the present invention will be explained in detail with reference to an embodiment shown in FIG.

被はんだ付け基板どしてのプリント配線基板W上に熱容
量の大きな基板搭載部品P1のリード1こス・j応する
クリームは/Vだを供給する第1のクリームはんだ供給
ユニット21と、前記クリーム(よんだ上に熱容量の大
きな基板搭載部品P1を供給する第1の部品供給ユニツ
1−22と、その部品搭載基板W上に付着されているク
リームは/υだを蒸気相が有ザる気化潜熱により溶融し
てプリン1−配線基板Wに搭載部品P1をはんだ付けす
る第1の気相式はんだ付りユニツ1〜23と、前記プリ
ント配線基板W上に熱容量の小さな基板搭載部品P2の
リードに対応するクリームはんだを供給づる第2のクリ
ームはんだ供給ユニット24と、前記クリームはんだ上
に熱容tRの小さな基板搭載部品P2を供給する第2の
部品供給ユニツ1〜25と、その部品搭載基板W上に基
板着されているクリームはんだを蒸気相が有する気化潜
熱により溶融してプリント配線基板Wに搭載部品P2を
はんだ付けする第2の気相式はんだ付けユニツ1〜26
とを、前記基板Wの搬送方向に順次配列する。前記第1
の気相式はんだイ」けユニット23に比べ、第2の気相
式はんだ付けユニット2Gは小形に形成する。
A first cream solder supply unit 21 supplies a lead 1 of a board-mounted component P1 having a large heat capacity onto a printed wiring board W, such as a board to be soldered. (The first component supply unit 1-22 supplies the board-mounted component P1 with a large heat capacity, and the cream attached to the component-mounted board W is vaporized with a vapor phase of /υ. First vapor phase soldering units 1 to 23 which melt due to latent heat and solder the mounted component P1 to the printed wiring board W, and the leads of the board mounted component P2 having a small heat capacity on the printed wiring board W. a second cream solder supply unit 24 that supplies a cream solder corresponding to the cream solder, a second component supply unit 1 to 25 that supplies a board mounting component P2 with a small heat capacity tR onto the cream solder, and the component mounting board. Second vapor phase soldering units 1 to 26 that solder the mounted component P2 to the printed wiring board W by melting the cream solder attached to the board W by the latent heat of vaporization possessed by the vapor phase.
are sequentially arranged in the transport direction of the substrate W. Said first
The second vapor phase soldering unit 2G is formed smaller than the vapor phase soldering unit 23 shown in FIG.

前記大形および小形の気相式はんだ(=Jけユニツh2
3,2Gは、装置本体31の下側に断熱材32により覆
われた外槽33を設け、この外槽33の内部にヒータ保
護バイブ34を設置し、この保護パイプ34の内部にス
1〜レートタイプの電熱ヒータ35を挿入する。
The above-mentioned large and small vapor phase soldering (=Jkeunits h2
3, 2G is provided with an outer tank 33 covered with a heat insulating material 32 on the lower side of the device main body 31, a heater protection vibe 34 is installed inside this outer tank 33, and a heater protection vibe 34 is installed inside this protection pipe 34. Insert a rate type electric heater 35.

前記外槽33の内部にはグリセリン、マシンオイル等の
伝熱媒体36が充填され、この伝熱媒体36は、前記ヒ
ータ35により225〜235℃に制御される。
The inside of the outer tank 33 is filled with a heat transfer medium 36 such as glycerin or machine oil, and this heat transfer medium 36 is controlled at 225 to 235° C. by the heater 35.

さらに、前記外槽33の内側に前記装置本体31の下部
に位C’J−6−る内槽41を配設し、この内槽41の
内部にフッ素系不活性溶剤等の不活性液体42を収容す
る。さらに、前記装置本体31は、−側部に搬入口43
を設けるとともに、他側に搬出口44を設け、この搬入
口43、搬出口44および装置本体31の上部に冷却管
45を設けたものである。
Furthermore, an inner tank 41 located below the device main body 31 is disposed inside the outer tank 33, and an inert liquid 42 such as a fluorine-based inert solvent is disposed inside the inner tank 41. to accommodate. Furthermore, the device main body 31 has a loading port 43 on the negative side.
In addition, a carry-out port 44 is provided on the other side, and a cooling pipe 45 is provided at the top of the carry-in port 43, the carry-out port 44, and the main body 31 of the apparatus.

次に、この実施例の作用を説明づる。Next, the operation of this embodiment will be explained.

先ず、プリン1〜配線基板W上の大部品対応部分に第1
のクリームはんだ供給ユニツ1〜21にてクリームはん
だを供給し、そのクリームはんだ上に第1の部品供給ユ
ニット22にてフラット・パッケージ・タイプIC等の
熱容量の大きな大部品P1を搭叙し、この大部品塔載基
板Wを第1の気相式はんだ付けユニット23にて加熱し
てプリント配線基板Wに大部品P1をはんだ<=tけづ
る。
First, the first
The cream solder supply units 1 to 21 supply cream solder, and the first component supply unit 22 installs a large component P1 with a large heat capacity such as a flat package type IC on top of the cream solder. The large component mounting board W is heated in the first vapor phase soldering unit 23 to solder the large component P1 onto the printed wiring board W.

前記第1の気相式はんだ(=jけユニット23では、前
記外槽33内の伝熱媒体36がヒータ35により225
〜235℃に加熱され、この伝熱媒体36により内槽4
1内に収容された不活性液体42(沸点215℃)が全
体的に均等に間接加熱されて蒸発し、前記装置本体31
の内部に蒸気相46が形成される。被はんだ付け物Wは
、冷却管45を設けてなる一側の搬入口43から他側の
搬出口44に搬送される間に、前記蒸気相46が有する
気化潜熱により加熱され、プリン1〜配’FAN板Wと
その搭載部品P1との間にあるクリームは/Vだが溶融
され、両者がはんだ付けされる。
In the first vapor phase soldering unit 23, the heat transfer medium 36 in the outer tank 33 is heated to 225 by the heater 35.
The inner tank 4 is heated to ~235°C by this heat transfer medium 36.
The inert liquid 42 (boiling point 215° C.) accommodated in the device body 31 is indirectly heated and evaporated evenly throughout the device body 31.
A vapor phase 46 is formed inside. The soldering object W is heated by the latent heat of vaporization of the vapor phase 46 while being transported from the inlet 43 on one side provided with the cooling pipe 45 to the outlet 44 on the other side, and is heated by the latent heat of vaporization of the vapor phase 46. 'The cream /V between the FAN board W and its mounting component P1 is melted and the two are soldered.

次に、プリント配線基板W上の小部品対応部分に第2の
クリームは/υだ供給ユニット24にてクリームはんだ
を供給し、そのクリームはんだ上に第2の部品供給ユニ
ット25にてスモール・アウトライン・パッケージIC
等の熱容量の小さな小部品P2を搭載し、この大小部品
混載基板Wを第2の気相式はんだ付けユニット26にて
加熱してプリント配線1%板Wに小部品P2をはんだ付
けする。そのはんだ付【J方法は、前記第1の気相式は
んだ(=jけユニッ1−23の場合と同様であるから、
説明を省略する。
Next, the second cream solder is supplied to the small parts corresponding portion on the printed wiring board W by the supply unit 24, and the small outline is applied to the cream solder by the second component supply unit 25.・Package IC
A small component P2 having a small heat capacity such as the like is mounted, and this large and small component mixed board W is heated by the second vapor phase soldering unit 26 to solder the small component P2 to the printed wiring 1% board W. The soldering [J method is the same as that of the first vapor phase soldering (=j) unit 1-23, so
The explanation will be omitted.

この第2の気相式はんだ付(プユニット26は、熱δ吊
の小ざな小部品P2をは/Vだ溶融温度まで温度上界さ
せるが、すでにはんだ付けされた大部品P1は熱容量が
大きいので、はんだ溶融温度まで温度上昇しない。例え
ば、大部品P1は、第1の気相式はんだ付けユニット2
3の装置本体31内に15秒間挿入され、そのうちの1
0秒間は温度上昇に費され、5秒間は平衡状態にあり、
また小部品P2は、第2の気相式はんだ付けユニツ1〜
26の装置本体31内に7秒間挿入され、そのうらの4
秒間は温度上界に費され、3秒間は平衡状態にあるから
、少なくとも10秒間の温度上背時間が必要な大部品P
1は第2の気相式はんだイ」けユニツ1〜26内では固
化はんだ再溶融温度まで温度上昇しない。
This second vapor phase soldering unit 26 raises the temperature of the small parts P2 with a temperature of δ up to the melting temperature of /V, but since the large part P1 that has already been soldered has a large heat capacity, , the temperature does not rise to the solder melting temperature.For example, the large component P1 is soldered in the first vapor phase soldering unit 2.
3 is inserted into the main body 31 of the device for 15 seconds, and one of the
0 seconds are spent increasing the temperature, 5 seconds are at equilibrium,
Moreover, the small parts P2 are attached to the second vapor phase soldering units 1 to 1.
26 for 7 seconds into the main body 31 of the device, and the back 4
Since 1 second is spent at the upper temperature limit and 3 seconds is spent in the equilibrium state, large parts P that require at least 10 seconds of upper temperature time.
1, the temperature does not rise to the remelting temperature of the solidified solder in the second vapor phase soldering units 1 to 26.

なお、前記実施例でtよ、第1の気相式は/υだ(=J
リユニット23を大形に形成し、第2の気相式はんだ付
りユニツ1−26を小形に形成したが、同形の気相式は
んだ付けユニットでも、内部での被は/uだ付け基板の
搬送速度を変えて第1と第2とを区別するようにしても
よい。例えば、第1の気相式はんだ何はユニツ1〜の内
部では低速搬送し、第2の気相式はんだイ・」けユニツ
[−の内部では高速搬送づ−る。
In addition, in the above example, t, the first gas phase equation is /υ (=J
Although the second vapor phase soldering unit 1-26 is formed in a small size while the second vapor phase soldering unit 23 is formed in a large size, even in the same type of vapor phase soldering unit, the internal covering/u soldering board is The first and second may be distinguished by changing the conveying speed of the two. For example, the first vapor phase soldering unit 1 is transported at a low speed inside the unit 1~, and the second vapor phase soldering unit 1~ is transported at a high speed inside the unit [-].

(発明の効果) 本発明によれば、初めに、熱容量の大きな搭載部品用の
第1のクリームはんだ供給ユニットと、第1の部品供給
ユニツ1−と、第1の気相式はんだ付【ツユニットとを
順次配列し、この熱容h1の大きな搭載部品用の第1の
気相式はんだ付けユニットの後に、熱容■の小さな搭載
部品用の第2のクリームはんだ供給ユニットと、第2の
部品供給ユニットと、第2の気相式はんだ付けユニット
とを順次配列したから、熱容旦大の部品に対しては十分
な加熱時間を確保できるとともに、熱容R;小の部品に
対しては過剰な加熱を防止でき、しかも第1の気相式は
んだ付けユニツ1〜で熱容吊大の部品に固化したはんだ
が、第2の気相式はんだ付けユニットで再溶融するおそ
れもない。
(Effects of the Invention) According to the present invention, first, a first cream solder supply unit for mounting components with a large heat capacity, a first component supply unit 1-, and a first vapor phase soldering unit 1- are provided. are arranged in sequence, and after this first vapor phase soldering unit for mounted components with a large heat capacity h1, a second cream solder supply unit for mounted components with a small heat capacity ■; Since the supply unit and the second vapor phase soldering unit are arranged in sequence, it is possible to secure sufficient heating time for parts with a large heat capacity R; Excessive heating can be prevented, and there is no fear that the solder solidified into a component with a large heat capacity in the first vapor phase soldering unit 1 will be remelted in the second vapor phase soldering unit.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の気相式はんだ付け装置の一実施例を示
4断面図、第2図は従来の気相式は/Vだイ1け装置の
断面図である。 W・・被はんだ付け基板、Pi、 P2・・搭載部品、
21・・第1のクリームはんだ供給ユニット、22・・
第1の部品供給ユニット、23・・第1の気相式はんだ
(t fツユニット、24・・第2のクリームはんだ供
給ユニツ1〜.25・・第2の部品υ(給ユニット、2
6・・第2の気相式はんだf」けユニット。
FIG. 1 is a sectional view showing an embodiment of a vapor phase soldering apparatus according to the present invention, and FIG. 2 is a sectional view of a conventional vapor phase soldering apparatus. W... Board to be soldered, Pi, P2... Mounted components,
21...first cream solder supply unit, 22...
First component supply unit, 23...First vapor phase solder (t ft unit, 24...Second cream solder supply unit 1-.25...Second component υ (supply unit, 2
6. Second vapor phase soldering unit.

Claims (1)

【特許請求の範囲】[Claims] (1)被はんだ付け基板にクリームはんだを供給するク
リームはんだ供給ユニットと、前記クリームはんだ上に
基板搭載部品を供給する部品供給ユニットと、その部品
搭載基板に付着されているクリームはんだを蒸気相が有
する気化潜熱により溶融して被はんだ付け基板に搭載部
品をはんだ付けする気相式はんだ付けユニットとを有す
る気相式はんだ付け装置において、熱容量の大きな搭載
部品用の第1のクリームはんだ供給ユニットと、第1の
部品供給ユニットと、第1の気相式はんだ付けユニット
とを順次配列し、この熱容量の大きな搭載部品用の第1
の気相式はんだ付けユニットの後に、熱容量の小さな搭
載部品用の第2のクリームはんだ供給ユニットと、第2
の部品供給ユニットと、第2の気相式はんだ付けユニッ
トとを順次配列したことを特徴とする気相式はんだ付け
装置。
(1) A cream solder supply unit that supplies cream solder to a board to be soldered, a component supply unit that supplies board-mounted components onto the cream solder, and a vapor phase of the cream solder attached to the component-mounted board. In the vapor phase soldering device, the vapor phase soldering unit has a first cream solder supply unit for the mounted components having a large heat capacity; , a first component supply unit and a first vapor phase soldering unit are sequentially arranged, and the first component supply unit and the first vapor phase soldering unit are arranged in order, and the first
After the vapor phase soldering unit, there is a second cream solder supply unit for mounting components with small heat capacity, and a second
A vapor phase soldering apparatus characterized in that a component supply unit and a second vapor phase soldering unit are sequentially arranged.
JP24773485A 1985-11-05 1985-11-05 Gaseous phase type soldering device Pending JPS62107862A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24773485A JPS62107862A (en) 1985-11-05 1985-11-05 Gaseous phase type soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24773485A JPS62107862A (en) 1985-11-05 1985-11-05 Gaseous phase type soldering device

Publications (1)

Publication Number Publication Date
JPS62107862A true JPS62107862A (en) 1987-05-19

Family

ID=17167874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24773485A Pending JPS62107862A (en) 1985-11-05 1985-11-05 Gaseous phase type soldering device

Country Status (1)

Country Link
JP (1) JPS62107862A (en)

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