JPS62107862A - Gaseous phase type soldering device - Google Patents

Abstract

PURPOSE:To heat adequately parts having a different heat capacity by providing in series a soldering unit for parts having a large heat capacity, and a unit for parts having a small heat capacity. CONSTITUTION:The first gaseous phase type soldering unit 23 for on-board parts having a large heat capacity is provided with the first cream solder feed ing unit 21 and the first parts feeding unit 22. Also, on the downstream side of this unit 21, the second unit 26 for on-board parts having a small heat capac ity, of the same constitution is placed in series. Accordingly, a sufficient heating time is secured for large parts, and also, an excessive heating can be prevented as for small parts. In this regard, it does not occur that which has been solidi fied by the unit 23 is remelted by the unit 26.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a vapor phase soldering device that performs soldering using latent heat of vaporization in the vapor phase.

[Conventional technology]

Conventionally, as shown in FIG. 2, a cream solder supply unit 1, a component supply unit 2, and a vapor phase soldering unit 3 are arranged in series, and only one solder is connected to the cream solder supply unit 1. A dispenser F supplies cream solder to multiple points on the printed wiring board W, and a component supply unit 2 supplies electronic components P such as ICs of various sizes onto the cream solder of the printed wiring board W.
1. P2 is mounted, and this component-mounted board is carried into the vapor phase soldering unit 1 and 3, where soldering is performed.

The vapor phase soldering unit 3 heats and evaporates the inert bamboo liquid 13 in the liquid tank 12 provided at the lower part of the device main body board with an electric heat 14, thereby soldering the device main body board. A vapor phase 15 is formed inside, and the component mounting board W carried into this vapor phase is heated by the vaporization latent heat of the vapor phase 15, and the printed wiring lj board W and its mounted components P1. The cream solder between P2 and P2 is melted to solder both.

In this way, conventionally, components P1 and P2 of different sizes and heat capacities ω are mounted on one printed wiring male board W at the same time by the component supply unit 2, and then the vapor phase soldering is carried out. Units 1 to 3 solder the large and small parts Pl and P2 to the printed wiring board W at the same time. In this case, the soldering time is set based on the large component P1 having a large heat capacity, and sufficient soldering time necessary for soldering all the 1-cut components is ensured.

[Problem that the invention seeks to solve]

However, such conventional ones have a small heat capacity [
For the small part P2, excessive heating time may occur, and the flux in the cream solder that comes into contact with the small part may evaporate and deteriorate the soldering characteristics by 1Ω, or the small part P2 may be subjected to excessive heating and the quality may deteriorate. There was a risk of 1n.

An object of the present invention is to ensure sufficient heating time for large components in vapor phase soldering, and to prevent excessive heating of small components.

[Means for solving problems]

The present invention includes cream solder supply units 1 to 1 for supplying cream solder to soldered boards, and flffflff-
A component supply unit 1- supplies components to be mounted on a circuit board onto a solder board, and a component supply unit 1- which supplies components to be mounted on a circuit board onto a solder board, and a component supply unit 1- which supplies components to be mounted on a board to be soldered by melting the cream solder attached to the component mounting circuit board by the latent heat of vaporization of the vapor phase and placing the components to be mounted on N number of boards to be soldered. Vapor phase soldering (
The present invention relates to a vapor phase soldering device having a J unit 1.

That is, the first cream solder supply unit 21 for mounting components with large heat capacity, and the first component supply unit 2.
2 and a first vapor phase soldering unit 23 are arranged in sequence, and after this first vapor phase soldering unit 23 for mounted components with a large heat capacity Φ, a first vapor phase soldering unit 23 for mounted components with a small heat capacity Φ is arranged. A second cream solder supply unit 24, a second component supply unit 25, and a second vapor phase soldering unit 26 are arranged in sequence.

[Effect]

In the present invention, first, the first cream solder supply unit 21 supplies cream solder to a large component corresponding portion on the board W to be soldered, and then the first component supply unit 22 supplies the cream solder with heat capacity. A thick Z large component P1 is mounted, and the large component mounting board W is heated in a first vapor phase soldering unit 23 to solder the large component P1 to the soldering target board W.

Next, the second cream solder supply unit 24 supplies cream solder to the part corresponding to small parts on the board W to be soldered. A small component P2 is mounted on the small component mounting board W, and this small component mounting board W is subjected to a second vapor phase soldering process.
The small component P2 is soldered to the soldering board W by heating at ~2G.

This second vapor phase soldering unit 26 melts the small part P2 with a small heat capacity ω by soldering F! Although the temperature is raised to temperature i, the temperature of the large component P1 with a large heat capacity is not raised to the solder melting temperature.

〔Example〕

Hereinafter, the present invention will be explained in detail with reference to an embodiment shown in FIG.

A first cream solder supply unit 21 supplies a lead 1 of a board-mounted component P1 having a large heat capacity onto a printed wiring board W, such as a board to be soldered. (The first component supply unit 1-22 supplies the board-mounted component P1 with a large heat capacity, and the cream attached to the component-mounted board W is vaporized with a vapor phase of /υ. First vapor phase soldering units 1 to 23 which melt due to latent heat and solder the mounted component P1 to the printed wiring board W, and the leads of the board mounted component P2 having a small heat capacity on the printed wiring board W. a second cream solder supply unit 24 that supplies a cream solder corresponding to the cream solder, a second component supply unit 1 to 25 that supplies a board mounting component P2 with a small heat capacity tR onto the cream solder, and the component mounting board. Second vapor phase soldering units 1 to 26 that solder the mounted component P2 to the printed wiring board W by melting the cream solder attached to the board W by the latent heat of vaporization possessed by the vapor phase.
are sequentially arranged in the transport direction of the substrate W. Said first
The second vapor phase soldering unit 2G is formed smaller than the vapor phase soldering unit 23 shown in FIG.

The above-mentioned large and small vapor phase soldering (=Jkeunits h2
3, 2G is provided with an outer tank 33 covered with a heat insulating material 32 on the lower side of the device main body 31, a heater protection vibe 34 is installed inside this outer tank 33, and a heater protection vibe 34 is installed inside this protection pipe 34. Insert a rate type electric heater 35.

The inside of the outer tank 33 is filled with a heat transfer medium 36 such as glycerin or machine oil, and this heat transfer medium 36 is controlled at 225 to 235° C. by the heater 35.

Furthermore, an inner tank 41 located below the device main body 31 is disposed inside the outer tank 33, and an inert liquid 42 such as a fluorine-based inert solvent is disposed inside the inner tank 41. to accommodate. Furthermore, the device main body 31 has a loading port 43 on the negative side.
In addition, a carry-out port 44 is provided on the other side, and a cooling pipe 45 is provided at the top of the carry-in port 43, the carry-out port 44, and the main body 31 of the apparatus.

Next, the operation of this embodiment will be explained.

First, the first
The cream solder supply units 1 to 21 supply cream solder, and the first component supply unit 22 installs a large component P1 with a large heat capacity such as a flat package type IC on top of the cream solder. The large component mounting board W is heated in the first vapor phase soldering unit 23 to solder the large component P1 onto the printed wiring board W.

In the first vapor phase soldering unit 23, the heat transfer medium 36 in the outer tank 33 is heated to 225 by the heater 35.
The inner tank 4 is heated to ~235°C by this heat transfer medium 36.
The inert liquid 42 (boiling point 215° C.) accommodated in the device body 31 is indirectly heated and evaporated evenly throughout the device body 31.
A vapor phase 46 is formed inside. The soldering object W is heated by the latent heat of vaporization of the vapor phase 46 while being transported from the inlet 43 on one side provided with the cooling pipe 45 to the outlet 44 on the other side, and is heated by the latent heat of vaporization of the vapor phase 46. 'The cream /V between the FAN board W and its mounting component P1 is melted and the two are soldered.

Next, the second cream solder is supplied to the small parts corresponding portion on the printed wiring board W by the supply unit 24, and the small outline is applied to the cream solder by the second component supply unit 25.・Package IC
A small component P2 having a small heat capacity such as the like is mounted, and this large and small component mixed board W is heated by the second vapor phase soldering unit 26 to solder the small component P2 to the printed wiring 1% board W. The soldering [J method is the same as that of the first vapor phase soldering (=j) unit 1-23, so
The explanation will be omitted.

This second vapor phase soldering unit 26 raises the temperature of the small parts P2 with a temperature of δ up to the melting temperature of /V, but since the large part P1 that has already been soldered has a large heat capacity, , the temperature does not rise to the solder melting temperature.For example, the large component P1 is soldered in the first vapor phase soldering unit 2.
3 is inserted into the main body 31 of the device for 15 seconds, and one of the
0 seconds are spent increasing the temperature, 5 seconds are at equilibrium,
Moreover, the small parts P2 are attached to the second vapor phase soldering units 1 to 1.
26 for 7 seconds into the main body 31 of the device, and the back 4
Since 1 second is spent at the upper temperature limit and 3 seconds is spent in the equilibrium state, large parts P that require at least 10 seconds of upper temperature time.
1, the temperature does not rise to the remelting temperature of the solidified solder in the second vapor phase soldering units 1 to 26.

In addition, in the above example, t, the first gas phase equation is /υ (=J
Although the second vapor phase soldering unit 1-26 is formed in a small size while the second vapor phase soldering unit 23 is formed in a large size, even in the same type of vapor phase soldering unit, the internal covering/u soldering board is The first and second may be distinguished by changing the conveying speed of the two. For example, the first vapor phase soldering unit 1 is transported at a low speed inside the unit 1~, and the second vapor phase soldering unit 1~ is transported at a high speed inside the unit [-].

(Effects of the Invention) According to the present invention, first, a first cream solder supply unit for mounting components with a large heat capacity, a first component supply unit 1-, and a first vapor phase soldering unit 1- are provided. are arranged in sequence, and after this first vapor phase soldering unit for mounted components with a large heat capacity h1, a second cream solder supply unit for mounted components with a small heat capacity ■; Since the supply unit and the second vapor phase soldering unit are arranged in sequence, it is possible to secure sufficient heating time for parts with a large heat capacity R; Excessive heating can be prevented, and there is no fear that the solder solidified into a component with a large heat capacity in the first vapor phase soldering unit 1 will be remelted in the second vapor phase soldering unit.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of a vapor phase soldering apparatus according to the present invention, and FIG. 2 is a sectional view of a conventional vapor phase soldering apparatus. W... Board to be soldered, Pi, P2... Mounted components,
21...first cream solder supply unit, 22...
First component supply unit, 23...First vapor phase solder (t ft unit, 24...Second cream solder supply unit 1-.25...Second component υ (supply unit, 2
6. Second vapor phase soldering unit.

Claims (1)

[Claims] (1) A cream solder supply unit that supplies cream solder to a board to be soldered, a component supply unit that supplies board-mounted components onto the cream solder, and a vapor phase of the cream solder attached to the component-mounted board. In the vapor phase soldering device, the vapor phase soldering unit has a first cream solder supply unit for the mounted components having a large heat capacity; , a first component supply unit and a first vapor phase soldering unit are sequentially arranged, and the first component supply unit and the first vapor phase soldering unit are arranged in order, and the first
After the vapor phase soldering unit, there is a second cream solder supply unit for mounting components with small heat capacity, and a second
A vapor phase soldering apparatus characterized in that a component supply unit and a second vapor phase soldering unit are sequentially arranged.