JPH0263697A - Draw bridging preventing method for chip parts - Google Patents
Draw bridging preventing method for chip partsInfo
- Publication number
- JPH0263697A JPH0263697A JP21346288A JP21346288A JPH0263697A JP H0263697 A JPH0263697 A JP H0263697A JP 21346288 A JP21346288 A JP 21346288A JP 21346288 A JP21346288 A JP 21346288A JP H0263697 A JPH0263697 A JP H0263697A
- Authority
- JP
- Japan
- Prior art keywords
- vapor phase
- temperature
- draw
- bridging
- saturated vapor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 8
- 239000012808 vapor phase Substances 0.000 claims abstract description 27
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 229920006395 saturated elastomer Polymers 0.000 claims abstract description 23
- 238000005476 soldering Methods 0.000 claims abstract description 23
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 8
- 239000000956 alloy Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000006071 cream Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は１例えはチップ部品な搭載した表面実装基板
の気相リフローハンダ付けにおいて利用されるものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention is used, for example, in vapor phase reflow soldering of surface-mounted substrates on which chip components are mounted.
（従来技術）
気相ハンダ付けとは、ある躯の不活性液体な沸騰させ、
その飽和蒸気相中に、被ハンダ付は物を放置させて、ハ
ンダな溶融させることによってハンダ付はケ行５す７０
−ハンダ付は技Ｗ（Ｆ）一つとし、て知られている。(Prior art) Vapor phase soldering is the process of boiling an inert liquid,
Soldering is accomplished by leaving the object to be soldered in the saturated vapor phase and melting the solder.
- Soldering is known as one technique W (F).
従来より、この技術は、例えば第１図に示すように、複
数個のチップ部品を基板上の所定箇所に一括してハンダ
付けする場合等に多く利用されている。Conventionally, this technique has been widely used, for example, when a plurality of chip components are collectively soldered to a predetermined location on a board, as shown in FIG.
第１図において、（１）基板、（２）導体パターン、（
３）チップ部品、（４）クリームハンダ、（５）飽和蒸
気相、（６）不活性液体、（７〕ヒータ、ω）冷却コイ
ル、（９）蒸気槽である。In FIG. 1, (1) a substrate, (2) a conductor pattern, (
3) chip parts, (4) cream solder, (5) saturated vapor phase, (6) inert liquid, (7) heater, ω) cooling coil, and (9) steam tank.
次に、この原理な説明する。蒸気槽（９）の中に不活性
液体（６）ヲ入れ、これをヒータ（７）で加熱し沸騰さ
せ、飽和蒸気相（５） ’＆影形成せる。次いで、予め
基＆ （１）の導体パターン（２）上にクリームハンダ
（４） １にスクリーン印刷あるいはデスペンサーで適
量供給し、その上にチップ部品（３）ヲ載せたものを、
この飽和蒸気相（５）の中に浸漬する。この場合の基板
、部品、ハンダの温度は、飽和蒸気相温度よりも低くな
っているため、その表面に触れた飽和蒸気は、その表面
で凝縮し、液化する。この液化の時に、飽和蒸気の放出
する気化潜熱で被ハンダ付は物は、加熱され、クリーム
ハンダが溶融してハンダ付けがなされる。Next, this principle will be explained. An inert liquid (6) is placed in a steam tank (9), heated by a heater (7) and brought to a boil to form a saturated vapor phase (5). Next, apply an appropriate amount of cream solder (4) 1 to the conductor pattern (2) of base & (1) in advance by screen printing or using a dispenser, and place the chip component (3) on top of it.
It is immersed in this saturated vapor phase (5). In this case, the temperature of the board, component, and solder is lower than the saturated vapor phase temperature, so the saturated vapor that touches the surface condenses and liquefies on the surface. During this liquefaction, the object to be soldered is heated by the latent heat of vaporization released by the saturated steam, and the cream solder is melted and soldered.
なお、この場合のクリームハンダとは、ハンダ粉末と適
度の粘着性を有する液状７シツクスとを均一に混ぜ合わ
せた物のことであるが、その代わりにプリホームされた
ハンダ材をチップ部品と導体パターンとの間に介在させ
たり、或は部品またはパターンの少なくとも何れか一方
に、適度の厚さの予備ハンダ被覆層な形成して、スラッ
クス処理を施す事もある。Note that the cream solder in this case is a uniform mixture of solder powder and liquid 7six with moderate adhesiveness, but instead, preformed solder material is used to connect chip parts and conductors. Slack processing may be performed by interposing it between the solder and the pattern, or by forming a preliminary solder coating layer of an appropriate thickness on at least either the component or the pattern.
上記の技術は、他のりフローハンダ付は技術。The above technology is the same as the other glue flow soldering technology.
例えば赤外線加熱、ホットプレート加熱箇の加熱方式に
よる−括りフローハンダ付は技法に比べて。For example, due to the heating method of infrared heating, hot plate heating point - lump flow soldering is compared to the technique.
次のような特長なもっている。It has the following features.
（ａ） 被ハンダ付は物の形状、大きさに関係無く。(a) Soldering is possible regardless of the shape or size of the object.
飽和蒸気が物体表面に触れて失われると１周囲から急速
に飽和蒸気が補給されるために。This is because when saturated steam is lost when it touches the surface of an object, saturated steam is rapidly replenished from the surrounding area.
例えば肉厚などに関係無く均一に加熱される。For example, it is heated evenly regardless of wall thickness.
（ｂ） 何らの温度制御なこうじなくとも、精密に一
定温度が維持される。(b) Precisely constant temperature is maintained without any temperature control.
（ｅ） 熱の伝達効率が極めて高く、かつ過熱される
ことが無い。(e) Extremely high heat transfer efficiency and no overheating.
（ｄ） 不活性液体を使用しているため、その飽和蒸
気相中では酸化、汚染が少ない。(d) Since an inert liquid is used, there is little oxidation and contamination in its saturated vapor phase.
しかしながら、この技術においては、チップ部品を搭載
した表面実装基板をハンダ付けした場合に、該飽和蒸気
相中においてチップ部品が基板のパター・ン面上で立ち
上がる現象すなわちドローブリッジング現象（一般には
ツームストーン現象、又はマンハッタン現象とも呼ばれ
ている）が起こるという問題が知られている。However, with this technology, when a surface-mounted board on which chip components are mounted is soldered, the chip component rises on the pattern surface of the board in the saturated vapor phase, that is, the draw bridging phenomenon (generally known as tooling). There is a known problem in which the Stone phenomenon (also called the Manhattan phenomenon) occurs.
この問題は１例えば文献「Ｈｙｂｒｉｄ Ｃ１ｒｃｕｉ
ｔｓ ＪＮｏ、９Ｊａｎｕａｒｙ１９８６ 、１８〜２
４頁において、あるいは「電子材料Ｊ １９８６年７月
号、１１１〜１１５頁においても記載されている。This problem is solved by 1, for example, the document “Hybrid C1rcui
ts JNo, 9January1986, 18-2
It is also described in "Electronic Materials J, July 1986 issue, pages 111-115."
これに対し、従来よりその効果的な防止方法が無く１時
にはハンダ付は前に予備乾保す行ってこのドローブリッ
ジング？減少させることもあるが。On the other hand, there has been no effective way to prevent this from happening in the past, and some people have to pre-keep it dry before soldering. Although it may be reduced.
そのような場合に、フラックスが劣化するためにハンダ
付は性が著しく低下してハンダ付は部の信頼性を犠牲に
する事が多い。In such cases, the flux deteriorates and the soldering properties are significantly reduced, often sacrificing the reliability of the soldering parts.
そのようなことから、高信頼性が追及される表面実装基
板の気相リフローハンダ付は作業においては、より効果
的なチッフ゛部品のドローブリッジング対策の出現が望
まれていた。For this reason, there has been a desire for a more effective measure against draw-bridging of chip components when performing vapor phase reflow soldering of surface mount boards where high reliability is sought.
（発明の目的）
本発明の目的は、上記のような背′Ｒｖ鑑みてなされた
もので、チップ部品ケ搭載した表面実装基板の気相り７
０−ハンダ付けにおいて、ハンダ付は部の侶鎗性！損な
わすに、飽和蒸気相中でのチップ部品のドローブリッジ
ングの発生ケ抑える方法な提供すること忙ある。(Objective of the Invention) The object of the present invention has been made in view of the above-mentioned problems, and is to
0- When it comes to soldering, soldering is the most difficult part! However, there is a need to provide methods for reducing the occurrence of draw bridging of chip components in the saturated vapor phase.
（発明の概要）
本発明は、上記の目的に基づいてなされたもので、気相
り７０−ハンダ付けにおいて、その飽和蒸気相温度より
５℃至２０℃低い温匿域に、敵相線温ｖＬ？有するハン
ダ合金？使用して、加熱過程でのチップ部品のドローブ
リッジングの発住ン抑えることな特徴とするものである
。(Summary of the Invention) The present invention has been made based on the above-mentioned object, and in vapor phase 70-soldering, the enemy phase line temperature is added to the thermal storage area 5°C to 20°C lower than the saturated vapor phase temperature. vL? Do you have a solder alloy? This feature is used to suppress draw bridging of chip components during the heating process.
なお１本発明において、飽和蒸気相温度およびハンダ合
金の成分組成は、何れも特に限定するものではないが、
１００〜３００℃の飽和蒸気相温度に対しては、Ｓｎあ
るいはＳｎ／Ｐｂ合金を主要成分とするハンダ合金が好
ましい。例えば、２１５℃の飽和蒸気相温度に対しては
、Ｓｎｙ主要成分とする場合は、Ｐｂ 、 Ｂｉ 、
Ａｇ 、 Ｓｂ 、 Ｉｎ 、 Ｚｎ等の金属元素から
選ばれる少なくとも１種以上の金属元素Ｙ添加したもの
である。Note that in the present invention, the saturated vapor phase temperature and the composition of the solder alloy are not particularly limited, but
For a saturated vapor phase temperature of 100 to 300°C, a solder alloy containing Sn or Sn/Pb alloy as a main component is preferred. For example, for a saturated vapor phase temperature of 215°C, if Sny is the main component, Pb, Bi,
At least one metal element Y selected from metal elements such as Ag, Sb, In, and Zn is added.
また１本発明に適応し得るハンダ合金の液相線温ｋｖ、
飽和蒸気相温度に対して５〜２０℃低い温度域に限定し
た理由は、５℃未満では液相線温度とその蒸気温度との
温度差が小さいためにハンダ付は性が著しく低下するた
めであり、２０℃を越えるとハンダ付は性には問題無い
が、チップ部品の電極間において、電極の厚さ、形状な
どの僅かなバラツキやハンダ量、フラックス量などの違
いに影にされて、ハンダのヌレ速度に差異が生じ。In addition, the liquidus temperature kv of the solder alloy that can be applied to the present invention,
The reason for limiting the temperature range to 5 to 20 degrees Celsius lower than the saturated vapor phase temperature is that below 5 degrees Celsius, the temperature difference between the liquidus temperature and the vapor temperature is small, resulting in a marked decrease in soldering properties. Yes, there is no problem with soldering when the temperature exceeds 20℃, but it is overshadowed by slight variations in the thickness and shape of the electrodes, and differences in the amount of solder and flux between the electrodes of chip components. There is a difference in the solder wetting speed.
チップ部品のドローブリッジングの発生Ｙ抑える効果が
殆ど得られないからである。This is because the effect of suppressing the occurrence of draw bridging of chip components is hardly achieved.
（発明の実施例） ６一 本発明の実施例を以下に説明する。第１表は。(Example of the invention) 61 Examples of the present invention will be described below. Table 1 is.
テスト基板上にクリームハンダｔスクリーン印刷によっ
て約２００μｍの厚さ印刷し、その上に１００個の含酸
チップコンデンサ１に一載せたもの＆、 ２１５℃の飽
和蒸気相中に約３０秒間放置した場合の本発明の一実施
例？第１表に示す。When a thickness of about 200 μm was printed on the test board by cream solder T-screen printing, 100 acid-containing chip capacitors 1 were placed on top of the test board, and the test board was left in a saturated vapor phase at 215°C for about 30 seconds. An embodiment of the present invention? Shown in Table 1.
なお、上記においてクリーム／）ンダは、＃！１表に示
すハンダ合金ｔＳそれぞれアトマイズ法によってハンダ
粉末とし、液状７ラツクスと均一に混合したものである
。該クリームハンダの仕様は下記のごとくとした：
ハンダ粉末粒Ｌ ２５０ ｍｅａｈ７ラツクス含
有量 １２チ
塩素含有量 ０．２ｓ
粘度 ６０００００ｅｐ
（発明の効果）
以上述べたように１本発明は、チップ部品を搭載した表
面実装基板の気相り７０−ハンダ付けにおいて、ハンダ
付は部の信頼性を損なわずに、チップ部品のドローブリ
ッジングの発生が殆ど皆無になると言う優れた効果な発
揮するものである。In addition, in the above, cream/)nda is #! Each of the solder alloys tS shown in Table 1 was made into solder powder by the atomization method and uniformly mixed with liquid 7lux. The specifications of the cream solder were as follows: Solder powder grain L 250 meah 7 lux content 12 chlorine content 0.2 s Viscosity 600000 ep (Effects of the invention) As described above, the present invention is equipped with a chip component. In vapor phase soldering of surface mount boards, soldering has an excellent effect in that draw bridging of chip components is almost completely eliminated without impairing the reliability of the parts.
なお１本発明は、このチップ部品のドローブリッジング
の防止効果と共に、チップ部品以外の表面実装部品１例
えはリード端子を有する各糧のミニモールド部品やフラ
ットパッケージ部品などの気相す７０−ハンダ付けにお
いて問題となる、リード端子部へのハンダの吸い上がる
現象いわゆるウィッキング現象にも効果な発揮する。In addition to the effect of preventing draw bridging of chip components, the present invention is also useful for surface mount components other than chip components, such as mini mold components and flat package components having lead terminals, etc. It is also effective against the so-called wicking phenomenon, which is a phenomenon in which solder wicks up to the lead terminal portion, which is a problem during soldering.
第１図は、チップ部品を搭載した表面実装基板の気相リ
フローハンダ付けの概要図である。
（１）・・・基板、伐）・・・導体パターン、（３）・
・・チップ部品。
（４）クリームハンダ、６）・・・飽和蒸気相、（６）
・・・不活性液体、（７）・・・ヒータ、（８）・・・
冷却コイル、（９）・・・蒸気槽。FIG. 1 is a schematic diagram of vapor phase reflow soldering of a surface mount board on which chip components are mounted. (1)...Substrate, cutting)...Conductor pattern, (3)...
...Chip parts. (4) Cream solder, 6)... Saturated vapor phase, (6)
...Inert liquid, (7)...Heater, (8)...
Cooling coil, (9)...steam tank.
Claims (1)
より５℃至２０℃低い温度域に、液相線温度を有するハ
ンダ合金を使用して、加熱過程でのチップ部品のドロー
ブリッジング現象の発生を抑えることを特徴とするチッ
プ部品のドローブリッジング防止方法。In vapor phase reflow soldering, we use a solder alloy with a liquidus temperature in the temperature range 5 to 20 degrees Celsius lower than its saturated vapor phase temperature to prevent the draw bridging phenomenon of chip components during the heating process. A method for preventing draw bridging of chip components, which is characterized by suppressing draw bridging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21346288A JPH0263697A (en) | 1988-08-27 | 1988-08-27 | Draw bridging preventing method for chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21346288A JPH0263697A (en) | 1988-08-27 | 1988-08-27 | Draw bridging preventing method for chip parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0263697A true JPH0263697A (en) | 1990-03-02 |
Family
ID=16639609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21346288A Pending JPH0263697A (en) | 1988-08-27 | 1988-08-27 | Draw bridging preventing method for chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0263697A (en) |
-
1988
- 1988-08-27 JP JP21346288A patent/JPH0263697A/en active Pending
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