JPS63122669U - - Google Patents

Info

Publication number
JPS63122669U
JPS63122669U JP1260387U JP1260387U JPS63122669U JP S63122669 U JPS63122669 U JP S63122669U JP 1260387 U JP1260387 U JP 1260387U JP 1260387 U JP1260387 U JP 1260387U JP S63122669 U JPS63122669 U JP S63122669U
Authority
JP
Japan
Prior art keywords
adhesive
stamp
component mounting
pin
stamp pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1260387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1260387U priority Critical patent/JPS63122669U/ja
Publication of JPS63122669U publication Critical patent/JPS63122669U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Coating Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ，ｂ，ｃおよびｄはそれぞれ本考案の
一実施例を示す平面図、側面図、下面図および側
面拡大図、第２図ａ〜ｄは同実施例の使用状態説
明図、第３図ａおよびｂはそれぞれ本考案の他の
実施例を示す側面図および下面図、第４図ａ，ｂ
およびｃはそれぞれ従来のスタンプピンを示す平
面図、側面図および下面図、第５図ａ〜ｄは従来
のスタンプピンを使用した部品搭載装置にて転写
した場合の接着剤転写状態図である。 １……スタンプピン、２……スタンプ面、３…
…突部、４……接着剤、５……基板、ａ……逃げ
。 Figures 1a, b, c, and d are a plan view, a side view, a bottom view, and an enlarged side view showing an embodiment of the present invention, respectively; Figures 2a to d are explanatory views of the embodiment in use; Figures 3a and b are side and bottom views showing other embodiments of the present invention, respectively, and Figures 4a and b are
5 and c are a plan view, a side view, and a bottom view showing a conventional stamp pin, respectively, and FIGS. 5 a to 5 d are diagrams showing an adhesive transfer state when transferring with a component mounting device using a conventional stamp pin. 1... Stamp pin, 2... Stamp surface, 3...
...Protrusion, 4...Adhesive, 5...Substrate, a...Escape.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板の所定位置にペースト状接着剤を転写させ
この接着剤上にチツプ状部品を搭載する部品搭載
装置の接着剤転写用スタンプピンにおいて、スタ
ンプ面に凸部を設けたことを特徴とする部品搭載
装置の接着剤転写用スタンプピン。 A stamp pin for adhesive transfer of a component mounting device that transfers a paste adhesive to a predetermined position on a substrate and mounts a chip-shaped component on the adhesive, the component mounting having a convex portion on the stamp surface. Stamp pin for adhesive transfer of equipment.
JP1260387U 1987-01-29 1987-01-29 Pending JPS63122669U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1260387U JPS63122669U (en) 1987-01-29 1987-01-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1260387U JPS63122669U (en) 1987-01-29 1987-01-29

Publications (1)

Publication Number Publication Date
JPS63122669U true JPS63122669U (en) 1988-08-09

Family

ID=30800887

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1260387U Pending JPS63122669U (en) 1987-01-29 1987-01-29

Country Status (1)

Country Link
JP (1) JPS63122669U (en)

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