JPS61131832U - - Google Patents

Info

Publication number
JPS61131832U
JPS61131832U JP1425385U JP1425385U JPS61131832U JP S61131832 U JPS61131832 U JP S61131832U JP 1425385 U JP1425385 U JP 1425385U JP 1425385 U JP1425385 U JP 1425385U JP S61131832 U JPS61131832 U JP S61131832U
Authority
JP
Japan
Prior art keywords
view
adhesive
showing
protrusions
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1425385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1425385U priority Critical patent/JPS61131832U/ja
Publication of JPS61131832U publication Critical patent/JPS61131832U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の使用状態を示す斜視図、第２
図イは本考案の実施例を示す正面図、第２図ロは
第２図イの底面図、第３図イは本考案にかかる接
着剤スタンプ用ツールの突出部の先端部を接着剤
中に浸漬した状態を示す正面図、第３図ロは接着
剤スタンプ用ツールの先端部を接着剤中から引上
げた状態を示す正面図、第３図ハは本考案によつ
て被塗布面に形成される接着剤小塊の一例を示す
平面図、第３図ニは第３図ハの正面図、第３図ホ
は半導体素子を、接着剤小塊が付着された被塗布
面に押付けた状態を示す正面図、第４図は本考案
の第２の実施例を示す底面図、第５図は本考案の
第３の実施例を示す一部断面正面図、第６図イは
従来の接着剤スタンプ用ツールを示す正面図、第
６図ロは第６図イの底面図、第７図は従来の接着
剤スタンプ用ツールの使用状態を示す図で、第７
図イはツール本体を接着剤中に浸漬した状態を示
す正面図、第７図ロは、接着剤中から引上げたツ
ール本体を示す正面図、第７図ハは被塗布面への
接着剤の塗布状態を示す平面図、第７図ニは半導
体素子を被塗布面上の接着剤層に押付けた状態を
示す正面図である。 ５……被塗布面、３４……ツール基台、３８，
３９，３８′……突出体。 Figure 1 is a perspective view showing how the present invention is used;
Figure A is a front view showing an embodiment of the present invention, Figure 2B is a bottom view of Figure 2A, and Figure 3A is a tool for adhesive stamping according to the present invention, with the tip of the protruding part being placed in an adhesive. 3B is a front view showing the state where the tip of the adhesive stamp tool is pulled up from the adhesive, and FIG. FIG. 3 D is a front view of FIG. 3 C, and FIG. 3 E is a state in which a semiconductor element is pressed against a surface to be coated to which an adhesive blob is attached. FIG. 4 is a bottom view showing the second embodiment of the present invention, FIG. 5 is a partially sectional front view showing the third embodiment of the present invention, and FIG. 6 A is a conventional adhesive. 6B is a bottom view of FIG. 6A, and FIG. 7 is a diagram showing the conventional adhesive stamp tool in use.
Figure A is a front view showing the tool body immersed in the adhesive, Figure 7 B is a front view showing the tool body pulled out of the adhesive, and Figure 7 C is a front view showing the tool body being immersed in the adhesive. FIG. 7D is a plan view showing the applied state, and a front view showing the state in which the semiconductor element is pressed against the adhesive layer on the surface to be coated. 5... Surface to be coated, 34... Tool base, 38,
39, 38'... Projection body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の突出体を、それらの突出体の先端面が同
一平面上にあるようにツール基台から突出させた
ことからなり、上記突出体は被塗布面の面積の範
囲内にあるように配設されていることを特徴とす
る接着剤スタンプ用ツール。 Consisting of a plurality of protrusions protruding from the tool base so that the tip surfaces of the protrusions are on the same plane, and the protrusions are arranged so that they are within the area of the surface to be coated. An adhesive stamp tool characterized by:
JP1425385U 1985-02-05 1985-02-05 Pending JPS61131832U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1425385U JPS61131832U (en) 1985-02-05 1985-02-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1425385U JPS61131832U (en) 1985-02-05 1985-02-05

Publications (1)

Publication Number Publication Date
JPS61131832U true JPS61131832U (en) 1986-08-18

Family

ID=30499002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1425385U Pending JPS61131832U (en) 1985-02-05 1985-02-05

Country Status (1)

Country Link
JP (1) JPS61131832U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101147613B1 (en) * 2009-08-13 2012-05-23 송병국 The automatic painting system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643160B2 (en) * 1976-06-09 1981-10-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5643160B2 (en) * 1976-06-09 1981-10-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101147613B1 (en) * 2009-08-13 2012-05-23 송병국 The automatic painting system

Similar Documents

Publication Publication Date Title
JPS61131832U (en)
JPS63131739U (en)
JPS58190916U (en) cosmetic tools
JPS6241002U (en)
JPH0177951U (en)
JPS6173203U (en)
JPS61174601U (en)
JPH0379862U (en)
JPS63103506U (en)
JPH02125945U (en)
JPS63131357U (en)
JPS63179810U (en)
JPH038376U (en)
JPS61200232U (en)
JPS6069624U (en) Anti-slip tape made from fish skin
JPS6123912U (en) puff
JPS61105177U (en)
JPS6194747U (en)
JPS61114475U (en)
JPS63158260U (en)
JPH0417061U (en)
JPS60182134U (en) Surface material
JPH02146600U (en)
JPS5948237U (en) hairbrush
JPS5819049U (en) wall joint material