JPS63122181A - Light-emitting and-receiving module - Google Patents
Light-emitting and-receiving moduleInfo
- Publication number
- JPS63122181A JPS63122181A JP61267557A JP26755786A JPS63122181A JP S63122181 A JPS63122181 A JP S63122181A JP 61267557 A JP61267557 A JP 61267557A JP 26755786 A JP26755786 A JP 26755786A JP S63122181 A JPS63122181 A JP S63122181A
- Authority
- JP
- Japan
- Prior art keywords
- light
- window glass
- inner size
- holding member
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000005357 flat glass Substances 0.000 claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims abstract description 14
- 238000005476 soldering Methods 0.000 abstract description 6
- 230000008602 contraction Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract 7
- 238000000034 method Methods 0.000 abstract 4
- 239000002184 metal Substances 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔注東上の利用分野〕
本発明は、発覚及び受光モジュールのメタル固定におい
て、メタル固定時の熱によりて発覚及び受光パッケージ
の窓ガラスが割れないようにした発・受光モジュールに
関する。[Detailed Description of the Invention] [Field of Application of Notebook] The present invention is a light emitting/receiving module that prevents the window glass of the detection and light reception package from breaking due to the heat generated when the metal is fixed when the detection and light reception module is fixed to metal. Regarding modules.
光を通すための窓ガラスを有する発光及び受光パッケー
ジを保持部材で保持して、発光及び受光モジ島−ル（以
下発・受光モジュールという）が作られる。A light emitting and light receiving module (hereinafter referred to as a light emitting and receiving module) is created by holding a light emitting and light receiving package having a window glass for transmitting light with a holding member.
最近では、上記光モジュールの信頼性を高めるために、
光パッケージと保持部材との接合には、半田や＃！接等
のメタル固定が行なわれるようになってきた。Recently, in order to increase the reliability of the above optical module,
Solder or #! is used to join the optical package and the holding member. Metal fixings such as metal fittings have come to be used.
このメタル固定は、相当の熱が発生するので、この熱に
よって光パッケージの窓ガラスが割れないようＫする必
要がある。This metal fixing generates a considerable amount of heat, so it is necessary to protect the window glass of the optical package from breaking due to this heat.
従来のメタル固定忙よる光モジュールは、ｖｐ、ｓ図に
示すように、窓ガラス３を有する発・受光素子気密パッ
ケージ１を、保持部材２に挿入し、半田４にて接合する
ようにしていた。In a conventional metal-fixed optical module, a light emitting/light receiving element airtight package 1 having a window glass 3 is inserted into a holding member 2 and bonded with solder 4, as shown in figures VP and S. .
即ち、保持部材２の内側寸法は、発・受光素子気密パッ
ケージ１の外形寸法に合せて、半田式となる一定の隙間
ができるように加工され、この半田式全体に半田４を流
し込み接合するようにしていた。That is, the inner dimensions of the holding member 2 are processed to match the outer dimensions of the airtight package 1 for the light emitting/light receiving element, so that a certain gap is created for the solder type, and the solder 4 is poured over the entire solder type for bonding. I was doing it.
なお、この種の装置として関連するものには例えば特開
昭６１−２０９１１号公報が挙げられる。Note that related devices of this type include, for example, Japanese Patent Application Laid-Open No. 61-20911.
上記従来の半田固定に録して、発・受光素子気密パッケ
ージ１と保持部材２との間の隙間が小さくこの隙間全体
に半田４を流し込むようにしていたので、半田４或は保
持部材２の熱膨・脹及び収縮時に発生する応力が発・受
光素子気密パッケージ１の窓ガラス３付°近に加わり、
窓ガラス３が損傷して気密不良を起す可能性があるとい
う問題があった。In the above-mentioned conventional solder fixing, the gap between the light emitting/light receiving element airtight package 1 and the holding member 2 is small and the solder 4 is poured into the entire gap. Stress generated during thermal expansion, expansion, and contraction is applied to the vicinity of the window glass 3 of the airtight package 1 of the light emitting/light receiving element.
There was a problem in that the window glass 3 could be damaged, resulting in poor airtightness.
本発明は、上記問題を解決した発・受光モジュールを提
供せんとするものである。The present invention aims to provide a light emitting/receiving module that solves the above problems.
上記問題点を解決するために本発明は、保持部材の内側
寸法を大きい部分と小さい部分に形成する。そしてこの
保持部材の内側寸法が大きい側に窓ガラス側が位置する
ように発光或は受光素子のパッケージを保持部材に押入
し、保持部材の内側寸法の、小さい部分を半田で固定す
るよ５Ｋしたもである。In order to solve the above-mentioned problems, the present invention forms a holding member with a large inner dimension and a small inner dimension. Then, the package of the light emitting or light receiving element was pushed into the holding member so that the window glass side was located on the side with the larger inner dimension of the holding member, and the smaller inner dimension of the holding member was fixed with solder for 5K. It is.
このように構成することにより、発光或は受光素子パッ
ケージの窓ガラス付近は、保持部材との間に空隙ができ
、半田固定の際における半田及び保持部材の熱膨張及び
収縮時の応力は窓ガラスに働かない。With this configuration, a gap is created between the light emitting or light receiving element package near the window glass and the holding member, and the stress caused by thermal expansion and contraction of the solder and the holding member during soldering is absorbed by the window glass. do not work.
以下本発明の一実施例について詳細に説明する。 An embodiment of the present invention will be described in detail below.
第１図において、５は窓ガラス・７を有する発光或は受
光素子気密パッケージである。６は保持部材であり、そ
の内側は、大きい内側寸法９と小さい内情寸法１０にて
形成されている。そして、発光或は受光素子パッケージ
５は、その窓ガラス７側が大きい内側寸法９に位置する
ように保持部材６に挿入され、小さい内側寸法１００部
分を半田固定する。In FIG. 1, reference numeral 5 denotes a light-emitting or light-receiving element airtight package having a window glass 7. Reference numeral 6 denotes a holding member, the inside of which is formed with a large internal dimension 9 and a small internal dimension 10. The light emitting or light receiving element package 5 is inserted into the holding member 6 so that the window glass 7 side is located at the larger inner dimension 9, and the smaller inner dimension 100 is fixed by soldering.
このようにすることにより、窓ガラス７の付近と保持部
材６の大きい内側寸法９ｓ分との間に空隙ができる。By doing so, a gap is created between the vicinity of the window glass 7 and the large inner dimension 9s of the holding member 6.
この空隙により、半田固定時における半田８及び保持部
材６の熱膨張及び収縮時に発生する応力は、窓ガラス７
の付近には加わらない。Due to this gap, the stress generated during thermal expansion and contraction of the solder 8 and the holding member 6 during solder fixation is absorbed by the window glass 7.
It does not join near.
第２図に示すものは、発光モジュールに本発明を適用し
たものであり、第１図と同一部分は同一符号をもって示
し、その説明は省略する。なお、図中１１は結合用レン
ズ、１２は光ファイバ、１５はレンズファイバ保持ケー
スである。What is shown in FIG. 2 is a light emitting module to which the present invention is applied, and the same parts as in FIG. In the figure, 11 is a coupling lens, 12 is an optical fiber, and 15 is a lens fiber holding case.
以上詳述した通り本発明に係る発・受光モジュールによ
れば、保持部材の内側を大きな内側寸法と小さな内側寸
法にて形成し、発光或は受光素子パッケージの窓側な大
きな内側寸法側に位置するように挿入し、小さな内側寸
法部分を半田固定するようにしたので、半田固定時にお
ける半田及び保持部材の熱膨張及び収縮時に発生する応
力は窓ガラス部に加わらない。As detailed above, according to the light emitting/receiving module according to the present invention, the inner side of the holding member is formed with a large inner dimension and a small inner dimension, and the holding member is located on the large inner dimension side such as the window side of the light emitting or light receiving element package. Since the window glass portion is inserted as shown in FIG.
これにより、窓ガラスの損傷はなく元パッケージの気密
性が保証され信頼性の高い光モジ為−ルにすることがで
き優れた効果を有する。As a result, the window glass is not damaged, the airtightness of the original package is guaranteed, and a highly reliable optical module can be obtained, which has an excellent effect.
又、窓ガラスの損傷がないので、メタル固定による不良
品の発生はなく、かつメタル固定が容易であるので、生
産性を大幅に向上することかできた０In addition, since there is no damage to the window glass, there is no chance of defective products due to metal fixing, and since metal fixing is easy, productivity can be greatly improved.
餓１図及び餓２図は本発明の一実施例であり、維
ｗＩ、１図は発・受光モジ１−ルの継断面図、８６ｇ２
図は本発明を発光モジ晶−ルに適用した場合の縦断面図
である。第５図は従来の発・受光モジュールの縦断面図
である。
５・・・発・受光素子気密パッケージ（元パッケージ］
６・・・保持部材 ７・・・窓ガラス８・・・
半１） ９・・・大きい内側寸法１０・・・
小さい内側寸法
【７Fig. 1 and Fig. 2 show an embodiment of the present invention;
The figure is a longitudinal sectional view of the case where the present invention is applied to a light emitting module crystal rule. FIG. 5 is a longitudinal sectional view of a conventional light emitting/receiving module. 5... Emitting/light receiving element airtight package (original package) 6... Holding member 7... Window glass 8...
Half 1) 9...Large inner dimension 10...
Small inner dimensions [7
Claims (1)
ッケージを保持部材で保持した発・受光モジュールにお
いて、上記保持部材の内側寸法を大きい部分と小さい部
分に形成し、該保持部材の内側寸法が大きい側に窓ガラ
ス側が位置するように発光或は受光素子のパッケージを
保持部材に挿入し、保持部材の内側寸法の小さい側を半
田で固定したことを特徴とする発・受光モジュール。1. In a light emitting/light receiving module in which a light emitting or light receiving element airtight package having a window glass through which light passes is held by a holding member, the inner dimensions of the holding member are formed into a large part and a small part, and the inner dimensions of the holding member are A light-emitting/light-receiving module characterized in that a package of a light-emitting or light-receiving element is inserted into a holding member so that the window glass side is located on the side with the larger side, and the side of the holding member with the smaller inner dimension is fixed with solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267557A JPS63122181A (en) | 1986-11-12 | 1986-11-12 | Light-emitting and-receiving module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267557A JPS63122181A (en) | 1986-11-12 | 1986-11-12 | Light-emitting and-receiving module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63122181A true JPS63122181A (en) | 1988-05-26 |
Family
ID=17446462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61267557A Pending JPS63122181A (en) | 1986-11-12 | 1986-11-12 | Light-emitting and-receiving module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63122181A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1300711A2 (en) * | 2001-09-26 | 2003-04-09 | NEC Compound Semiconductor Devices, Ltd. | Semiconductor device for optically coupling semiconductor light-emitting device to optical fiber |
-
1986
- 1986-11-12 JP JP61267557A patent/JPS63122181A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1300711A2 (en) * | 2001-09-26 | 2003-04-09 | NEC Compound Semiconductor Devices, Ltd. | Semiconductor device for optically coupling semiconductor light-emitting device to optical fiber |
| EP1300711A3 (en) * | 2001-09-26 | 2004-05-12 | NEC Compound Semiconductor Devices, Ltd. | Semiconductor device for optically coupling semiconductor light-emitting device to optical fiber |
| US6905262B2 (en) | 2001-09-26 | 2005-06-14 | Nec Compound Semiconductor Devices, Ltd. | Semiconductor device for optically coupling semiconductor light-emitting device to optical fiber |
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