JPS63120745A - Treating solution for molded product of fluororesin - Google Patents
Treating solution for molded product of fluororesinInfo
- Publication number
- JPS63120745A JPS63120745A JP26714586A JP26714586A JPS63120745A JP S63120745 A JPS63120745 A JP S63120745A JP 26714586 A JP26714586 A JP 26714586A JP 26714586 A JP26714586 A JP 26714586A JP S63120745 A JPS63120745 A JP S63120745A
- Authority
- JP
- Japan
- Prior art keywords
- fluororesin
- metallic sodium
- soln
- molded product
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims abstract description 22
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 22
- 239000011734 sodium Substances 0.000 claims abstract description 22
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims abstract description 16
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- 238000009835 boiling Methods 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 8
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 8
- 239000011259 mixed solution Substances 0.000 claims description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052731 fluorine Inorganic materials 0.000 abstract description 5
- 239000011737 fluorine Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 238000006115 defluorination reaction Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 19
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229910000831 Steel Inorganic materials 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910001868 water Inorganic materials 0.000 description 4
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004334 fluoridation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はフッ素樹脂成形品の表面を脱フッ素するための
処理液に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a treatment liquid for defluorinating the surface of a fluororesin molded article.
（従来の技術）
一般にフッ素樹脂は、撥水、撥油、非粘着性が高く、離
形性を望むものにおいて広く用いられているが、その反
面接着が非常に困難であることから、その用途に制約を
受けていた。(Prior art) Generally, fluororesins have high water repellency, oil repellency, and non-adhesive properties, and are widely used in products requiring mold releasability. was constrained by.
特に近年半導体製造装置の薬液槽や純水槽或はパイプな
どに金属非含有性・表面平滑性等の特性を仔するために
用いられているが、該フッ素樹脂は高価で剛性を持たな
いので鋼板やＦＲＰにライニングして用いるのが好まし
いが、上記のように接着性が悪くライニングが良好に行
えなかった。In recent years, in particular, it has been used to give properties such as metal-free properties and surface smoothness to chemical liquid tanks, pure water tanks, and pipes in semiconductor manufacturing equipment, but since the fluororesin is expensive and lacks rigidity, steel plates are used. It is preferable to use it by lining it with or FRP, but as mentioned above, the lining could not be done well due to poor adhesion.
そこで従来は、フッ素樹脂からなる板材などの成形品表
面を脱フツ素処理して、接着性を高めるごとくしている
。Conventionally, therefore, the surface of molded products such as plates made of fluororesin is treated to remove fluorine to improve adhesion.
この脱フツ素処理としては、例えば液体アンモニアに１
％の金属ナトリウムを添加して調合した処理液を用いる
アンモニア法、水と苛性ソーダとアルコールを３：１：
１の割合で混合して調合した処理液を用いる苛性ソーダ
法、或はテトラヒドロフラン（ＴＨＦ）ｉＮにナフタリ
ン１２８ｇと金属ナトリウム２３ｇを添加して調合した
処理液を用いるナフタリン法などがある。For this defluoridation treatment, for example, 1
Ammonia method using a treatment solution prepared by adding % metallic sodium, water, caustic soda and alcohol at 3:1:
The caustic soda method uses a treatment solution prepared by mixing 1:1, and the naphthalene method uses a treatment solution prepared by adding 128 g of naphthalene and 23 g of metallic sodium to tetrahydrofuran (THF) iN.
（発明が解決しようとする問題点）
処で上記したアンモニア法や苛性ソーダ法は、管理設備
、環境設備の点で実用的ではなく、一般にはナフタリン
法が採用されているが、この場合にあっても次のような
問題がある。(Problems to be solved by the invention) The ammonia method and caustic soda method mentioned above are not practical in terms of management equipment and environmental equipment, and the naphthalene method is generally adopted, but in this case, There are also the following problems.
即ちＴＨＦは沸点が低く揮発性が極めて高く、フッ素樹
脂成形品の表面に塗布して脱フツ素処理するとき、ＴＨ
Ｆがすぐに蒸発して金属ナトリウムがフッ素樹脂中のフ
ッ素と結合する前に空気中の水分と結合し、Ｎ ａ Ｏ
Ｈに変化し、所謂脱フッ素が不充分であったりバラツキ
が大きく、接着性を充分に高めることができず、またＴ
ＨＦは引火点が−１７，２℃と非常に低く、取扱に注意
を要するものであった。In other words, THF has a low boiling point and extremely high volatility, so when applying it to the surface of a fluororesin molded product for defluoridation treatment, THF
F quickly evaporates and metal sodium combines with moisture in the air before combining with fluorine in the fluororesin, forming N a O
T
HF has a very low flash point of -17.2°C and must be handled with care.
（問題点を解決するための手段）
本発明は以上のごとき問題点に注目して発明したもので
あって、沸点が非常に高く、かつ金属ナトリウムと反応
しない溶液、例えば１．３−ジメチル−２−イシダゾリ
シン（ＤＭＩ）、ジメチルアセトアシド（ＤＭＡＡ）
、キシレン、トルエン等を用いた点に特徴を有し、これ
らの単独若しくは混合の溶液に金属ナトリウムとナフタ
リンとを添加して調合したものである。(Means for Solving the Problems) The present invention was devised by paying attention to the above-mentioned problems. 2-Isidazolysine (DMI), dimethylacetoacid (DMAA)
It is characterized by the use of , xylene, toluene, etc., and is prepared by adding metallic sodium and naphthalene to a solution of these alone or in combination.
（作用）
上記した構成によれば、沸点が高く金属ナトリウムと反
応しない溶液を用いることから、処理作業時の液蒸発が
非常に少なく、金属す） ＋Ｊウムの空気中水分との結
合番阻止することができ、その活性化を損なうようなこ
とがなく、この金属ナトリュウムによるフッ素樹脂成形
品の表面脱フツ素処理が確実に行われ、その接着性を高
め得る。(Function) According to the above configuration, since a solution having a high boiling point and which does not react with metal sodium is used, there is very little liquid evaporation during treatment work, and the combination of metal sodium +J with moisture in the air is prevented. The surface of the fluororesin molded product can be reliably defluorinated with this metallic sodium without impairing its activation, and its adhesion can be improved.
（実施例）
本発明の処理液として用いられる溶液は、沸点が高く金
属ナトリウムと反応しないもの、例えばＤＭ１１ＤＭＡ
Ａ１キシレン、トルエン等が挙げ・られる。(Example) The solution used as the treatment solution of the present invention has a high boiling point and does not react with metallic sodium, such as DM11DMA.
A1 xylene, toluene, etc. are mentioned.
これらの溶液の沸点は２２６°Ｃ，２０６℃、１４４℃
、１１１℃であり、また引火点は１０７°Ｃ１１６６°
Ｃ１１７℃、５℃であり、ＴＨＦの６６℃及び−１７，
２°Ｃより遥に高い沸点と引火点を有している。そして
、該溶液には塩素基、水酸基を有しておらず、金属ナト
リウムと反応することはない。これらの溶液のうち、Ｄ
ＭＩとＤＭＡＡは沸点、引火点に他の溶液に比べて極端
に高く、本発明の実施例において最も好ましいものとし
て採用される。The boiling points of these solutions are 226°C, 206°C, and 144°C.
, 111°C, and the flash point is 107°C 1166°
C117℃, 5℃, THF 66℃ and -17,
It has a boiling point and flash point much higher than 2°C. The solution does not have chlorine groups or hydroxyl groups and does not react with metallic sodium. Among these solutions, D
MI and DMAA have extremely high boiling points and flash points compared to other solutions, and are most preferably employed in the embodiments of the present invention.
上記溶液の内、一種若しくは数種混合の溶液に、あるい
はＴＨＦとの混合溶液に金属ナトリウムとナフタリンと
を徐々に加え、２４時間放置した後、充分に撹拌して調
合するのである。Metallic sodium and naphthalene are gradually added to one or a mixture of the above solutions, or to a mixed solution with THF, left for 24 hours, and then thoroughly stirred to prepare the solution.
しかして上記のごとく調合された処理液によりフッ素樹
脂成形品、例えばフッ素樹脂板（りの片側面を脱フツ素
処理するのであって、第２図に示すごとくフッ素樹脂板
（１）をロールコータ（２）に供給して、該樹脂板（１
）の片面に上記した本発明の処理液（３）を塗布するの
である。One side of a fluororesin molded product, such as a fluororesin plate, is defluorinated using the treatment solution prepared as described above, and the fluororesin plate (1) is coated with a roll coater as shown in (2) and the resin plate (1
) is coated with the above-mentioned treatment liquid (3) of the present invention.
これによってフッ素樹脂板（＋）における表面のフッ素
が上記処理液（３）の金属ナトリュウムと反応して脱フ
ッ素されるのである。またフッ素樹脂板の一部のみを脱
フッ素するには、本発明処理液を該部分に滴下塗布すれ
ばよいことはいうまでもない。As a result, the fluorine on the surface of the fluororesin plate (+) reacts with the metal sodium of the treatment liquid (3) and is defluorinated. It goes without saying that in order to defluorine only a part of the fluororesin plate, the treatment liquid of the present invention may be applied dropwise to the part.
Ｉ−記のように脱フツ素処理された樹脂板（１）はその
接着性が高（、エポキシ系或はアクリル系等の接着剤に
より適宜の材料、例えば銅版やＦＲＰ板に強固に接着す
ることができる。また上記脱フツ素処理は、前記処理液
（３）を樹脂板（りの表面に塗布するだけであるから、
特別な装置や設備を必要とせず、簡単容易にかつ安価に
実施することができるものである。The resin board (1) that has been treated to remove fluorine as shown in I- has high adhesive properties (it can be firmly adhered to an appropriate material such as a copper plate or FRP board using an epoxy or acrylic adhesive). In addition, since the above-mentioned fluoridation treatment simply applies the treatment liquid (3) to the surface of the resin plate,
It does not require any special equipment or equipment and can be implemented easily and inexpensively.
次に、本発明の具体例とＪ Ｉ ５Ｋ８８５０の接着試
験法による接着試験の結果とについて説明する。Next, specific examples of the present invention and the results of an adhesion test according to the adhesion test method of J I 5K8850 will be explained.
使用するフッ素樹脂板としては、ニフッ化ビニリデン樹
脂板（タキロン株式会社製、ＫＦ板）を用い、該ＫＦ板
の片面をサンドペーパー＃１２０により縦横両方向に磨
き、アセトンで洗浄した後、第１表のごとき割合とした
本発明の処理液を塗布してブラッシングを行い、約１分
後にアセトンで拭き取り水洗いして試験片とした。The fluororesin board used was a vinylidene difluoride resin board (manufactured by Takiron Co., Ltd., KF board). One side of the KF board was polished in both length and width directions with #120 sandpaper, washed with acetone, and then The treatment liquid of the present invention was applied in the following proportions and brushed, and after about 1 minute, it was wiped off with acetone and washed with water to prepare a test piece.
一方、鋼板を脱脂後サンドペーパー＃１２０で磨いた後
、アセントで抜き取り試験片とした。On the other hand, after degreasing the steel plate and polishing it with #120 sandpaper, it was sampled using Ascent and used as a test piece.
そしてこれらの試験片をエポキシ系の接着剤、ボンドＥ
Ｄ−１００（コニシ株式会社製）により接着した。また
、前記と同様に処理したＫＦ板にエポキシ系プライマー
処理剤リポキシＲＴ−８３３（コニシ株式会社製）を用
いてプライマー処理を行い、その上に＃５００ガラスマ
ットを当てポリエステル樹脂を含浸硬化させ接着した。These specimens were then glued with an epoxy adhesive, Bond E.
Adhesion was made using D-100 (manufactured by Konishi Co., Ltd.). In addition, the KF board treated in the same manner as above was subjected to primer treatment using an epoxy primer treatment agent Ripoxy RT-833 (manufactured by Konishi Co., Ltd.), and a #500 glass mat was placed on top of it, impregnated with polyester resin and cured, and bonded. did.
その後引張試験機にて引張テストを行い接着強度を測定
した処、第１表のごとき試験結果を得た。Thereafter, a tensile test was carried out using a tensile tester to measure the adhesive strength, and the test results shown in Table 1 were obtained.
また、上記のエポキシ系接着剤に代えて二液混合型のア
クリル系接着剤、ボンドコニセットＡＧ−１００（コニ
シ株式会社製）を用い、ＫＦ板と鋼板での接着処理時の
温度及び湿度を変えて、常温での接着強度を試験した処
、第２表のごとき試験結果を得た。In addition, we used a two-component mixed acrylic adhesive, Bond Koniset AG-100 (manufactured by Konishi Co., Ltd.) instead of the epoxy adhesive mentioned above, to control the temperature and humidity during the bonding process between KF plate and steel plate. Instead, the adhesive strength at room temperature was tested, and the test results shown in Table 2 were obtained.
なお第１表において、従来品ＡはＫＦ板にサンドペーパ
ーで磨きを掛けたものであり、従来品Ｂは磨きを行わな
いものである。In Table 1, conventional product A is a KF plate polished with sandpaper, and conventional product B is not polished.
上記第１．２表から明らかなごと〈従来品Ａ及びＢはい
ずれも、本発明の実施例ｌｌｌｌ１１ｒＶに比較して剪
断強度が低（、シかも温度及び湿度が変わってもその関
係は変わらず、また接着部の剥離が、従来品にあっては
ＫＦ板側で発生し、本発明にあっては鋼販側で発生して
いることから、本発明では鋼販に対する接着性能の良い
接着剤を用いることにより、フッ素樹脂板と鋼販との接
着をより一層確実強固に行わせ得ることが分かる。It is clear from Table 1.2 above that both conventional products A and B have a lower shear strength than Example 1111rV of the present invention. In addition, peeling of the adhesive part occurs on the KF plate side in the conventional product, and on the steel plate side in the present invention, so in the present invention, an adhesive with good adhesive performance for the steel plate is used. It can be seen that by using the fluororesin plate, the adhesion between the fluororesin plate and the steel sheet can be made even more reliable and strong.
さらに、実施例ＩＩＩは実施例ＩＩＩＩＶより剪断強度
が高＜、ＤＭＩ又はＤＭＡＡにＴＨＦを混合した溶液に
よる接着がＤＭＩ又はＤＭＡＡ単独の処理液より強固に
行われることがわかる。これはＴＨＥにより金属ナトリ
ウムが活性化されるためであろうと思われる。Furthermore, it can be seen that Example III has a higher shear strength than Example IIIIV, and the adhesion by a solution of DMI or DMAA mixed with THF is stronger than that of a treatment solution of DMI or DMAA alone. This is probably because metallic sodium is activated by THE.
（発明の効果）
以上説明したごとく本発明によるフッ素樹脂成形品の処
理液は、沸点が高く金属す） ＩＪウムと反応しない溶
液を用いるものであるから、フッ素樹脂成形品の表面に
塗布したときの液蒸発が非常に少なく、金属ナトリュウ
ムの空気中水分との結合を低く抑え、所謂金属す） Ｉ
Ｊニウムの活性化を損なうようなことがなく、従って前
記フッ素樹脂成形品の表面脱フツ素処理を確実に行って
、その接着性を高め得るに至ったのである。また上記の
ごとく本発明に用いる溶液は揮発性が低（、かつ引火点
の高い溶液を用いることにより、処理液の経時変化が少
なく、脱フツ素処理を安定よく行わ得るのであり、しか
も揮発及び引火を防止するための特別な設備を必要とせ
ず、設備コストやランニングコストの引き下げを図るこ
とができ、また取り扱いも非常に楽くになる等の実用的
な作用効果を奏するものである。(Effects of the Invention) As explained above, the treatment liquid for fluororesin molded articles according to the present invention uses a solution that has a high boiling point and does not react with metals. There is very little liquid evaporation, and the combination of metal sodium with moisture in the air is kept low, making it possible to reduce the so-called metal sodium content.
The activation of J-nium is not impaired, and therefore, the surface of the fluororesin molded article can be reliably defluorinated and its adhesiveness can be improved. Furthermore, as mentioned above, the solution used in the present invention has low volatility (and has a high flash point), so that the treatment solution changes less over time, and the defluorination treatment can be performed stably. It does not require special equipment to prevent ignition, reduces equipment costs and running costs, and has practical effects such as being extremely easy to handle.
第１図は本発明の実施例を示す縦断面図、第２・図は処
理液の塗布説明図である。
（１）・・・フッ素樹脂製板体、（３）・・・処理液、
イー゛ムニ゛ＩFIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, and the second figure is an explanatory view of applying a treatment liquid. (1)...Fluororesin plate, (3)...Treatment liquid,
E-Muni I
Claims (2)
与するための処理液であって、沸点が高く金属ナトリウ
ムと反応しない単独若しくは混合の溶液に金属ナトリウ
ムとナフタリンとを添加して調合したことを特徴とする
フッ素樹脂成形品の処理液。(1) A treatment liquid for defluoridating the surface of fluororesin molded products and imparting adhesive properties, prepared by adding metallic sodium and naphthalene to a single or mixed solution that has a high boiling point and does not react with metallic sodium. A processing liquid for fluororesin molded products.
くは混合の溶液にテトラヒドロフランを混合したことを
特徴とする特許請求の範囲第１項に記載のフッ素樹脂成
形品の処理液。(2) The treatment liquid for fluororesin molded articles according to claim 1, characterized in that tetrahydrofuran is mixed into a single or mixed solution that has a high boiling point and does not react with metallic sodium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267145A JPH07121993B2 (en) | 1986-11-10 | 1986-11-10 | Fluorocarbon resin molded product processing liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267145A JPH07121993B2 (en) | 1986-11-10 | 1986-11-10 | Fluorocarbon resin molded product processing liquid |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63120745A true JPS63120745A (en) | 1988-05-25 |
| JPH07121993B2 JPH07121993B2 (en) | 1995-12-25 |
Family
ID=17440707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61267145A Expired - Lifetime JPH07121993B2 (en) | 1986-11-10 | 1986-11-10 | Fluorocarbon resin molded product processing liquid |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07121993B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5411629A (en) * | 1992-02-03 | 1995-05-02 | Motorola, Inc. | Method for roughening surface of halocarbon film |
| JP2002198017A (en) * | 2000-12-26 | 2002-07-12 | Honda Motor Co Ltd | Gasket for lithium cell |
| JP2007330885A (en) * | 2006-06-14 | 2007-12-27 | Takenaka Komuten Co Ltd | Fluoro-resin membrane surface treatment method |
| JP2010243245A (en) * | 2009-04-02 | 2010-10-28 | Tokyo Keiso Co Ltd | Ultrasonic flow meter |
| WO2015166812A1 (en) * | 2014-05-02 | 2015-11-05 | 住友電気工業株式会社 | Sodium ion secondary cell |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5453173A (en) * | 1977-10-04 | 1979-04-26 | Kawaken Fine Chem Co Ltd | Agent for treating the surface of fluorine resin molded products |
-
1986
- 1986-11-10 JP JP61267145A patent/JPH07121993B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5453173A (en) * | 1977-10-04 | 1979-04-26 | Kawaken Fine Chem Co Ltd | Agent for treating the surface of fluorine resin molded products |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5411629A (en) * | 1992-02-03 | 1995-05-02 | Motorola, Inc. | Method for roughening surface of halocarbon film |
| JP2002198017A (en) * | 2000-12-26 | 2002-07-12 | Honda Motor Co Ltd | Gasket for lithium cell |
| JP4516206B2 (en) * | 2000-12-26 | 2010-08-04 | 本田技研工業株式会社 | Lithium battery gasket |
| JP2007330885A (en) * | 2006-06-14 | 2007-12-27 | Takenaka Komuten Co Ltd | Fluoro-resin membrane surface treatment method |
| JP2010243245A (en) * | 2009-04-02 | 2010-10-28 | Tokyo Keiso Co Ltd | Ultrasonic flow meter |
| WO2015166812A1 (en) * | 2014-05-02 | 2015-11-05 | 住友電気工業株式会社 | Sodium ion secondary cell |
| JP2015213012A (en) * | 2014-05-02 | 2015-11-26 | 住友電気工業株式会社 | Sodium ion secondary battery |
| CN106133982A (en) * | 2014-05-02 | 2016-11-16 | 住友电气工业株式会社 | Sodium ion secondary battery |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07121993B2 (en) | 1995-12-25 |
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