JPS63118693U - - Google Patents
Info
- Publication number
- JPS63118693U JPS63118693U JP1044087U JP1044087U JPS63118693U JP S63118693 U JPS63118693 U JP S63118693U JP 1044087 U JP1044087 U JP 1044087U JP 1044087 U JP1044087 U JP 1044087U JP S63118693 U JPS63118693 U JP S63118693U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- gasket
- heat sensor
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 6
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000010276 construction Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000012856 packing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Fire-Detection Mechanisms (AREA)
Description
第１図は本考案の一実施例の分解斜視図、第２
図は同上の熱感知素子の取付状態を示す断面図、
第３図は同上のパツキンへの熱感知素子の取付説
明図である。
１はベース、２はカバー、３は熱感知素子、４
はプリント基板、５はパツキン、６はクリツプば
ね、１５は熱感知穴、１８は貫通孔である。
Fig. 1 is an exploded perspective view of one embodiment of the present invention;
The figure is a cross-sectional view showing the installation state of the heat sensing element same as above.
FIG. 3 is an explanatory diagram of attaching the heat sensing element to the packing same as above. 1 is the base, 2 is the cover, 3 is the heat sensing element, 4
1 is a printed circuit board, 5 is a packing, 6 is a clip spring, 15 is a heat sensing hole, and 18 is a through hole.
Claims (1)
知素子をプリント基板上に立設し、ベースに被着
してケースを形成するカバーに穿設された熱感知
穴にパツキンを嵌合し、上記パツキンの貫通孔に
先端のサーミスタを貫通させて熱感知素子を熱感
知穴内に挿入してプリント基板をカバーに取り付
け、上記カバーをベースに被着してベースとカバ
ーにてプリント基板を挟持して固定して成ること
を特徴とする半導体式熱感知器。 (2) 上記プリント基板の下面に接続ピンを突設
し、上記接続ピンをベースの底面に穿設された挿
通孔に挿通し、この接続ピンのベースの下面側か
らの突出部を天井などの造営面への取付用の受け
台と電気的及び機械的に接続するクリツプばねに
穿孔された挿入孔に挿入し、この接続ピン先端を
クリツプばねに半田付けしてプリント基板とクリ
ツプばねとの電気的な接続を行つて成ることを特
徴とする実用新案登録請求の範囲第１項記載の半
導体式熱感知器。 (3) 上記パツキンとして熱伝導度の低い材質の
ものを用いて成ることを特徴とする実用新案登録
請求の範囲第１項記載の半導体式熱感知器。 (4) 上記パツキンを熱感知穴に圧入して成るこ
とを特徴とする実用新案登録請求の範囲第１項記
載の半導体式熱感知器。 (5) 上記パツキンを接着剤にてカバーの熱感知
用孔内に取り付けて成ることを特徴とする実用新
案登録請求の範囲第１項記載の半導体式熱感知器
。[Scope of Claim for Utility Model Registration] (1) A rod-shaped heat sensing element with a thermistor attached to the tip is installed upright on a printed circuit board, and a heat sensor is installed in a cover that is attached to the base to form a case. Fit the gasket into the sensing hole, pass the thermistor at the tip through the through hole of the gasket, insert the heat sensing element into the heat sensing hole, attach the printed circuit board to the cover, and attach the cover to the base. A semiconductor heat sensor characterized by comprising a printed circuit board sandwiched and fixed between a cover and a printed circuit board. (2) Provide a connecting pin protruding from the bottom of the printed circuit board, insert the connecting pin into the insertion hole drilled in the bottom of the base, and connect the protruding part of the connecting pin from the bottom of the base to the ceiling, etc. Insert it into the insertion hole drilled in the clip spring that electrically and mechanically connects it to the cradle for mounting on the construction surface, and solder the tip of this connecting pin to the clip spring to connect the printed circuit board and the clip spring. 2. A semiconductor heat sensor according to claim 1, characterized in that the semiconductor heat sensor is formed by making a connection according to the following claims. (3) The semiconductor heat sensor according to claim 1, wherein the gasket is made of a material with low thermal conductivity. (4) A semiconductor heat sensor according to claim 1, characterized in that the gasket is press-fitted into a heat sensing hole. (5) The semiconductor heat sensor according to claim 1, wherein the gasket is attached to the heat sensing hole of the cover using an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987010440U JPH0731348Y2 (en) | 1987-01-27 | 1987-01-27 | Semiconductor thermal sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987010440U JPH0731348Y2 (en) | 1987-01-27 | 1987-01-27 | Semiconductor thermal sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63118693U true JPS63118693U (en) | 1988-08-01 |
| JPH0731348Y2 JPH0731348Y2 (en) | 1995-07-19 |
Family
ID=30796733
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987010440U Expired - Lifetime JPH0731348Y2 (en) | 1987-01-27 | 1987-01-27 | Semiconductor thermal sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0731348Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722307U (en) * | 1980-07-14 | 1982-02-05 | ||
| JPS6031698A (en) * | 1983-07-30 | 1985-02-18 | 松下電工株式会社 | Photoelectric smoke sensor |
-
1987
- 1987-01-27 JP JP1987010440U patent/JPH0731348Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722307U (en) * | 1980-07-14 | 1982-02-05 | ||
| JPS6031698A (en) * | 1983-07-30 | 1985-02-18 | 松下電工株式会社 | Photoelectric smoke sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0731348Y2 (en) | 1995-07-19 |
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