JPS6311738Y2 - - Google Patents

Description

[Detailed explanation of the invention] This invention uses a heat sink to which a transistor is fixed.
The present invention relates to a heat dissipation device that is effective when fixed to a molded product that is sensitive to high heat, such as a plastic cabinet of a television receiver.

The heat sink reaches a fairly high temperature due to the heat generated by the transistor, so it is not possible to directly fix the heat sink by using a thermoplastic molded product to prevent deformation. In most cases, a transistor and a heat sink are mounted on a printed circuit board, and the printed circuit board is fixed to a molded product. At this time, when there was no space to install a heat sink on the printed circuit board, the solution was to move other components outside the printed circuit board to create space, or to make the cabinet larger. In this way,
There was a problem in that this became a major obstacle when miniaturizing television receivers and the like.

The present invention eliminates the above-mentioned conventional drawbacks, and provides a heat dissipation device that can fix a heat dissipation plate to a molded product without causing any adverse effects due to heat, and can also effectively fix a transistor to the heat dissipation plate. The purpose is to provide.

An embodiment of the present invention will now be described with reference to the accompanying drawings.

A first embodiment is shown in FIGS. 1 to 3. FIG. 1 shows a heat sink, and FIG. 2 shows an insulating plate. In the figure, reference numeral 1 denotes a heat sink, and projections 3 and 4 for holding one end of the insulating plate 2 shown in FIG. 2 are integrally formed on both sides of the transistor fixing part. In order to prevent the bosses 6, 7 from coming into contact with the heat dissipation plate 1 when fixing them to the bosses 6, 7, relief holes 8 having a larger diameter than the bosses 6, 7 are formed. Further, 9 is a transistor fixing hole, and 10 and 11 are insulating plate fixing holes.

Also, insulating plates (insulating fibers, baked plates, etc.)
As shown in FIG. 2, each of the insulating plates 2 is provided with a fixing hole 12 approximately in the center and a fixing hole 13 at one end for fixing the insulating plate 2 to the heat sink 1.

In the above configuration, when fixing the heat sink 1 to the molded product 5, as shown in FIG. while inserting each into the gap,
A screw 14 whose other end passes through fixing holes 13, 10, 11,
It is fixed to the heat sink 1 at 15. On the other hand, the transistor 16 is fixed to the heat sink 1 with screws 17. At this time, since the protrusions 3 and 4 are located on both sides of the transistor 16, when tightening the screws, the transistor 16
rotation can be prevented.

Insulating plate 2 and transistor 16 as described above.
is fixed to the heat sink 1, the boss parts 6 and 7 of the molded product 5 are brought into contact with the insulating plate 2 through the escape hole 8 of the heat sink 1, and the insulating plate 2 is fixed to the boss with the screw 18 passing through the fixing hole 12. By fixing to the parts 6 and 7, the heat sink 1 is indirectly fixed to the molded product 5.

Here, as the insulating plate 2, one is used that has as low a thermal conductivity as possible, is sufficiently strong against heat, and can sufficiently support the heat dissipation plate 1 in terms of strength.
As described above, according to the configurations shown in FIGS. 1 to 3, the heat sink 1 can be fixed to the molded product 5 without the heat from the heat sink 1 affecting the molded product 5,
Deformation of the molded product 5 due to heat can be prevented. Furthermore, by forming the protrusions 3 and 4 on both sides of the fixed portion of the transistor 16, the transistor 1
Rotation of the transistor 16 when the transistor 6 is fixed can be prevented. Furthermore, by holding one end of the insulating plate 2 with the protrusions 3 and 4, the number of fixing screws can be reduced.

FIG. 4 shows another example of the heat sink 20. This is provided by dividing the protrusions 3 and 4 respectively.
Here, 21 and 22 are the protrusions 3, and 23 and 24 are the protrusions 4, respectively. Of course, the same effects as in the case of FIGS. 1 to 3 can be obtained.

FIG. 5 shows yet another embodiment. In this embodiment, the insulating plate 25 is formed in a U-shape so that the insulating plate 25 can be fixed to the heat sink 26 with one screw. Here, 27 and 28 indicate fixing holes. According to this embodiment, in addition to the effects obtained in FIGS. 1 to 3, there is an effect that the number of screws can be reduced.

As described above, according to the present invention, a plurality of protrusions are integrally provided on the heat sink, the insulating plate is fixed to the heat sink using the protrusions, and the insulating plate is brought into direct contact without touching the heat sink. By screwing the insulating plate to the boss portion of the molded product, the heat sink can be fixed without deforming the molded product due to heat, which is extremely advantageous for downsizing the product. In addition, by installing the protrusions on both sides of the transistor fixing part to hold the transistor,
The projection can prevent rotation of the transistor during transistor rotation. Furthermore, by processing the insulating plate into a U-shape and fixing it to the heat sink, the number of fixing screws used can be reduced, which is more practical.

[Brief explanation of drawings]

FIG. 1 is a perspective view of a heat radiating plate used in a heat radiating device according to an embodiment of the present invention, FIG. 2 is a perspective view of an insulating plate used in the device, and FIG. 3 is an exploded perspective view of the device. FIG. 4 is a perspective view showing another example of a heat sink;
FIG. 5 is a perspective view showing another example of the insulating plate. 1... Heat sink, 2... Insulating plate, 3, 4... Protrusion, 5... Molded product, 6, 7... Boss portion, 8... Relief hole, 9, 10, 11, 12, 13... fixing hole,
14, 15, 17, 18... screws, 16... transistors.

Claims (1)

[Scope of utility model registration request] A heat sink is provided with a plurality of protrusions for fixing the insulating plate and a large diameter hole that does not touch the boss portion of the molded product, and the transistor is fixed to the heat sink while being prevented from rotating by the plurality of protrusions. ,
A heat dissipation device, wherein the insulating plate is fixed to the boss portion at the position of the large diameter hole.