JPS63114087U - - Google Patents
Info
- Publication number
- JPS63114087U JPS63114087U JP681287U JP681287U JPS63114087U JP S63114087 U JPS63114087 U JP S63114087U JP 681287 U JP681287 U JP 681287U JP 681287 U JP681287 U JP 681287U JP S63114087 U JPS63114087 U JP S63114087U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic component
- engaging protrusion
- mounting
- clamping portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002788 crimping Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP681287U JPS63114087U (enExample) | 1987-01-19 | 1987-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP681287U JPS63114087U (enExample) | 1987-01-19 | 1987-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63114087U true JPS63114087U (enExample) | 1988-07-22 |
Family
ID=30789680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP681287U Pending JPS63114087U (enExample) | 1987-01-19 | 1987-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63114087U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08125079A (ja) * | 1994-10-25 | 1996-05-17 | Rohm Co Ltd | 半導体装置の放熱板取り付け構造 |
-
1987
- 1987-01-19 JP JP681287U patent/JPS63114087U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08125079A (ja) * | 1994-10-25 | 1996-05-17 | Rohm Co Ltd | 半導体装置の放熱板取り付け構造 |