JPS63111706A - Method for forming electrode film of dielectric resonator - Google Patents
Method for forming electrode film of dielectric resonatorInfo
- Publication number
- JPS63111706A JPS63111706A JP25880586A JP25880586A JPS63111706A JP S63111706 A JPS63111706 A JP S63111706A JP 25880586 A JP25880586 A JP 25880586A JP 25880586 A JP25880586 A JP 25880586A JP S63111706 A JPS63111706 A JP S63111706A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- electrode film
- electrode
- film
- dielectric resonator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 30
- 238000009713 electroplating Methods 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- 238000007772 electroless plating Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract 3
- 239000002253 acid Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 6
- 239000002003 electrode paste Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- CMMUKUYEPRGBFB-UHFFFAOYSA-L dichromic acid Chemical compound O[Cr](=O)(=O)O[Cr](O)(=O)=O CMMUKUYEPRGBFB-UHFFFAOYSA-L 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000010020 roller printing Methods 0.000 description 1
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はマイクロ波等の誘電体共振器の電極膜形成方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of forming an electrode film of a dielectric resonator for microwave or the like.
従来の技術
従来、この種の波誘電体共振器は、円筒の誘電体共振器
の内周面外周面に電極膜を形成し、内導体、外導体を有
する死波長の同軸ＴＥＭ共振器が実用化されている。こ
の誘電体共振器の斜視図及び断面図を第２図ム、Ｂに示
し、１は誘電体セラミック素子、２は電極膜である。電
極膜は内導体電極膜２１Ｌ、外導体電極膜２ｂ、さらに
、内導体電極２ａと外導体電極２ｂとを接続させる側面
電極２Ｃ１また、共振器の周波数を調整するために設け
られパターン状の側面電極２ｄから構成される０
従来、この種の誘電体共振器の電極形成方法は、銀電極
ペーストを共振器の内面に筆塗り、外面にローラ印刷、
側面にスクリーン印刷して、電極ペーストを焼付する。Conventional technology Conventionally, in this type of wave dielectric resonator, an electrode film is formed on the inner peripheral surface and outer peripheral surface of a cylindrical dielectric resonator, and a dead-wavelength coaxial TEM resonator having an inner conductor and an outer conductor has been put into practical use. has been made into A perspective view and a cross-sectional view of this dielectric resonator are shown in FIG. The electrode films include an inner conductor electrode film 21L, an outer conductor electrode film 2b, a side electrode 2C1 for connecting the inner conductor electrode 2a and the outer conductor electrode 2b, and a patterned side surface provided to adjust the frequency of the resonator. Conventionally, the electrode formation method for this type of dielectric resonator includes applying silver electrode paste to the inner surface of the resonator with a brush, printing it on the outer surface with a roller,
Screen print the sides and bake the electrode paste.
さらに、最近ではディップ塗装法により全面電極ペース
トを塗布し焼付後、−方の側面電極をはがし、この上に
パターン電極としてスクリーン印刷して焼付することに
よって得られている。Furthermore, recently, electrode paste has been applied to the entire surface using a dip coating method, and after baking, the negative side electrode is peeled off, and a pattern electrode is screen printed on this and baked.
発明が解決しようとする問題点
誘電体共振器は自動車電話など高周波フィルターとして
用いられ、その普及とともに年々低価格化が要求されて
いる。このような中で、従来の製造方法では電極ペース
トの筆塗り、ローラ印刷。Problems to be Solved by the Invention Dielectric resonators are used as high-frequency filters in automobile telephones, and as they become more widespread, there is a demand for lower prices year by year. Under these circumstances, conventional manufacturing methods include brush painting of electrode paste and roller printing.
スクリーン印刷、また、一方のディップ法においてもデ
ィップ塗布、研摩、スクリーン印刷等工数を多く要する
だけでなく、機械化ができず量産化が図れないことから
誘電体共振器の電極膜の製造コストが高いという問題が
あった。Screen printing, and one of the dip methods, not only requires a large number of man-hours such as dip coating, polishing, and screen printing, but also requires high manufacturing costs for electrode films for dielectric resonators because it cannot be mechanized and cannot be mass-produced. There was a problem.
本発明は、このような問題点を解決するもので、誘電体
共振器の電極膜の製造コストが安く、かつ効率的に形成
させることを目的とするものである。The present invention is intended to solve these problems, and aims to form an electrode film of a dielectric resonator at low manufacturing cost and efficiently.
問題点を解決するための手段
この問題点を解決するために本発明は、誘電体共振器の
側面にメッキレジスト材を形成させ、無電解メッキ法に
より導電性の良いメッキを行い、メッキレジスト材を剥
離することにより、無電解メッキのパターン状の電極膜
を形成し、前記無電解メッキ上に電解メッキ法で銅、お
よび銀のメッキを電極膜として形成する方法である。Means for Solving the Problem In order to solve this problem, the present invention forms a plating resist material on the side surface of a dielectric resonator, performs plating with good conductivity by electroless plating method, and forms the plating resist material. In this method, a patterned electrode film of electroless plating is formed by peeling off the electrode film, and then copper and silver plating is formed as an electrode film on the electroless plating using an electrolytic plating method.
作用
この構成により、誘電体共振器の電極膜形成は無電解メ
ッキ上に電解メッキすることにより数十μの電極膜が形
成でき、Ｑ特性が安定するとともに従来方法と比べて低
コストで量産化が可能になる。さらに、メッキレジスト
を用いることにより、任意の電極パターンが可能となり
、その結果、周波数調整用電極膜の形成が容易にできる
。Effect: With this configuration, the electrode film of the dielectric resonator can be formed by electroplating on electroless plating to form an electrode film of several tens of microns, which stabilizes the Q characteristic and enables mass production at a lower cost than conventional methods. becomes possible. Furthermore, by using a plating resist, any electrode pattern can be formed, and as a result, the frequency adjustment electrode film can be easily formed.
実施例 本発明の一実施例について、第１図を用いて説明する。Example An embodiment of the present invention will be described using FIG. 1.
第１図人に示すように誘電体共振器のセラミック素子１
に電極パターンとなる熱可塑性樹脂系のメッキレジスト
材６をスクリーン印刷し固化乾燥させる。上記メッキレ
ジスト６をつけた誘電体セラミック素子１を重クロム酸
中でエツチング処理し、表面を粗した後に銅の無電解メ
ッキ槽の中で、第１図Ｂに示すように２〜３μの無電解
メッキの電極膜３を全面に形成する。次に、この無電解
メッキした誘電体セラミック素子１を有機溶剤の中に投
入し、熱可塑性樹脂のメッキレジスト材を溶解させ、メ
ッキレジスト上の無電解メッキ電極膜３を剥離した後に
、第１図Ｃに示すように周波数調整用のパターン状の電
極膜３ｄを形成する。さらに、この無電解メッキ電極膜
３上に第１図りに示すように、電解メッキ法を用いて銅
メッキの電極膜４を２０μ程度形成させ、さらに同じく
電解メッキ法で上記電解メッキ電極膜４上に１０数μの
銀メッキの電極膜６を形成した。Ceramic element 1 of dielectric resonator as shown in Figure 1
A thermoplastic resin plating resist material 6, which will become an electrode pattern, is screen printed and solidified and dried. The dielectric ceramic element 1 with the plating resist 6 attached thereto is etched in dichromic acid to roughen the surface, and then placed in an electroless copper plating bath with a thickness of 2 to 3 μm as shown in FIG. 1B. Electrolytic plating electrode film 3 is formed on the entire surface. Next, this electrolessly plated dielectric ceramic element 1 is placed in an organic solvent, the thermoplastic resin plating resist material is dissolved, and the electroless plated electrode film 3 on the plating resist is peeled off. As shown in Figure C, a patterned electrode film 3d for frequency adjustment is formed. Furthermore, as shown in the first diagram on this electroless plated electrode film 3, a copper plated electrode film 4 of about 20 μm is formed using an electrolytic plating method, and then on the electrolytically plated electrode film 4 using the same electrolytic plating method. A silver-plated electrode film 6 having a thickness of about 10 μm was formed on the surface.
この時、周波数調整用のパターン状の電極膜は、無電解
メッキ層が剥離されており、電解メッキでは電気を通す
金属部分の無電解メッキ層上のみ電解メッキされるので
パターン電極が形成される。At this time, the electroless plating layer of the patterned electrode film for frequency adjustment has been peeled off, and in electrolytic plating, electrolytic plating is performed only on the electroless plating layer of the metal part that conducts electricity, so a patterned electrode is formed. .
なお、本実施例では銅の無電解メッキ上に銅と銀の電解
メッキの電極膜を用いた。さらに、著者は実験を深め、
無電解メッキは銅メッキのほかクロム、ニッケル、など
有利であり、また、電解メッキも銅、及び銀だけの単体
のメッキでも充分、電気的特性が得られることが分かっ
た。In this example, an electrode film formed by electrolytic plating of copper and silver was used on electroless plating of copper. Furthermore, the author deepens the experiment,
Electroless plating is advantageous for plating chromium, nickel, etc. in addition to copper plating, and it has been found that sufficient electrical properties can be obtained even with electrolytic plating of copper and silver alone.
また、電解メッキは通常行なわれているバレルメッキ法
で容易に行なうことが可能であり、さらに、誘電体共振
器と金属のビーズを入れることにより、メッキ速度、メ
ッキ厚みの均一性も図ることができる。In addition, electrolytic plating can be easily performed using the commonly used barrel plating method, and by adding a dielectric resonator and metal beads, it is possible to improve the plating speed and uniformity of the plating thickness. can.
発明の効果
以上のように本発明はメッキレジスト材を用いて、無電
解メッキ後に、任意のパターン電極を形成することがで
き、さらに、電解メッキによりメッキ厚を厚くするとと
もに均一性が向上した。この結果、電気的特性が良好で
、密着強度が良好、しかも、低コストで量産的に製造す
る方法を発明した。Effects of the Invention As described above, according to the present invention, an arbitrary pattern electrode can be formed after electroless plating using a plating resist material, and furthermore, the plating thickness can be increased by electrolytic plating and the uniformity can be improved. As a result, we have invented a method for mass production that has good electrical properties and good adhesion strength, and at low cost.
第１図Ａ−Ｄは本発明の一実施例の工程を示す斜視図、
第２図人は従来の誘電体共振器を示す斜視図、同図Ｂは
その断面図である０
１・・・・・・誘電体セラミック素子、３・・・・・・
無電解メッキの電極膜、３ｄ・・・・・・パターン状の
無電解電極膜、４・・・・・・電解メッキの電極膜、６
・・・・・・銀メッキの電極膜、６・・・・・・メッキ
レジスト。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名７−
−−￥？ぎ箸む胃ぐいラミック榔１子、３−−−鍬」岬
六電敬表
第 １ 図 ３ｃＬ−一一
パターン尤（の無唱乳解電極表
第２図
（ハ） ２ｂFIGS. 1A to 1D are perspective views showing the steps of an embodiment of the present invention;
Figure 2 is a perspective view showing a conventional dielectric resonator, and Figure B is its cross-sectional view.
Electroless plating electrode film, 3d... Patterned electroless electrode film, 4... Electrolytic plating electrode film, 6
・・・・・・Silver plated electrode film, 6・・・・・・Plating resist. Name of agent: Patent attorney Toshio Nakao and 1 other person7-
--￥? 1 child, 3 --- hoe' Misaki Rokuden call table No. 1 Figure 3c
Claims (1)
形成し、前記誘電体共振器上に無電解メッキ法で導電性
の高いメッキを形成したのち、メッキレジスト材を剥離
し、前記誘電体共振器の無電解メッキ上に電解メッキ法
で銅又は銀のいずれか一方、又は双方のメッキを形成し
たことを特徴とする誘電体共振器の電極膜形成方法。A plating resist material is applied and formed in a pattern on a dielectric resonator, and a highly conductive plating is formed on the dielectric resonator by an electroless plating method, and then the plating resist material is peeled off to form a pattern on the dielectric resonator. 1. A method for forming an electrode film for a dielectric resonator, characterized in that copper or silver, or both, is plated by electrolytic plating on the electroless plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25880586A JPS63111706A (en) | 1986-10-30 | 1986-10-30 | Method for forming electrode film of dielectric resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25880586A JPS63111706A (en) | 1986-10-30 | 1986-10-30 | Method for forming electrode film of dielectric resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63111706A true JPS63111706A (en) | 1988-05-17 |
Family
ID=17325295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25880586A Pending JPS63111706A (en) | 1986-10-30 | 1986-10-30 | Method for forming electrode film of dielectric resonator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63111706A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196909A (en) * | 1992-08-31 | 1994-07-15 | Siemens Matsushita Components Gmbh & Co Kg | Metallic coating processing of microwave ceramics filter |
-
1986
- 1986-10-30 JP JP25880586A patent/JPS63111706A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06196909A (en) * | 1992-08-31 | 1994-07-15 | Siemens Matsushita Components Gmbh & Co Kg | Metallic coating processing of microwave ceramics filter |
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