JPS6311106Y2 - - Google Patents
Info
- Publication number
- JPS6311106Y2 JPS6311106Y2 JP1982062478U JP6247882U JPS6311106Y2 JP S6311106 Y2 JPS6311106 Y2 JP S6311106Y2 JP 1982062478 U JP1982062478 U JP 1982062478U JP 6247882 U JP6247882 U JP 6247882U JP S6311106 Y2 JPS6311106 Y2 JP S6311106Y2
- Authority
- JP
- Japan
- Prior art keywords
- bag
- buffer bag
- thermoplastic resin
- inner layer
- antistatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 29
- 229920005992 thermoplastic resin Polymers 0.000 claims description 16
- 239000011162 core material Substances 0.000 claims description 11
- 239000006229 carbon black Substances 0.000 claims description 10
- 239000002216 antistatic agent Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 12
- -1 polyethylene Polymers 0.000 description 9
- 230000005611 electricity Effects 0.000 description 6
- 230000003068 static effect Effects 0.000 description 6
- 239000012780 transparent material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 150000003973 alkyl amines Chemical class 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229940045714 alkyl sulfonate alkylating agent Drugs 0.000 description 1
- 150000008052 alkyl sulfonates Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 201000003373 familial cold autoinflammatory syndrome 3 Diseases 0.000 description 1
- 150000002462 imidazolines Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229940083254 peripheral vasodilators imidazoline derivative Drugs 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
Description
【考案の詳細な説明】
本考案は、導電性緩衝袋に関するものである。
更に詳しくは、帯電防止性能を付与した材料から
なり、特に集積回路(IC)素子などの精密弱電
部品を収納するのに適した緩衝袋に関するもので
ある。[Detailed Description of the Invention] The present invention relates to a conductive buffer bag.
More specifically, the present invention relates to a buffer bag made of a material that has antistatic properties and is particularly suitable for storing precision light electrical parts such as integrated circuit (IC) elements.
近年、集積回路素子などの半導体部品の生産が
増大し、それらに適合した梱包材料の需要が高ま
つている。半導体部品、特にMOS型集積回路素
子などでは、金属酸化物被膜の厚みが約500Å程
度であるから、静電気によつて容易に回路が破壊
される。したがつて、これらの包装袋としては、
緩衝性能は勿論、部品と袋や袋自体の接触および
摩擦による静電気が蓄積されないようなものが必
要である。 In recent years, the production of semiconductor parts such as integrated circuit elements has increased, and the demand for packaging materials suitable for them has also risen. Semiconductor parts, especially MOS type integrated circuit elements, have a metal oxide coating that is about 500 Å thick, so the circuits are easily destroyed by static electricity. Therefore, the packaging bags for these parts are:
It is necessary to have sufficient cushioning performance, and also to prevent static electricity build-up due to contact and friction between the parts and the bag or between the bag itself.
従来から、熱可塑性樹脂のインフレーシヨンフ
イルムをヒートシールして製造した袋、熱可塑性
樹脂フイルムに凹凸加工を施した芯材の片面また
は両面に、平坦な樹脂フイルム材を貼合して多数
の独立空気室を形成した材料で製造した袋などが
使用されているが、これらの袋の表面抵抗率は
1018〜1010Ωと高く、電気絶縁体を構成するの
で、静電気が蓄積され易く、静電気に弱い部品を
収納する袋としては適当でない。 Conventionally, bags have been manufactured by heat-sealing thermoplastic resin inflation films, and bags have been manufactured by laminating flat resin film materials on one or both sides of a core material made of thermoplastic resin film with textured edges. Bags made of materials with independent air chambers are used, but the surface resistivity of these bags is
Since it has a high resistance of 10 18 to 10 10 Ω and constitutes an electrical insulator, static electricity is likely to accumulate, making it unsuitable as a bag for storing components that are sensitive to static electricity.
この対策として、帯電防止剤やカーボンブラツ
クなどの電気良導体を配合した熱可塑性樹脂材料
を使用した包装袋も一部使用されているが、従来
のものは、帯電防止剤やカーボンブラツクなどを
袋の材料全体に配合しているので、材料費が著し
く高くなり、また、袋の製造過程において品種を
切替える場合に多大の材料ロスが生ずるという欠
点があつた。 As a countermeasure against this problem, some packaging bags are made of thermoplastic resin materials containing antistatic agents and good electrical conductors such as carbon black. Since it is blended into the entire material, the cost of the material increases significantly, and there is also the disadvantage that a large amount of material is lost when changing types during the manufacturing process of the bag.
また、熱可塑性樹脂にカーボンブラツクなどを
配合した不透明フイルムのみで袋を作つた場合に
は、帯電防止性能はあるが、袋の内容物を外から
見ることができないという欠点もあつた。 In addition, when bags were made only from opaque film made of thermoplastic resin mixed with carbon black, etc., although they had antistatic properties, they also had the disadvantage that the contents of the bag could not be seen from the outside.
本考案はこれらの欠点を除去した新規な導電性
緩衝袋に関するものである。 The present invention relates to a novel conductive buffer bag that eliminates these drawbacks.
すなわち、本考案の導電性緩衝袋は、熱可塑性
樹脂フイルムに凹凸加工を施した芯材の片面また
は両面に、平坦な熱可塑性樹脂フイルムを貼合し
て、多数の独立空気室を形成した緩衝材料からな
る緩衝袋の、内容物に接触する2面の内側層の
内、少なくとも片側面の内側層が、原料樹脂100
重量部に対して10〜30重量部のカーボンブラツク
を配合した帯電防止性能を有する材料からなるこ
とを特徴とするものである。 In other words, the conductive buffer bag of the present invention is a buffer bag in which a flat thermoplastic resin film is laminated on one or both sides of a core material made of a thermoplastic resin film with a textured surface to form a large number of independent air chambers. Of the two inner layers in contact with the contents of the buffer bag made of material, at least one inner layer is made of raw resin 100%
It is characterized by being made of a material that has antistatic properties and contains 10 to 30 parts by weight of carbon black.
以下に本考案を図示の実施例により更に詳細に
説明する。 The present invention will be explained in more detail below with reference to illustrated embodiments.
第1図に示す本考案の緩衝袋1は第2図Aから
Fに示すような種々の層構成を有する。熱可塑性
樹脂フイルムからなる芯材2は凹凸加工を施して
あり、これに熱可塑性樹脂のフイルム材3を貼着
することによつて、多数の独立空気室4を形成す
る。独立空気室4の平面形状は通常円形である
が、特にこれに限定されるものではない。この芯
材2の層を袋1の内側にすると(例えば第2図
A)、袋1の内容物が移動し難くなり、運搬中に
内容物が袋内で安定している。また、芯材2の層
を外側にすると(例えば、第2図C)、袋1へ内
容物を出し入れする操作が容易になる。また、第
2図DからFに示すように、袋の片側面あるいは
両側面を三層構成にすると、袋の腰が強くなり袋
の取扱いが容易になる。 The buffer bag 1 of the present invention shown in FIG. 1 has various layer configurations as shown in FIGS. 2A to 2F. A core material 2 made of a thermoplastic resin film is textured, and a large number of independent air chambers 4 are formed by adhering a thermoplastic resin film material 3 to the core material 2 . The planar shape of the independent air chamber 4 is usually circular, but is not particularly limited to this. If this layer of core material 2 is placed inside the bag 1 (for example, FIG. 2A), the contents of the bag 1 will be difficult to move, and the contents will remain stable within the bag during transportation. Further, if the core material 2 layer is placed on the outside (for example, as shown in FIG. 2C), it becomes easier to take the contents into and out of the bag 1. Furthermore, as shown in FIGS. 2D to F, if one side or both sides of the bag are made of three layers, the bag will have a stronger elasticity and will be easier to handle.
本考案においては、上記のような構成の緩衝袋
1の構成材料を特定するものである。すなわち、
前記芯材2またはフイルム材3の内、内容物に接
触する内側層5の少なくとも一層を帯電防止性能
を有するフイルム材料で形成する。 In the present invention, the constituent materials of the buffer bag 1 having the above-mentioned structure are specified. That is,
At least one layer of the inner layer 5 of the core material 2 or the film material 3 that contacts the contents is formed of a film material having antistatic properties.
帯電防止性能を有するフイルム材料としては、
熱可塑性樹脂にカーボンブラツクを添加したもの
が、材料の加工性、汎用性、低廉性、導電性等に
点から好適であり、表面抵抗率を106Ω以下にす
ることができる。ただし、フイルム材料が不透明
になるので内容物を袋外から見ることはできな
い。以下にこれを「導電性材料A」という。 Film materials with antistatic properties include:
A thermoplastic resin to which carbon black is added is preferable in terms of material processability, versatility, low cost, electrical conductivity, etc., and can have a surface resistivity of 10 6 Ω or less. However, since the film material becomes opaque, the contents cannot be seen from outside the bag. This will be referred to as "conductive material A" below.
導電性材料Aとして、例えば、ポリエチレン、
ポリプロピレンなどのポリオレフイン樹脂にカー
ボンブラツクを配合する場合には、原料樹脂100
重量部に対して、通常カーボンブラツクを10〜30
重量部とすることが好ましい。カーボンブラツク
の配合量が10重量部未満であると、導電性が不十
分となり、良好な帯電防止性能が得られない。ま
た、カーボンブラツクの配合量を30重量部より多
くしても、導電性の効果はそれ以上向上すること
はなく、かつ、インフレーシヨン中にピンホール
が発生したり、ヒートシールが不良になるなどの
欠点が生じるので好ましくない。 As the conductive material A, for example, polyethylene,
When blending carbon black with polyolefin resin such as polypropylene, raw resin 100%
Carbon black is usually 10 to 30 parts by weight.
Preferably, it is expressed in parts by weight. If the amount of carbon black is less than 10 parts by weight, conductivity will be insufficient and good antistatic performance will not be obtained. Furthermore, even if the amount of carbon black added is greater than 30 parts by weight, the conductivity effect will not be further improved, and pinholes will occur during inflation and heat sealing will be defective. This is not preferable because of the following disadvantages.
帯電防止性能を有する材料としては、上記の他
に、熱可塑性樹脂に帯電防止剤を配合した材料、
熱可塑性樹脂フイルムに帯電防止剤を塗布した材
料、(以下これらを「導電性材料B」という)な
どがあり、これらは透明性を有するが、表面抵抗
率は前記導電性材料Aよりも高く、1010〜106Ω
程度である。 In addition to the above, examples of materials with antistatic properties include materials made of thermoplastic resin mixed with an antistatic agent;
There are materials such as a thermoplastic resin film coated with an antistatic agent (hereinafter referred to as "conductive material B"), which have transparency, but have a higher surface resistivity than the conductive material A. 10 10 ~ 10 6 Ω
That's about it.
帯電防止剤としては、カチオン系の第4級アン
モニウム塩、イミダゾリン誘導体;アニオン系の
アルキルサルフエート、アルキルアリールサルフ
エート、アルキルスルホネート;ノニオン系のポ
リオキシエチレンアルキルアミン類、グリセリン
脂肪酸エステル類;および両性系のアルキルベタ
インなどの各種の界面活性剤があるが、これらの
内、ポリオキシエチレンアルキルアミンおよびグ
リセリン脂肪酸エステルなどが好適である。 Examples of antistatic agents include cationic quaternary ammonium salts and imidazoline derivatives; anionic alkyl sulfates, alkylaryl sulfates, and alkyl sulfonates; nonionic polyoxyethylene alkylamines and glycerin fatty acid esters; and amphoteric There are various types of surfactants such as alkyl betaines, among which polyoxyethylene alkylamines and glycerin fatty acid esters are preferred.
本考案においては、前記の袋1を構成する各層
の内、袋の内容物に接触する内側層5として、前
記導電性材料Aを使用する。更に、導電性を与え
た内側層5以外の他の芯材2やフイルム材3にも
導電性材料を適宜に使用し得ることは勿論であ
る。 In the present invention, among the layers constituting the bag 1, the conductive material A is used as the inner layer 5 that contacts the contents of the bag. Furthermore, it goes without saying that conductive materials can be appropriately used for the core material 2 and the film material 3 other than the inner layer 5 which is provided with conductivity.
本考案者らの試験結果によれば、集積回路素子
用の袋のように帯電防止性能の要求が高度の場合
でも、袋の内外層のすべてを導電性材料で構成す
る必要はなく、集積回路の端子等が接触する内側
層5に表面抵抗率106〜100Ωの前記導電性材料A
を使用すれば好結果が得られ、更に他の内側層5
にも、前記導電性材料AもしくはBを使用するこ
とにより更に良好な結果を得られることが判明し
た。 According to the test results of the present inventors, even in cases where high antistatic performance is required, such as bags for integrated circuit devices, it is not necessary to make all of the inner and outer layers of the bag from conductive materials. The conductive material A having a surface resistivity of 10 6 to 10 0 Ω is applied to the inner layer 5 in contact with the terminals, etc.
Good results can be obtained by using the inner layer 5.
It has also been found that even better results can be obtained by using the conductive material A or B.
本考案の他の実施態様においては、緩衝袋の内
側層の面積の少なくとも50%を、不透明な材料、
例えば前記導電性材料Aで構成し、他の部分を透
明な材料で構成する。その場合、片側面の内側層
の全面を不透明な材料で構成し、他側面の内側層
を透明な材料で構成してもよいが、それのみに限
らず、内側層の全面にわたり、あるいは所望部分
に、縞模様、帯状模様、水玉模様、格子縞模様、
その他任意の配置で不透明部分を形成することに
より、緩衝袋に導電性を与えると共に、意匠性を
付与して付加価値を高めることができる。透明な
材料としてはポリオレフインフイルム等の通常の
熱可塑性樹脂フイルムおよび前記の導電性材料B
の界面活性剤などを配合した透明な材料がある。
また、本考案で透明とは、袋の外側から内容物の
存在を確認でき得る程度の状態を云う。 In another embodiment of the invention, at least 50% of the area of the inner layer of the buffer bag is made of an opaque material.
For example, it is made of the conductive material A, and the other parts are made of a transparent material. In that case, the entire surface of the inner layer on one side may be made of an opaque material, and the inner layer on the other side may be made of a transparent material. , striped pattern, striped pattern, polka dot pattern, plaid pattern,
By forming the opaque portion in any other arbitrary arrangement, it is possible to impart electrical conductivity to the buffer bag, as well as impart design properties and increase added value. Examples of the transparent material include ordinary thermoplastic resin films such as polyolefin films and the above-mentioned conductive material B.
There are transparent materials that contain surfactants, etc.
Furthermore, in the present invention, transparent refers to a state in which the presence of the contents can be confirmed from the outside of the bag.
上記のようにすることによつて、緩衝袋に帯電
防止性能を付与すると同時に、袋の内容物を容易
に確認できるようになり、包装物の取扱上好適で
ある。 By doing as described above, it is possible to impart antistatic properties to the buffer bag, and at the same time, it becomes possible to easily check the contents of the bag, which is suitable for handling the package.
上記のような本考案の緩衝袋は、内容物を外部
の衝撃から守ることができ、かつ静電気が蓄積し
難いので、静電気の放電により内容物を損傷する
ことがなく、更に、内容物を外部から見ることが
できるという利点を有し、しかも、従来の帯電防
止性能を有する袋よりも製造コストが低廉である
という特徴を有している。 The buffer bag of the present invention as described above can protect the contents from external shocks and is difficult to accumulate static electricity, so the contents will not be damaged by static electricity discharge, and furthermore, the contents can be protected from external shocks. It has the advantage that it can be seen from the outside, and is also characterized by lower manufacturing costs than conventional bags with antistatic properties.
第1図は本考案の緩衝袋の縦断面図、および第
2図AからFはそれぞれ第1図の−線におけ
る拡大縦断面図で緩衝袋の層構成を示すものであ
る。
1……緩衝袋、2……芯材、3……フイルム
材、4……独立空気室、5……内側層。
FIG. 1 is a longitudinal sectional view of the buffer bag of the present invention, and FIGS. 2A to 2 F are enlarged longitudinal sectional views taken along the line - in FIG. 1, showing the layer structure of the buffer bag. 1... Buffer bag, 2... Core material, 3... Film material, 4... Independent air chamber, 5... Inner layer.
Claims (1)
材の片面または両面に、平坦な熱可塑性樹脂フ
イルムを貼合して、多数の独立空気室を形成し
た緩衝材料からなる緩衝袋の、内容物に接触す
る2面の内側層の内、少なくとも片側面の内側
層が、原料樹脂100重量部に対して、10〜30重
量部のカーボンブラツクを配合した帯電防止性
能を有する材料からなることを特徴とする導電
性緩衝袋。 (2) 前記緩衝袋の帯電防止性能を有する内側層以
外のフイルム材および芯材の任意のものを帯電
防止性能を有する材料で形成したことを特徴と
する実用新案登録請求の範囲第1項に記載の導
電性緩衝袋。 (3) 前記緩衝袋の片側面の内側層が、熱可塑性樹
脂にカーボンブラツクを配合した帯電防止性能
を有する材料からなり、他側面の少なくとも内
側層が熱可塑性樹脂に界面活性剤系の帯電防止
剤を配合した帯電防止性能を有する材料からな
る実用新案登録請求の範囲第1項または第2項
に記載の導電性緩衝袋。[Claims for Utility Model Registration] (1) A buffer in which a flat thermoplastic resin film is laminated to one or both sides of a core material made of a thermoplastic resin film with a textured surface to form a large number of independent air chambers. The inner layer on at least one side of the two inner layers in contact with the contents of the buffer bag made of the material is antistatic, containing 10 to 30 parts by weight of carbon black per 100 parts by weight of the raw resin. A conductive buffer bag characterized by being made of a material with high performance. (2) The utility model registered in claim 1, characterized in that any film material and core material other than the inner layer having antistatic properties of the buffer bag are formed of materials having antistatic properties. Conductive buffer bag as described. (3) The inner layer on one side of the buffer bag is made of a material with antistatic properties made of a thermoplastic resin and carbon black, and at least the inner layer on the other side is made of a thermoplastic resin and a surfactant-based antistatic material. The conductive buffer bag according to claim 1 or 2, which is made of a material having antistatic properties and containing an antistatic agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6247882U JPS58163478U (en) | 1982-04-28 | 1982-04-28 | conductive buffer bag |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6247882U JPS58163478U (en) | 1982-04-28 | 1982-04-28 | conductive buffer bag |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58163478U JPS58163478U (en) | 1983-10-31 |
JPS6311106Y2 true JPS6311106Y2 (en) | 1988-04-01 |
Family
ID=30072629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6247882U Granted JPS58163478U (en) | 1982-04-28 | 1982-04-28 | conductive buffer bag |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58163478U (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH028712Y2 (en) * | 1985-02-12 | 1990-03-01 | ||
JPH0312702Y2 (en) * | 1985-02-25 | 1991-03-25 | ||
JP2595224Y2 (en) * | 1992-06-26 | 1999-05-24 | 信越ポリマー株式会社 | Carrier tape for storing electronic components |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5239421B2 (en) * | 1972-08-22 | 1977-10-05 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5239421U (en) * | 1975-02-25 | 1977-03-19 | ||
JPS5842291Y2 (en) * | 1980-02-25 | 1983-09-24 | 東洋化学株式会社 | Static electricity eliminating bag |
-
1982
- 1982-04-28 JP JP6247882U patent/JPS58163478U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5239421B2 (en) * | 1972-08-22 | 1977-10-05 |
Also Published As
Publication number | Publication date |
---|---|
JPS58163478U (en) | 1983-10-31 |
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