JPS63110045U - - Google Patents
Info
- Publication number
- JPS63110045U JPS63110045U JP233187U JP233187U JPS63110045U JP S63110045 U JPS63110045 U JP S63110045U JP 233187 U JP233187 U JP 233187U JP 233187 U JP233187 U JP 233187U JP S63110045 U JPS63110045 U JP S63110045U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- base material
- semiconductor
- semiconductor device
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/884—
-
- H10W90/754—
-
- H10W90/756—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP233187U JPH0642343Y2 (ja) | 1987-01-09 | 1987-01-09 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP233187U JPH0642343Y2 (ja) | 1987-01-09 | 1987-01-09 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63110045U true JPS63110045U (cg-RX-API-DMAC10.html) | 1988-07-15 |
| JPH0642343Y2 JPH0642343Y2 (ja) | 1994-11-02 |
Family
ID=30781076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP233187U Expired - Lifetime JPH0642343Y2 (ja) | 1987-01-09 | 1987-01-09 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642343Y2 (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355569A (zh) * | 2015-11-05 | 2016-02-24 | 南通富士通微电子股份有限公司 | 封装方法 |
| JP2017069431A (ja) * | 2015-09-30 | 2017-04-06 | 株式会社デンソー | 半導体装置 |
| US10014284B2 (en) | 2014-03-04 | 2018-07-03 | Rohm Co., Ltd. | Power semiconductor module for an inverter circuit and method of manufacturing the same |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157400B (zh) * | 2011-01-30 | 2013-06-19 | 南通富士通微电子股份有限公司 | 高集成度晶圆扇出封装方法 |
| CN102169879B (zh) * | 2011-01-30 | 2013-10-02 | 南通富士通微电子股份有限公司 | 高集成度晶圆扇出封装结构 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169161A (ja) * | 1983-03-16 | 1984-09-25 | Hitachi Ltd | 半導体装置 |
| JPS6018939A (ja) * | 1983-07-13 | 1985-01-31 | Hitachi Micro Comput Eng Ltd | 樹脂封止型半導体装置 |
-
1987
- 1987-01-09 JP JP233187U patent/JPH0642343Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59169161A (ja) * | 1983-03-16 | 1984-09-25 | Hitachi Ltd | 半導体装置 |
| JPS6018939A (ja) * | 1983-07-13 | 1985-01-31 | Hitachi Micro Comput Eng Ltd | 樹脂封止型半導体装置 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10014284B2 (en) | 2014-03-04 | 2018-07-03 | Rohm Co., Ltd. | Power semiconductor module for an inverter circuit and method of manufacturing the same |
| US10777542B2 (en) | 2014-03-04 | 2020-09-15 | Rohm Co., Ltd. | Power semiconductor module for an inverter circuit and method of manufacturing the same |
| JP2017069431A (ja) * | 2015-09-30 | 2017-04-06 | 株式会社デンソー | 半導体装置 |
| CN105355569A (zh) * | 2015-11-05 | 2016-02-24 | 南通富士通微电子股份有限公司 | 封装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0642343Y2 (ja) | 1994-11-02 |