JPH03106756U - - Google Patents

Info

Publication number
JPH03106756U
JPH03106756U JP1990015506U JP1550690U JPH03106756U JP H03106756 U JPH03106756 U JP H03106756U JP 1990015506 U JP1990015506 U JP 1990015506U JP 1550690 U JP1550690 U JP 1550690U JP H03106756 U JPH03106756 U JP H03106756U
Authority
JP
Japan
Prior art keywords
heat sink
resin
semiconductor device
sealed semiconductor
semiconductor pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990015506U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990015506U priority Critical patent/JPH03106756U/ja
Publication of JPH03106756U publication Critical patent/JPH03106756U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/0198—
    • H10W72/5363—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1990015506U 1990-02-19 1990-02-19 Pending JPH03106756U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990015506U JPH03106756U (cg-RX-API-DMAC10.html) 1990-02-19 1990-02-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990015506U JPH03106756U (cg-RX-API-DMAC10.html) 1990-02-19 1990-02-19

Publications (1)

Publication Number Publication Date
JPH03106756U true JPH03106756U (cg-RX-API-DMAC10.html) 1991-11-05

Family

ID=31518809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990015506U Pending JPH03106756U (cg-RX-API-DMAC10.html) 1990-02-19 1990-02-19

Country Status (1)

Country Link
JP (1) JPH03106756U (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7124977B2 (en) 2003-10-15 2006-10-24 Actown Electrocoil, Inc. Magnetic core winding apparatus
WO2012060314A1 (ja) * 2010-11-02 2012-05-10 船井電機株式会社 ディスク装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7124977B2 (en) 2003-10-15 2006-10-24 Actown Electrocoil, Inc. Magnetic core winding apparatus
US7154368B2 (en) 2003-10-15 2006-12-26 Actown Electricoil, Inc. Magnetic core winding method, apparatus, and product produced therefrom
US7159816B2 (en) 2003-10-15 2007-01-09 Actown Electricoil, Inc. Magnetic core winding method
WO2012060314A1 (ja) * 2010-11-02 2012-05-10 船井電機株式会社 ディスク装置

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