JPS6236550U - - Google Patents

Info

Publication number
JPS6236550U
JPS6236550U JP1985128647U JP12864785U JPS6236550U JP S6236550 U JPS6236550 U JP S6236550U JP 1985128647 U JP1985128647 U JP 1985128647U JP 12864785 U JP12864785 U JP 12864785U JP S6236550 U JPS6236550 U JP S6236550U
Authority
JP
Japan
Prior art keywords
semiconductor device
view
irregularities
semiconductor element
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985128647U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985128647U priority Critical patent/JPS6236550U/ja
Publication of JPS6236550U publication Critical patent/JPS6236550U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W72/07551
    • H10W72/533
    • H10W72/5363
    • H10W72/543
    • H10W72/551
    • H10W72/555
    • H10W74/00
    • H10W90/756

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1985128647U 1985-08-22 1985-08-22 Pending JPS6236550U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985128647U JPS6236550U (cg-RX-API-DMAC10.html) 1985-08-22 1985-08-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985128647U JPS6236550U (cg-RX-API-DMAC10.html) 1985-08-22 1985-08-22

Publications (1)

Publication Number Publication Date
JPS6236550U true JPS6236550U (cg-RX-API-DMAC10.html) 1987-03-04

Family

ID=31024509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985128647U Pending JPS6236550U (cg-RX-API-DMAC10.html) 1985-08-22 1985-08-22

Country Status (1)

Country Link
JP (1) JPS6236550U (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03151648A (ja) * 1989-11-08 1991-06-27 Toshiba Corp ボンディングワイヤ及びこれを有する半導体装置
US6849930B2 (en) 2000-08-31 2005-02-01 Nec Corporation Semiconductor device with uneven metal plate to improve adhesion to molding compound

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03151648A (ja) * 1989-11-08 1991-06-27 Toshiba Corp ボンディングワイヤ及びこれを有する半導体装置
US6849930B2 (en) 2000-08-31 2005-02-01 Nec Corporation Semiconductor device with uneven metal plate to improve adhesion to molding compound

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