JPS63108645U - - Google Patents
Info
- Publication number
- JPS63108645U JPS63108645U JP20217586U JP20217586U JPS63108645U JP S63108645 U JPS63108645 U JP S63108645U JP 20217586 U JP20217586 U JP 20217586U JP 20217586 U JP20217586 U JP 20217586U JP S63108645 U JPS63108645 U JP S63108645U
- Authority
- JP
- Japan
- Prior art keywords
- heat generating
- heat
- package
- generating component
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20217586U JPH0429568Y2 (enrdf_load_html_response) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20217586U JPH0429568Y2 (enrdf_load_html_response) | 1986-12-27 | 1986-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63108645U true JPS63108645U (enrdf_load_html_response) | 1988-07-13 |
JPH0429568Y2 JPH0429568Y2 (enrdf_load_html_response) | 1992-07-17 |
Family
ID=31166311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20217586U Expired JPH0429568Y2 (enrdf_load_html_response) | 1986-12-27 | 1986-12-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0429568Y2 (enrdf_load_html_response) |
-
1986
- 1986-12-27 JP JP20217586U patent/JPH0429568Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0429568Y2 (enrdf_load_html_response) | 1992-07-17 |
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