JPS63107522A - Mold equipment - Google Patents

Mold equipment

Info

Publication number
JPS63107522A
JPS63107522A JP25174286A JP25174286A JPS63107522A JP S63107522 A JPS63107522 A JP S63107522A JP 25174286 A JP25174286 A JP 25174286A JP 25174286 A JP25174286 A JP 25174286A JP S63107522 A JPS63107522 A JP S63107522A
Authority
JP
Japan
Prior art keywords
plunger
light
detecting
spring
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25174286A
Other languages
Japanese (ja)
Other versions
JP2538890B2 (en
Inventor
Shingo Osaka
大坂 慎吾
Bunji Kuratomi
倉富 文司
Mitsuhiro Momota
光宏 百田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Hokkai Semiconductor Ltd
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Hokkai Semiconductor Ltd, Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd filed Critical Hitachi Hokkai Semiconductor Ltd
Priority to JP61251742A priority Critical patent/JP2538890B2/en
Publication of JPS63107522A publication Critical patent/JPS63107522A/en
Application granted granted Critical
Publication of JP2538890B2 publication Critical patent/JP2538890B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/768Detecting defective moulding conditions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/84Safety devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/84Safety devices
    • B29C2045/848Safety devices detecting or preventing overload of an injection plunger

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To contrive unification of a mold product by detecting the wear of a plunger or a pot in an early stage, by providing a detecting device of a sliding action of a plunger on each of the plungers. CONSTITUTION:A seat 12 and detecting pin 13 moving unitarily with a plunger 6 through an action of a spring 11 are held into a hole 14 in the lower part of plungers 6 and a light emitting appliance 16 and light receiving appliance 17 are arranged in the direction crossing at right angles with a sliding direction of the detecting pin 13. In the case where sleeve resistance between a pot 4a and plunger 6a is great, the plunger 6a is hard to ascend inspite of an ascent of a transfer cylinder 9. Therefore, a spring 11a starts to contract earlier as compared with the spring 11 in the lower part of the plunger 6 operating normally and light through a light emitting appliance 16a is interrupted by a detecting pin 13a before the lapse of (t) hours after starting of the transfer cylinder 9. Therefore, whether resin is cast into a cavity 7 normally can be judged by only detecting timing where light through the light emitting appliance 16 is shaded by a detecting pin 17.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、モールド技術に関するもので特にマルチプラ
ンジャモールド技術に適用して有効な技術に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to molding technology, and particularly to a technology that is effective when applied to multi-plunger molding technology.

〔従来の技術〕[Conventional technology]

複数本のプランジャを有するいわゆるマルチプランジャ
モールド装置につい℃は、特開昭59−201429号
公報に記載されている。その概要を第3図、第4図を用
い℃説明する。1は下金型でその主パーティング面には
左右一対のキャビティ部3Aが一方向に配列され、前記
両キャビティ部3人間には、レジンタブレットを投入す
るためのポット4がそれぞれ設けられている。なお、前
記デクト4内にはそれぞれプランジャ6が配設されてい
る。2は上金型で、そのパーティング面には下金型1の
キャビティ部3Aと対応してキャビティ部3Bが形成さ
れている。5はゲートでありポット4で圧入されたレジ
ンが、このゲート5を介し℃キャビティ3A、3Bで構
成される空間に注入されるようになっている。なお、7
はレジンである。
The temperature of a so-called multi-plunger mold device having a plurality of plungers is described in Japanese Patent Laid-Open No. 59-201429. The outline will be explained using FIGS. 3 and 4. Reference numeral 1 denotes a lower mold, in which a pair of left and right cavities 3A are arranged in one direction on its main parting surface, and pots 4 for inserting resin tablets are provided in each of the two cavities 3. . Incidentally, a plunger 6 is disposed inside each of the ducts 4. Reference numeral 2 designates an upper mold, and a cavity portion 3B is formed on the parting surface of the upper mold, corresponding to the cavity portion 3A of the lower mold 1. Reference numeral 5 denotes a gate, through which the resin press-fitted in the pot 4 is injected into the space constituted by the °C cavities 3A and 3B. In addition, 7
is resin.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、このようなマルチプランジャ方式のモールド
装置の場合、品質一様なモールド製品を製造するために
は、各キャビティ3A、3B内にレジン7をほぼ同時に
注入することが必要となっている。
Incidentally, in the case of such a multi-plunger type molding device, in order to manufacture a molded product of uniform quality, it is necessary to inject the resin 7 into each cavity 3A, 3B almost simultaneously.

ところが、各プランジャあるいはポットの摩耗の度合い
がそれぞれ異なるためスリーブ抵抗(プランジャがポッ
ト内を摺動する際の抵抗)にも差が生じてくる。すなわ
ち、ポット4とプランジャ60頭部間にレジン7が入り
込んだ場合には摩擦が非常に大きくなり、プランジャ6
がスムースに摺動せずキャビティ3A、3Bへのレジン
7の移送が遅れてモールド不足、ボイド等のモールド不
良が生じてしまうという問題があった。
However, since the degree of wear of each plunger or pot is different, differences occur in sleeve resistance (resistance when the plunger slides inside the pot). In other words, when the resin 7 enters between the pot 4 and the head of the plunger 60, the friction becomes extremely large and the plunger 6
There was a problem in that the resin 7 did not slide smoothly and the transfer of the resin 7 to the cavities 3A and 3B was delayed, resulting in mold defects such as insufficient mold and voids.

本発明の目的はモールド不良を低減できうる技術を提供
することである。
An object of the present invention is to provide a technique that can reduce mold defects.

本発明の目的は各プランジャおのおのの摺動動作を検出
でき5る技術を提供することである。
An object of the present invention is to provide a technique that can detect the sliding movement of each plunger.

本発明の前記ならびKそのほかの目的と新規な特徴は、
本明細書の記述および添付図面からあきらかになるであ
ろう。
The above and other objects and novel features of the present invention are:
It will become clear from the description of this specification and the accompanying drawings.

〔問題点を解決するための手段〕[Means for solving problems]

本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば下記の通りである。
A brief overview of typical inventions disclosed in this application is as follows.

すなわち、各々のプランジャに前記プランジャの摺動動
作の検出手段を設けることである。
That is, each plunger is provided with means for detecting the sliding movement of the plunger.

〔作用〕[Effect]

上記した手段によれば、早期忙プランジャの摺動動作の
異状を検出できるので、適時にプランジャあるいはポッ
トの交換等のメンテナンスを行なうことが可能となり、
ボイドやモールド不足等のモールド不良を低減できるも
のである。
According to the above-mentioned means, abnormalities in the sliding movement of the busy plunger can be detected, so maintenance such as replacing the plunger or pot can be carried out in a timely manner.
This can reduce mold defects such as voids and mold shortages.

〔実施例〕〔Example〕

第1図は本発明の一実施例であるモールド装置の概略構
成図、第2図は本発明の主要部拡大図である。以下図面
に従い詳細に説明する。なお、第3図、第4図で説明し
た構成と同一構成部分について同一符号を付し、その説
明を省略する。
FIG. 1 is a schematic configuration diagram of a molding device which is an embodiment of the present invention, and FIG. 2 is an enlarged view of the main parts of the present invention. A detailed explanation will be given below according to the drawings. Components that are the same as those described in FIGS. 3 and 4 are designated by the same reference numerals, and their explanations will be omitted.

各プランジャ6は一枚のプランジャホルダ8におのおの
支持され、トランスファシリンダ9の上下動によりポッ
ト4内を往復運動するようになりている。10はバッキ
ングプレートであり、各々プランジャ6の下方にはバネ
11の作用によりプランジャ6と一体的に動く座12と
前記塵12と連結した検出ピン13がホール14内に収
納されている。15は前記検出ピン13の摺動を検出す
るための手段を保持する検出器ホルダであり、例えば検
出ピン13の摺動方向に対し℃直交する方向に発光器1
6及び受光器17が配設されている。
Each plunger 6 is supported by one plunger holder 8, and is reciprocated within the pot 4 by vertical movement of a transfer cylinder 9. Reference numeral 10 designates a backing plate, and a seat 12 that moves together with the plunger 6 by the action of a spring 11 and a detection pin 13 connected to the dust 12 are housed in a hole 14 below the plunger 6, respectively. Reference numeral 15 denotes a detector holder that holds a means for detecting the sliding movement of the detection pin 13. For example, the light emitter 1
6 and a light receiver 17 are provided.

なお、18はプランジャ6の最大ストローク長を規定す
るためのストッパ、19はバッキングプレート10を下
金型IK対し工平行に上下動させるためのスライド軸で
ある。
In addition, 18 is a stopper for regulating the maximum stroke length of the plunger 6, and 19 is a slide shaft for moving the backing plate 10 up and down parallel to the lower mold IK.

次(動作につい℃詳細に説明する。まず、各ボット4内
にレジン粉を成型したタブレット(図示せず)を投入す
る。そののち、下限位置にありたプレスシリンダを初期
段階では高速に動作させ、上限位置、すなわち下金を1
が上金型2と当接する手前で低速動作させて上昇させ両
金型な所定の圧力で型締めする。型締め完了と同期しニ
ドランスフアシリンダ9を下限位置から上動させる。な
お、トランスファシリンダ9が下限位置にあるとき、各
プランジャ6の下部にあるバネ11は、プランジャ6、
座12及び検出ピン13の重量弁で若干縮んでいるが、
各検出ピン13は発光器16からの元を遮断しない位置
に設定されている。また、タブレットの上端が上金型2
に当接し、プランジャ6に下方向の力が加わらないかぎ
り正常なモールドではトランス7アシリンダ9を上昇さ
せテモ、トランスファシリンダ9と同幅でプランジャ6
及び検出ピン13が共に上昇するので、発光及び受光器
15.16と検出ピン13との位置関係は変わらず、発
光器16から発生した光は前記検出ピン13で遮断され
ず受光器17に違する。
Next (the operation will be explained in detail). First, a tablet (not shown) molded with resin powder is put into each bot 4. After that, the press cylinder, which was at the lower limit position, is operated at high speed in the initial stage. , the upper limit position, that is, the lower gold is 1
The upper mold 2 is moved at low speed and raised before it comes into contact with the upper mold 2, and both molds are clamped with a predetermined pressure. Synchronizing with the completion of mold clamping, the nitrogen transfer cylinder 9 is moved upward from the lower limit position. Note that when the transfer cylinder 9 is at the lower limit position, the spring 11 at the bottom of each plunger 6
Although it is slightly compressed due to the weight valve of the seat 12 and detection pin 13,
Each detection pin 13 is set at a position where it does not block the source from the light emitter 16. Also, the top edge of the tablet is the upper mold 2.
In a normal mold, unless a downward force is applied to the plunger 6, the transformer 7 and the cylinder 9 will rise, and the plunger 6 will move up with the same width as the transfer cylinder 9.
Since both the detection pin 13 and the detection pin 13 rise, the positional relationship between the light emitting and light receivers 15 and 16 and the detection pin 13 remains unchanged, and the light generated from the light emitter 16 is not blocked by the detection pin 13 and is transmitted to the light receiver 17. do.

タブレットが上金型2に当接するまでトランスファシリ
ンダ9を上昇させるとプランジャ6を下方向に押す力が
加わり、バネ11が縮み始める。そして、バネ11が所
定量縮んだときに、検出ピン13が発光器15からの光
を遮断するように調整され℃いる。なお、トランスファ
シリンダ9を始動させたのち各検出ピン13が光を遮断
するまでの時間(1)を一定とするため、各バネ11の
バネ定数長さ及び検出ビンの長さを一致させている。
When the transfer cylinder 9 is raised until the tablet comes into contact with the upper mold 2, a downward force is applied to the plunger 6, and the spring 11 begins to contract. Then, when the spring 11 is compressed by a predetermined amount, the detection pin 13 is adjusted to block the light from the light emitter 15. In addition, in order to keep the time (1) from starting the transfer cylinder 9 until each detection pin 13 blocks light constant, the spring constant length of each spring 11 and the length of the detection bin are made to be the same. .

ところが、ポットとプランジャとの間のスリーブ抵抗が
大である場合(本実施例ではボッ)4a。
However, when the sleeve resistance between the pot and the plunger is large (in this embodiment, it is 4a).

プランジャ6a)には、トランスファシリンダ9が上昇
するにもかかわらずプランジャ6aが上昇しないあるい
は上昇しにくいため、バネllaが正常な動作している
プランジャ11の下部にあるバネ11に比べて早(縮み
始め、トランスファシリンダ9が始動してから1時間が
かかる前に検出ピン13aにより発光器16aからの光
が遮断される。
In the plunger 6a), the plunger 6a does not rise or does not rise easily even though the transfer cylinder 9 rises, so the spring lla shrinks faster than the spring 11 at the bottom of the plunger 11 which is operating normally. Initially, the light from the light emitter 16a is blocked by the detection pin 13a before one hour has passed since the transfer cylinder 9 was started.

従っ又、発光器16からの光が検出ビン17で遮光され
るタイミングを検出するだけで、各々のプランジャにつ
いて正常にレジンをキャビティ7内に注入しているかど
うかを判断することが可能となる。
Therefore, by simply detecting the timing at which the light from the light emitter 16 is blocked by the detection bottle 17, it is possible to determine whether resin is normally injected into the cavity 7 for each plunger.

次に本実施例について作用、効果を説明する。Next, the functions and effects of this embodiment will be explained.

(1)複数のプランジャの各々の摺動動作を測定するこ
とにより、各プランジャおのおののスリーブ抵抗の大小
を測定できるので、早期にプランジャあるいはポットの
摩耗を検知することができ、適切なメンテナンスの時期
を把握することが容易となる効果が得られるものである
(1) By measuring the sliding movement of each of multiple plungers, it is possible to measure the magnitude of the sleeve resistance of each plunger, so wear of the plunger or pot can be detected at an early stage, and appropriate maintenance timing can be determined. This has the effect of making it easier to understand.

(2)  (1)によりモールド作業を安定した条件で
行なうことができるので、モールド製品の品質を均一化
できるという効果が得られる。
(2) Since the molding operation can be performed under stable conditions due to (1), the quality of the molded product can be made uniform.

(31(1)により、早期にプランジャあるいはポット
の摩耗を検知して、早期に交換が可能となるので、モー
ルド製品のモールド不足、内部ボイドを低減できるとい
う効果が得られる。
(31(1) makes it possible to detect wear of the plunger or pot at an early stage and replace it at an early stage, which has the effect of reducing mold shortages and internal voids in molded products.

(4)各プランジャあるいは各プランジャの上下動と一
体的に動く部材の動作を、光が発光器と受光器間を透過
あるいは遮断されることで検知することにより、簡単な
構成でかつコンパクトに各々のプランジャの摺動状態を
認識できるという効果が得られる。
(4) By detecting the movement of each plunger or a member that moves integrally with the vertical movement of each plunger by the transmission or interruption of light between the emitter and receiver, each plunger can be easily and compactly configured. The effect is that the sliding state of the plunger can be recognized.

以上本発明者によってなされた発明を実施例にもとづき
具体的に説明したが、本発明は上記実施例に限定される
ものではなく、その要旨を逸脱しない範囲で種々変更可
能であることはいうまでもない。たとえば、各プランジ
ャの動作を光の透過及び遮断で検知することに限定され
るものではな(、例えば、磁気的にプランジャの上下動
作を検知するようにしてもよい。
Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, the present invention is not limited to detecting the movement of each plunger by transmitting or blocking light (for example, the vertical movement of the plunger may be detected magnetically).

以上の説明では主として本発明者によってなされた発明
をその背景となった利用分野である半導体装置のマルチ
プランジャモールド装置に適用した場合につい℃説明し
たが、それに限定されるものではなく、プランジャが単
数であるモールド装置にも適用することができるもので
ある。
In the above explanation, the invention made by the present inventor is mainly applied to a multi-plunger molding device for semiconductor devices, which is the background field of application. The present invention can also be applied to a molding device.

〔発明の効果〕〔Effect of the invention〕

本願におい℃開示される発明のうち代表的なものによっ
て得られる効果を簡単に説明丁れば、下記のとおりであ
る。
A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

すなわち、各々のプランジャについ℃スリーブ抵抗の大
小を検出することができるので、早期にプランジャある
いはポットの摩耗を検知し、モールド製品の均一化を図
ることができるという効果が得られるものである。
That is, since it is possible to detect the magnitude of the °C sleeve resistance for each plunger, it is possible to detect wear of the plunger or pot at an early stage, and to achieve the effect that the molded product can be made uniform.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例であるモールド装置の概略構
成図、 第2図は第1図のモールド装置の拡大断面図、wc3図
、第4図は従来のモールド装置の説明図である。 1・・・下金型、2・・・上金型、3・・・キャビティ
、4・・・ポット、5・・・ゲート、6・・・プランジ
ャ、7・・・レジン、8・・・プランジャホルダ、9・
・・トランスファシリンダ、10・・・バッキングプレ
ート、11・・・バネ、12・・・座、13・・・検出
ピン、14・・・ホール、15・・・検出器ホルダ、1
6・・・発光器、17・・・受光器、18・・・ストッ
パ、19・・・スライド軸。 、−゛・。 代理人 弁理士 小 川 勝 男(°:第  1  図 第  2  図
Fig. 1 is a schematic configuration diagram of a molding device that is an embodiment of the present invention, Fig. 2 is an enlarged cross-sectional view of the molding device shown in Fig. 1, and Figs. 3 and 4 are explanatory diagrams of a conventional molding device. . 1...Lower mold, 2...Upper mold, 3...Cavity, 4...Pot, 5...Gate, 6...Plunger, 7...Resin, 8... Plunger holder, 9.
...Transfer cylinder, 10...Backing plate, 11...Spring, 12...Seat, 13...Detection pin, 14...Hole, 15...Detector holder, 1
6... Emitter, 17... Light receiver, 18... Stopper, 19... Slide shaft. ,−゛・. Agent: Patent Attorney Katsuo Ogawa (°: Figure 1 Figure 2

Claims (1)

【特許請求の範囲】 1、上下両金型のパーティング面で構成した多数のキャ
ビティと、下金型に形成した複数の円筒状ポットと、前
記ポットに対応して設けられた複数本のプランジャとを
有するモールド装置において、前記各プランジャごとに
その摺動動作を測定する機構を有するモールド装置。 2、プランジャの摺動動作を測定する機構は、プランジ
ャ自体あるいはプランジャと一体的に動く部材の上下動
作の作用により、遮光あるいは透過するように所定位置
に配設された発光装置及びそれに対向して設けられた受
光装置からなる特許請求の範囲第1項記載のモールド装
置。
[Scope of Claims] 1. A large number of cavities formed by the parting surfaces of both upper and lower molds, a plurality of cylindrical pots formed in the lower mold, and a plurality of plungers provided corresponding to the pots. A molding device comprising: a mechanism for measuring the sliding motion of each of the plungers. 2. The mechanism for measuring the sliding motion of the plunger includes a light emitting device disposed at a predetermined position and a light emitting device placed at a predetermined position so as to block or transmit light by the action of the vertical movement of the plunger itself or a member that moves integrally with the plunger. The molding device according to claim 1, comprising a light receiving device.
JP61251742A 1986-10-24 1986-10-24 Mold device Expired - Fee Related JP2538890B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61251742A JP2538890B2 (en) 1986-10-24 1986-10-24 Mold device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61251742A JP2538890B2 (en) 1986-10-24 1986-10-24 Mold device

Publications (2)

Publication Number Publication Date
JPS63107522A true JPS63107522A (en) 1988-05-12
JP2538890B2 JP2538890B2 (en) 1996-10-02

Family

ID=17227255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61251742A Expired - Fee Related JP2538890B2 (en) 1986-10-24 1986-10-24 Mold device

Country Status (1)

Country Link
JP (1) JP2538890B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01146919U (en) * 1988-03-31 1989-10-11
WO2001002153A1 (en) * 1999-06-30 2001-01-11 Husky Injection Molding Systems Ltd. Failsafe shooting pot actuator for an injection molding machine
JP2009202507A (en) * 2008-02-29 2009-09-10 Nec Corp Plastics injection device, plastic injection method, plastic injection program and recording medium
CN107718445A (en) * 2017-11-07 2018-02-23 歌尔股份有限公司 Product structure detection device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61181708U (en) * 1985-05-01 1986-11-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61181708U (en) * 1985-05-01 1986-11-13

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01146919U (en) * 1988-03-31 1989-10-11
WO2001002153A1 (en) * 1999-06-30 2001-01-11 Husky Injection Molding Systems Ltd. Failsafe shooting pot actuator for an injection molding machine
US6276916B1 (en) 1999-06-30 2001-08-21 Husky Injection Molding Systems Ltd. Failsafe shooting pot actuator for an injection molding machine
JP2009202507A (en) * 2008-02-29 2009-09-10 Nec Corp Plastics injection device, plastic injection method, plastic injection program and recording medium
CN107718445A (en) * 2017-11-07 2018-02-23 歌尔股份有限公司 Product structure detection device

Also Published As

Publication number Publication date
JP2538890B2 (en) 1996-10-02

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