JPS63107054A - リ−ドフレ−ム材料 - Google Patents

リ−ドフレ−ム材料

Info

Publication number
JPS63107054A
JPS63107054A JP25241686A JP25241686A JPS63107054A JP S63107054 A JPS63107054 A JP S63107054A JP 25241686 A JP25241686 A JP 25241686A JP 25241686 A JP25241686 A JP 25241686A JP S63107054 A JPS63107054 A JP S63107054A
Authority
JP
Japan
Prior art keywords
copper
lead frame
rolling
subjected
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25241686A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582979B2 (enExample
Inventor
Katsuyoshi Wakamoto
若本　勝嘉
Yoshiaki Ogawa
義明 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP25241686A priority Critical patent/JPS63107054A/ja
Publication of JPS63107054A publication Critical patent/JPS63107054A/ja
Publication of JPH0582979B2 publication Critical patent/JPH0582979B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP25241686A 1986-10-23 1986-10-23 リ−ドフレ−ム材料 Granted JPS63107054A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25241686A JPS63107054A (ja) 1986-10-23 1986-10-23 リ−ドフレ−ム材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25241686A JPS63107054A (ja) 1986-10-23 1986-10-23 リ−ドフレ−ム材料

Publications (2)

Publication Number Publication Date
JPS63107054A true JPS63107054A (ja) 1988-05-12
JPH0582979B2 JPH0582979B2 (enExample) 1993-11-24

Family

ID=17237048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25241686A Granted JPS63107054A (ja) 1986-10-23 1986-10-23 リ−ドフレ−ム材料

Country Status (1)

Country Link
JP (1) JPS63107054A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02145755A (ja) * 1988-11-28 1990-06-05 Kobe Steel Ltd 樹脂との接合性が良好なリードフレーム材の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58191456A (ja) * 1982-04-30 1983-11-08 Nippon Gakki Seizo Kk 半導体用リ−ドフレ−ム及びその製法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58191456A (ja) * 1982-04-30 1983-11-08 Nippon Gakki Seizo Kk 半導体用リ−ドフレ−ム及びその製法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02145755A (ja) * 1988-11-28 1990-06-05 Kobe Steel Ltd 樹脂との接合性が良好なリードフレーム材の製造方法

Also Published As

Publication number Publication date
JPH0582979B2 (enExample) 1993-11-24

Similar Documents

Publication Publication Date Title
US3999955A (en) Strip for lead frames
JPH07231161A (ja) プリント配線板用銅箔およびその製造方法
US7488408B2 (en) Tin-plated film and method for producing the same
US4917967A (en) Multiple-layered article and method of making same
JP2008115449A (ja) 金バンプ又は金配線形成用非シアン系電解金めっき浴
JP2014221941A (ja) めっき膜の製造方法
US4055062A (en) Process for manufacturing strip lead frames
JPS63107054A (ja) リ−ドフレ−ム材料
JPH08277485A (ja) 印刷回路用銅箔の製造方法
JP3667926B2 (ja) 金／ニッケル／ニッケル３層めっき銅合金電子部品およびその製造方法
JP2005105307A (ja) リフローＳｎめっき部材、前記部材の製造方法、および前記部材が用いられた電気電子機器用部品
JPH07116573B2 (ja) リードフレーム用Ｃｕ系条材の製造方法
JPS6340865B2 (enExample)
JP2529774B2 (ja) 半導体装置リ―ドフレ―ム材料及びその製造方法
JP3262929B2 (ja) 金合金メッキ液
JPS61151914A (ja) 接触子
JPH0368788A (ja) リードフレーム用銅条の製造方法
JPS6142941A (ja) 半導体用リ−ドフレ−ム
JPS5944396B2 (ja) 錫めつき銅線の製造法
JP2542735B2 (ja) 半導体リ―ドフレ―ム材料及びその製造方法
JPS63109191A (ja) 置換防止剤
KR800001622B1 (ko) 리이드 프레임용 금속 스트립
JPH0356319B2 (enExample)
JPH0394095A (ja) 錫および錫合金めっき材
JPH03243789A (ja) 耐食性，はんだ性，密着性にすぐれたＣｕ系被覆処理Ｃｒ含有鋼板