JPS63106133U - - Google Patents
Info
- Publication number
- JPS63106133U JPS63106133U JP1986200082U JP20008286U JPS63106133U JP S63106133 U JPS63106133 U JP S63106133U JP 1986200082 U JP1986200082 U JP 1986200082U JP 20008286 U JP20008286 U JP 20008286U JP S63106133 U JPS63106133 U JP S63106133U
- Authority
- JP
- Japan
- Prior art keywords
- recessed hole
- semiconductor device
- narrower
- bonding
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/019—
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- H10W72/07502—
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- H10W72/07551—
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- H10W72/07553—
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- H10W72/50—
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- H10W72/531—
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- H10W72/536—
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- H10W72/5363—
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- H10W72/59—
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- H10W72/884—
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- H10W72/90—
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- H10W72/934—
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- H10W90/736—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986200082U JPS63106133U (cg-RX-API-DMAC10.html) | 1986-12-26 | 1986-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986200082U JPS63106133U (cg-RX-API-DMAC10.html) | 1986-12-26 | 1986-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63106133U true JPS63106133U (cg-RX-API-DMAC10.html) | 1988-07-08 |
Family
ID=31162264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986200082U Pending JPS63106133U (cg-RX-API-DMAC10.html) | 1986-12-26 | 1986-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63106133U (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005026691A (ja) * | 2003-07-01 | 2005-01-27 | Stmicroelectronics Inc | ボールボンディングにおいて小径ワイヤにより構成されたボンドの強度を増加するシステム及び方法 |
| JP2010171107A (ja) * | 2009-01-21 | 2010-08-05 | Renesas Electronics Corp | 半導体装置及びその製造方法 |
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1986
- 1986-12-26 JP JP1986200082U patent/JPS63106133U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005026691A (ja) * | 2003-07-01 | 2005-01-27 | Stmicroelectronics Inc | ボールボンディングにおいて小径ワイヤにより構成されたボンドの強度を増加するシステム及び方法 |
| JP2010171107A (ja) * | 2009-01-21 | 2010-08-05 | Renesas Electronics Corp | 半導体装置及びその製造方法 |
| US8350392B2 (en) | 2009-01-21 | 2013-01-08 | Renesas Electronics Corporation | Semiconductor device having recess with varying width and method of manufacturing the same |