JPS63106130U - - Google Patents
Info
- Publication number
- JPS63106130U JPS63106130U JP1986200081U JP20008186U JPS63106130U JP S63106130 U JPS63106130 U JP S63106130U JP 1986200081 U JP1986200081 U JP 1986200081U JP 20008186 U JP20008186 U JP 20008186U JP S63106130 U JPS63106130 U JP S63106130U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- metal particles
- back electrode
- utility
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986200081U JPS63106130U (enExample) | 1986-12-26 | 1986-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986200081U JPS63106130U (enExample) | 1986-12-26 | 1986-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63106130U true JPS63106130U (enExample) | 1988-07-08 |
Family
ID=31162262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986200081U Pending JPS63106130U (enExample) | 1986-12-26 | 1986-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63106130U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339354A (ja) * | 2005-06-01 | 2006-12-14 | Tdk Corp | 半導体ｉｃ及びその製造方法、並びに、半導体ｉｃ内蔵モジュール及びその製造方法 |
-
1986
- 1986-12-26 JP JP1986200081U patent/JPS63106130U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006339354A (ja) * | 2005-06-01 | 2006-12-14 | Tdk Corp | 半導体ｉｃ及びその製造方法、並びに、半導体ｉｃ内蔵モジュール及びその製造方法 |