JPS63105357U - - Google Patents

Info

Publication number
JPS63105357U
JPS63105357U JP20195586U JP20195586U JPS63105357U JP S63105357 U JPS63105357 U JP S63105357U JP 20195586 U JP20195586 U JP 20195586U JP 20195586 U JP20195586 U JP 20195586U JP S63105357 U JPS63105357 U JP S63105357U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
lead frame
sealed
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20195586U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0510367Y2 (US20070244113A1-20071018-C00087.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986201955U priority Critical patent/JPH0510367Y2/ja
Publication of JPS63105357U publication Critical patent/JPS63105357U/ja
Application granted granted Critical
Publication of JPH0510367Y2 publication Critical patent/JPH0510367Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1986201955U 1986-12-25 1986-12-25 Expired - Lifetime JPH0510367Y2 (US20070244113A1-20071018-C00087.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986201955U JPH0510367Y2 (US20070244113A1-20071018-C00087.png) 1986-12-25 1986-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986201955U JPH0510367Y2 (US20070244113A1-20071018-C00087.png) 1986-12-25 1986-12-25

Publications (2)

Publication Number Publication Date
JPS63105357U true JPS63105357U (US20070244113A1-20071018-C00087.png) 1988-07-08
JPH0510367Y2 JPH0510367Y2 (US20070244113A1-20071018-C00087.png) 1993-03-15

Family

ID=31165892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986201955U Expired - Lifetime JPH0510367Y2 (US20070244113A1-20071018-C00087.png) 1986-12-25 1986-12-25

Country Status (1)

Country Link
JP (1) JPH0510367Y2 (US20070244113A1-20071018-C00087.png)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4919353A (US20070244113A1-20071018-C00087.png) * 1972-06-14 1974-02-20
JPS5610950A (en) * 1979-07-05 1981-02-03 Nec Corp Lead wire for semiconductor device
JPS5753969A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Semiconductor device
JPS5814544A (ja) * 1981-07-17 1983-01-27 Nec Corp モノリシツク集積回路容器
JPS59151447U (ja) * 1983-03-29 1984-10-11 日本電気株式会社 硝子封止型パツケ−ジ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4919353A (US20070244113A1-20071018-C00087.png) * 1972-06-14 1974-02-20
JPS5610950A (en) * 1979-07-05 1981-02-03 Nec Corp Lead wire for semiconductor device
JPS5753969A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Semiconductor device
JPS5814544A (ja) * 1981-07-17 1983-01-27 Nec Corp モノリシツク集積回路容器
JPS59151447U (ja) * 1983-03-29 1984-10-11 日本電気株式会社 硝子封止型パツケ−ジ

Also Published As

Publication number Publication date
JPH0510367Y2 (US20070244113A1-20071018-C00087.png) 1993-03-15

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