JPS63105356U - - Google Patents
Info
- Publication number
- JPS63105356U JPS63105356U JP20385286U JP20385286U JPS63105356U JP S63105356 U JPS63105356 U JP S63105356U JP 20385286 U JP20385286 U JP 20385286U JP 20385286 U JP20385286 U JP 20385286U JP S63105356 U JPS63105356 U JP S63105356U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- die island
- extending
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000725 suspension Substances 0.000 claims 2
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20385286U JPH043508Y2 (en:Method) | 1986-12-25 | 1986-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20385286U JPH043508Y2 (en:Method) | 1986-12-25 | 1986-12-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63105356U true JPS63105356U (en:Method) | 1988-07-08 |
| JPH043508Y2 JPH043508Y2 (en:Method) | 1992-02-04 |
Family
ID=31169571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20385286U Expired JPH043508Y2 (en:Method) | 1986-12-25 | 1986-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH043508Y2 (en:Method) |
-
1986
- 1986-12-25 JP JP20385286U patent/JPH043508Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH043508Y2 (en:Method) | 1992-02-04 |