JPS6310507U - - Google Patents
Info
- Publication number
- JPS6310507U JPS6310507U JP10582386U JP10582386U JPS6310507U JP S6310507 U JPS6310507 U JP S6310507U JP 10582386 U JP10582386 U JP 10582386U JP 10582386 U JP10582386 U JP 10582386U JP S6310507 U JPS6310507 U JP S6310507U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- superconducting wire
- soldered connection
- stabilized superconducting
- aluminum stabilized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図、第２図はこの考案の一実施例のアルミ
ニウム安定化超電導線の半田付け前および半田付
け後をそれぞれ示す斜視図、第３図は従来のアル
ミニウム安定化超電導線の半田付け接続部を表す
斜視図である。
図において、１はアルミニウム安定化材、２０
はアルミニウム安定化超電導線、４はメツキ層、
５は半田付け接続部である。尚、図中同一符号は
同一又は相当部分を示す。
Figures 1 and 2 are perspective views showing an aluminum stabilized superconducting wire according to an embodiment of this invention before and after soldering, respectively, and Figure 3 is a soldered connection of a conventional aluminum stabilized superconducting wire. FIG. In the figure, 1 is an aluminum stabilizing material, 20
is an aluminum stabilized superconducting wire, 4 is a plating layer,
5 is a soldered connection part. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
を有する起電導電磁石において、上記アルミニウ
ム安定化超電導線の外表面にアルミニウム以外の
金属をメツキした後、半田付け接続を行つたこと
を特徴とする超電導電磁石。 A superconducting electromagnet having a soldered connection portion of an aluminum stabilized superconducting wire, characterized in that the outer surface of the aluminum stabilized superconducting wire is plated with a metal other than aluminum and then the soldered connection is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10582386U JPS6310507U (en) | 1986-07-08 | 1986-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10582386U JPS6310507U (en) | 1986-07-08 | 1986-07-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6310507U true JPS6310507U (en) | 1988-01-23 |
Family
ID=30980614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10582386U Pending JPS6310507U (en) | 1986-07-08 | 1986-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6310507U (en) |
-
1986
- 1986-07-08 JP JP10582386U patent/JPS6310507U/ja active Pending