JPS63104683A - Coating method for resin film - Google Patents

Abstract

PURPOSE:To diffuse a resin onto a substrate surface and to form a resin film having a uniform thickness by blowing air or inert gas from plural pieces of nozzles to the resin which is discharged from a dispenser onto the substrate surface. CONSTITUTION:A needle 4 of the dispenser which discharges the coating resin 2 is held and mounted perpendicularly to an arm 7. For example, the resin 2 is discharged onto the substrate 1 to be coated on a stage 3 from the needle 4 while the arm 7 is moved in an X-axis direction. The air or inert gas is blown from the nozzles 5, 6 disposed to the arm 7 to the resin 2 discharged onto the substrate 1. The resin 2 is diffused in an X-axis direction by the effect of the gaseous pressure by which the resin film 9 of a uniform thickness is formed on the substrate 1.

Description

[Detailed description of the invention] [Industrial application field] The present invention is a method for forming a film by coating a substrate with a resin.

In particular, it relates to a coating method using a dispenser.

[Conventional technology]

Conventionally, when the target object is a disk, resin 12 is applied to the center of the disk 11 on a stage 13, and the disk 11 is rotated and centrifuged. There are methods of applying by force and methods of applying by moving a dispenser in the X, Y, Z, and θ-axis directions.

[Problem that the invention seeks to solve]

In the conventional coating method using centrifugal force described above, the target substrate is limited to a circular plate, and if the substrate surface is uneven or the center of gravity is uneven, it is difficult to uniformly spread the resin using centrifugal force. Have difficulty. Further, in the conventional coating method using a dispenser, the film thickness varies locally and is poor in uniformity, and there is a limit to the ability to form a thin film due to the inner diameter of the dispenser needle and the adhesion force of the resin to the substrate.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for coating a resin film that is capable of forming a resin film with a uniform thickness.

[Differences between the invention and the prior art]

In contrast to the conventional resin film formation described above, the present invention has an original content in that air or inert gas is ejected from a plurality of nozzles onto the discharged resin.

[Means for solving problems]

The present invention sprays air or inert gas from a plurality of nozzles onto the resin discharged from a dispenser on the substrate surface, and uses the action of the gas pressure to diffuse the resin onto the substrate surface to form a resin film. This is a characteristic resin film coating method.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIG. 2, the needle 4 of the dispenser for discharging the coating resin 2 is held vertically and attached to the arm 7. In the embodiment, in order to move the needle 4 in the X-axis direction, nozzles 5 and 6 that eject air or inert gas are held perpendicularly to the arm 7 on both sides of the needle 4 along the X-axis direction. Arrange. 8 and 8' are screws for fixing the nozzles 5 and 6.

As shown in FIGS. 1 and 2, while moving the arm 7 in the X-axis direction, the coating resin 2 is discharged from the needle 4 onto the surface of the substrate 1 to be coated on the stage 3. Air or inert gas is blown onto the resin 2 through the nozzle 5, and the resin 2 is diffused in the X-axis direction by the action of the gas pressure, thereby forming a resin film 9 on the substrate 1.

The different states of the resin film depend on the viscosity of the resin, the coating conditions, the inner diameter of the nozzle, and the type of gas.

This can be achieved by selecting the pressure, flow rate, nozzle angle, height (Z-axis direction), ejection position, and ejection condition.Also, a different surface of the resin can be obtained by filling a gas with foreign matter or changing the atmosphere. Furthermore, the stage 3 may be heated if necessary.

〔Effect of the invention〕

As explained above, the present invention makes it possible to form a thin resin film with an arbitrary thickness by diffusing the resin discharged from a dispenser onto a substrate by the action of gas pressure, and also allows the resin to be Because the gas pressure from the nozzle is applied to force the dispersion, the dispenser pitch can be made larger than before, which has the effect of shortening the manufacturing time and reducing the amount of resin used for the same product. be.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view showing the method of forming a coating film according to the present invention;
FIG. 2 is a configuration diagram showing an embodiment of a coating mechanism according to the present invention, and FIG. 3 is a sectional view showing an example of a conventional coating film forming method.

Claims (1)

[Claims] (1) Spraying air or inert gas from multiple nozzles onto the resin on the substrate surface discharged from the dispenser,
A method for applying a resin film, characterized in that the resin is diffused onto the surface of a substrate by the action of the gas pressure to form a resin film.