JPS6310280Y2 - - Google Patents
Info
- Publication number
- JPS6310280Y2 JPS6310280Y2 JP8085583U JP8085583U JPS6310280Y2 JP S6310280 Y2 JPS6310280 Y2 JP S6310280Y2 JP 8085583 U JP8085583 U JP 8085583U JP 8085583 U JP8085583 U JP 8085583U JP S6310280 Y2 JPS6310280 Y2 JP S6310280Y2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- lead
- layer
- tin
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002131 composite material Substances 0.000 claims description 16
- 239000011888 foil Substances 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 239000002985 plastic film Substances 0.000 claims description 11
- 229920006255 plastic film Polymers 0.000 claims description 11
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 27
- 229910052718 tin Inorganic materials 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 229920003023 plastic Polymers 0.000 description 11
- 239000004033 plastic Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 9
- 238000005260 corrosion Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 239000012212 insulator Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 4
- -1 polyethylene, ethylene propylene Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910020282 Pb(OH) Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910001245 Sb alloy Inorganic materials 0.000 description 2
- 240000005572 Syzygium cordatum Species 0.000 description 2
- 235000006650 Syzygium cordatum Nutrition 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000007765 extrusion coating Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910000004 White lead Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8085583U JPS59187439U (ja) | 1983-05-28 | 1983-05-28 | 複合テ−プ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8085583U JPS59187439U (ja) | 1983-05-28 | 1983-05-28 | 複合テ−プ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59187439U JPS59187439U (ja) | 1984-12-12 |
| JPS6310280Y2 true JPS6310280Y2 (US20080094685A1-20080424-C00004.png) | 1988-03-28 |
Family
ID=30210831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8085583U Granted JPS59187439U (ja) | 1983-05-28 | 1983-05-28 | 複合テ−プ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59187439U (US20080094685A1-20080424-C00004.png) |
-
1983
- 1983-05-28 JP JP8085583U patent/JPS59187439U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59187439U (ja) | 1984-12-12 |
