JPS63100802U - - Google Patents
Info
- Publication number
- JPS63100802U JPS63100802U JP10315986U JP10315986U JPS63100802U JP S63100802 U JPS63100802 U JP S63100802U JP 10315986 U JP10315986 U JP 10315986U JP 10315986 U JP10315986 U JP 10315986U JP S63100802 U JPS63100802 U JP S63100802U
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- metal film
- substrate
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 238000005187 foaming Methods 0.000 claims 1
- 239000004088 foaming agent Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Adjustable Resistors (AREA)
Description
第１図は考案の実施例に示す金属皮膜抵抗体の
平面図、第２図は応力試験の方法を示す図、第３
図は冶具の荷重と抵抗変化率の関係を示す図であ
る。
１：基板、２：抵抗体部、３：引出し端子部、
４：リード線、５：リード線接続部、６：加圧試
験治具、７：ゴム板、８：保護膜。
Fig. 1 is a plan view of a metal film resistor shown in an embodiment of the invention, Fig. 2 is a diagram showing a stress test method, and Fig. 3 is a plan view of a metal film resistor shown in an embodiment of the invention.
The figure is a diagram showing the relationship between the load of the jig and the rate of change in resistance. 1: Board, 2: Resistor part, 3: Output terminal part,
4: Lead wire, 5: Lead wire connection part, 6: Pressure test jig, 7: Rubber plate, 8: Protective film.
補正 昭６３．１．３０ 考案の名称を次のように補正する。 考案の名称 金属皮膜抵抗体Correction: 1986.1.30 The name of the invention is amended as follows. Name of invention Metal film resistor
Claims (1)
む熱硬化性樹脂の接着剤を発泡硬化させた合成樹
脂皮膜層面上に化学めつきで抵抗体素子部と引出
し端子部を一体に形成し、前記抵抗体素子部を保
護皮膜で覆つたことを特徴とする金属皮膜抵抗体
。 (2) 基板がポリイミド、ポリエステル、ポリア
ミド、フツ素のいずれか１種の樹脂基板からなる
ことを特徴とする実用新案登録請求の範囲第１項
記載の金属被膜抵抗体。 (3) 抵抗体がＮｉ系合金であることを特徴とす
る実用新案登録請求の範囲第１項又は第２項記載
の金属被膜抵抗体。[Claims for Utility Model Registration] (1) Resistor element parts and drawers are formed by chemical plating on at least one side of the substrate a synthetic resin film layer formed by foaming and hardening a thermosetting resin adhesive containing foaming agent powder. A metal film resistor characterized in that a terminal portion is integrally formed and the resistor element portion is covered with a protective film. (2) The metal film resistor according to claim 1, wherein the substrate is made of a resin substrate of any one of polyimide, polyester, polyamide, and fluorine. (3) The metal film resistor according to claim 1 or 2 of the utility model registration claim, wherein the resistor is made of a Ni-based alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10315986U JPS63100802U (en) | 1986-07-07 | 1986-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10315986U JPS63100802U (en) | 1986-07-07 | 1986-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63100802U true JPS63100802U (en) | 1988-06-30 |
Family
ID=30975451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10315986U Pending JPS63100802U (en) | 1986-07-07 | 1986-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63100802U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113867A (en) * | 1978-02-27 | 1979-09-05 | Hitachi Ltd | Method of producing resistanceeequipped printed circuit board |
| JPS58148495A (en) * | 1982-02-27 | 1983-09-03 | 松下電工株式会社 | Method of surface treating additive board |
| JPS6148570A (en) * | 1984-08-10 | 1986-03-10 | Mitsubishi Electric Corp | Formation of conductor layer onto resin |
-
1986
- 1986-07-07 JP JP10315986U patent/JPS63100802U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54113867A (en) * | 1978-02-27 | 1979-09-05 | Hitachi Ltd | Method of producing resistanceeequipped printed circuit board |
| JPS58148495A (en) * | 1982-02-27 | 1983-09-03 | 松下電工株式会社 | Method of surface treating additive board |
| JPS6148570A (en) * | 1984-08-10 | 1986-03-10 | Mitsubishi Electric Corp | Formation of conductor layer onto resin |
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