JPS6310060U - - Google Patents
Info
- Publication number
- JPS6310060U JPS6310060U JP1986103930U JP10393086U JPS6310060U JP S6310060 U JPS6310060 U JP S6310060U JP 1986103930 U JP1986103930 U JP 1986103930U JP 10393086 U JP10393086 U JP 10393086U JP S6310060 U JPS6310060 U JP S6310060U
- Authority
- JP
- Japan
- Prior art keywords
- friction coefficient
- bottom plate
- semiconductor wafers
- polishing jig
- surface friction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims 5
- 235000012431 wafers Nutrition 0.000 claims 5
- 238000005530 etching Methods 0.000 claims 1
- 238000000992 sputter etching Methods 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986103930U JPS6310060U (is) | 1986-07-07 | 1986-07-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986103930U JPS6310060U (is) | 1986-07-07 | 1986-07-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6310060U true JPS6310060U (is) | 1988-01-22 |
Family
ID=30976946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986103930U Pending JPS6310060U (is) | 1986-07-07 | 1986-07-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6310060U (is) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001198814A (ja) * | 2000-01-18 | 2001-07-24 | Disco Abrasive Syst Ltd | 板状物研削装置及び板状物研削方法 |
-
1986
- 1986-07-07 JP JP1986103930U patent/JPS6310060U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001198814A (ja) * | 2000-01-18 | 2001-07-24 | Disco Abrasive Syst Ltd | 板状物研削装置及び板状物研削方法 |
JP4549471B2 (ja) * | 2000-01-18 | 2010-09-22 | 株式会社ディスコ | 板状物研削装置及び板状物研削方法 |