JPS6298977A - Solid state image pickup device - Google Patents
Solid state image pickup deviceInfo
- Publication number
- JPS6298977A JPS6298977A JP60238917A JP23891785A JPS6298977A JP S6298977 A JPS6298977 A JP S6298977A JP 60238917 A JP60238917 A JP 60238917A JP 23891785 A JP23891785 A JP 23891785A JP S6298977 A JPS6298977 A JP S6298977A
- Authority
- JP
- Japan
- Prior art keywords
- state image
- image pickup
- solid state
- solid
- pickup element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【発明の詳細な説明】
〔概要〕
各画素の受光部が光の不感部により2次元的に隔てられ
ている2次元固体撮像素子を圧電素子により受光面を2
次元的に変位させることにより、簡単な構成で高解像度
の画像が得られる固体撮像装置を提起する。[Detailed Description of the Invention] [Summary] A two-dimensional solid-state image sensor in which the light-receiving part of each pixel is two-dimensionally separated by a light-insensitive part is divided into two light-receiving surfaces by a piezoelectric element.
We propose a solid-state imaging device that can obtain high-resolution images with a simple configuration by dimensional displacement.
本発明は圧電変位素子により表示画素数を増加した高解
像度固体撮像装置に関する。The present invention relates to a high-resolution solid-state imaging device in which the number of display pixels is increased using piezoelectric displacement elements.
固体描像装置開発の課題として画像の高解像度化があげ
られる。そのために、
■ 固体撮像素子の多画素化
■ 圧電素子による固体撮像素子の変位を利用した走査
等の対策が行われている。Increasing the resolution of images is an issue in the development of solid-state imaging devices. To this end, countermeasures such as (1) increasing the number of pixels in the solid-state image sensor (2) scanning using displacement of the solid-state image sensor using a piezoelectric element are being taken.
■の対策は固体撮像素子をより高集積化する必要があり
、ウェハサイズやプロセス上の制約がある。Countermeasure (2) requires higher integration of solid-state image sensors, and there are restrictions on wafer size and process.
■の対策は簡単な方法で画素数を増加できるが従来の固
体撮像素子では1方向だけしか変位できず、従って解像
度(画素数)の増加は1方向のみとなっている。従って
この方法を利用してさらに高解像度化が望まれる。As for countermeasure (2), the number of pixels can be increased by a simple method, but the conventional solid-state image sensor can only be displaced in one direction, so the resolution (number of pixels) can only be increased in one direction. Therefore, it is desired to use this method to achieve even higher resolution.
第6図は従来の2次元間体撮像素子の平面図である。 FIG. 6 is a plan view of a conventional two-dimensional interbody image sensor.
一般に、固体撮像素子においては各画素の受光部は隙間
なく隣接しているわけではない。図のように受光部の隣
に転送部があると必然的に受光部間に隙間が生ずるが、
隙間は1方向のみにあるものが主流である。Generally, in a solid-state image sensor, the light receiving portions of each pixel are not adjacent to each other without any gaps. If there is a transfer section next to the light receiving section as shown in the figure, there will inevitably be a gap between the light receiving sections.
Generally, the gap is in only one direction.
このような固体撮像素子に前記■の対策を施すと1方向
だけしか変位できず、従って解像度の増加は1方向のみ
となる。If such a solid-state image sensing device is subjected to the above-mentioned measure (2), it can only be displaced in one direction, and therefore the resolution can only be increased in one direction.
従来の2次元間体撮像装置では垂直、水平の2方向の解
像度を向上することができなかった。Conventional two-dimensional interbody imaging devices have been unable to improve resolution in two directions, vertical and horizontal.
上記問題点の解決は、各画素の受光部が光の不感部によ
り2次元的に隔てられている2次元間体撮像素子が、そ
の受光面に平行な2方向に変位可能なように、該2次元
間体撮像素子に圧電変位素子が配設されてなる本発明に
よる固体撮像装置、さらに、前記圧電変位素子の駆動電
圧の波形の位相をずらすことにより、前記受光部が変位
前の前記光の不感部内を順次移動し、移動した各位置で
の出力を1画素の出力として表示する本発明による固体
撮像装置により達成される。The solution to the above problem is to make the two-dimensional body image sensor, in which the light-receiving part of each pixel is two-dimensionally separated by a light-insensitive part, movable in two directions parallel to the light-receiving surface. The solid-state imaging device according to the present invention includes a piezoelectric displacement element disposed in a two-dimensional interbody imaging element, furthermore, by shifting the phase of the waveform of the drive voltage of the piezoelectric displacement element, the light receiving section can detect the light before displacement. This is achieved by the solid-state imaging device according to the present invention, which sequentially moves within the dead area of the image sensor and displays the output at each moved position as the output of one pixel.
第1図+11、(2)は本発明による固体撮像素子の平
面図、固体撮像装置の斜視図である。FIG. 1+11 (2) is a plan view of a solid-state imaging device and a perspective view of a solid-state imaging device according to the present invention.
第1図(1)の固体撮像素子は、各画素の受光部はx、
Yの2方向に間隔があり、その間隔は1画素の受光部よ
り大きい。In the solid-state image sensor shown in FIG. 1 (1), the light receiving section of each pixel is x,
There is a gap in the two directions of Y, and the gap is larger than the light receiving section of one pixel.
第1図(2)の固体撮像装置は、上記の固体撮像素子l
がx、Yの2方向に変位ができるようにx、Y方向圧電
変位素子2.3を配置して構成される。一本発明は、X
、Y方向圧電変位素子2.3にそれぞれX、Y方向駆動
電圧をあたえ、かつX、Y方向駆動電圧波形の位相をず
らすことにより受光部の間隔(光の不感部)を埋めてゆ
くように変位させ、各受光部の変位中の各位置の出力を
1画素として表示することにより、等価的にX、Y 2
方向の解像度を向上させるようにしたものである。The solid-state imaging device in FIG. 1(2) uses the above-mentioned solid-state imaging device l.
It is constructed by arranging x- and Y-direction piezoelectric displacement elements 2.3 so that it can be displaced in two directions, x and y. One aspect of the present invention is
, by applying X and Y direction drive voltages to the Y direction piezoelectric displacement elements 2.3, respectively, and by shifting the phase of the X and Y direction drive voltage waveforms, the gap between the light receiving parts (light blind area) is filled. By displacing each light receiving part and displaying the output at each position during the displacement as one pixel, X, Y 2
This is to improve the directional resolution.
第2図は本発明の固体撮像装置の構成を示すブロック図
である。FIG. 2 is a block diagram showing the configuration of the solid-state imaging device of the present invention.
図において、固体撮像素子(NXN画素)1にはX、Y
方向圧電変位素子2.3が取り付けら、圧電変位素子ド
ライバ4からの駆動電圧波形により、受光面と平行な2
方向(χ、Y方向)に変位する構成となっている。In the figure, solid-state image sensor (NXN pixels) 1 has X, Y
When the directional piezoelectric displacement element 2.3 is attached, the drive voltage waveform from the piezoelectric displacement element driver 4 causes the directional piezoelectric displacement element 2.3 to move in parallel to the light receiving surface.
It is configured to be displaced in the direction (χ, Y direction).
固体撮像素子lは固体撮像素子ドライバ5により駆動さ
れる。The solid-state image sensor l is driven by a solid-state image sensor driver 5.
固体撮像素子lより出た信号はアンプ、A/Dコンバー
タを経て、フレームメモリ6.7を含む走査変換回路に
入り、ここより高解像度化された画像としてD/Aコン
バータを経てTVに表示される。The signal output from the solid-state image sensor passes through an amplifier and an A/D converter, enters a scan conversion circuit including a frame memory 6.7, and from there is displayed on a TV as a high-resolution image via a D/A converter. Ru.
走査変換回路内のデータセレクタ8は、フレームメモリ
6.7の書込、読出を交互に使うためのものである。A data selector 8 in the scan conversion circuit is used for alternately writing and reading the frame memory 6.7.
第3図はX、Y方向駆動電圧波形の位相を示す波形図で
ある。FIG. 3 is a waveform diagram showing the phases of the X and Y direction drive voltage waveforms.
図示のように、X、Y方向駆動電圧波形の位相は1/2
ずれているので、固体撮像素子1は第4図のように2次
元的な移動を行う。As shown, the phase of the X and Y direction drive voltage waveforms is 1/2
Because of the deviation, the solid-state image sensor 1 moves two-dimensionally as shown in FIG.
第4図は固体撮像素子の受光部の移動を時系列的に示す
平面図である。FIG. 4 is a plan view chronologically showing the movement of the light receiving section of the solid-state image sensor.
図において、受光部は上記の駆動電圧により1〜4の順
に固体撮像素子の1フレームタイム毎に移動する。それ
ぞれのフレームを第1〜第4フレームと呼ぶことにする
と、第3図に示されるように、表示のフレームタイムは
第1〜第4フレームタイムの和で表される。In the figure, the light receiving section is moved in the order of 1 to 4 every frame time of the solid-state image sensor by the above drive voltage. If each frame is called the first to fourth frames, the display frame time is represented by the sum of the first to fourth frame times, as shown in FIG.
そこで、固体撮像素子1を、第3図の第1〜第4フレー
ムの各期間内に蓄積、転送、続出を行って、第2図のフ
レームメモリ6.7に収納しておき、表示時期に第5図
に示されるようにして表示する。Therefore, the solid-state image sensor 1 is stored in the frame memory 6.7 of FIG. 2 by accumulating, transferring, and sequentially outputting it within each period of the first to fourth frames in FIG. It is displayed as shown in FIG.
第5図(1)、(2)は素子配列と表示時の画素配列を
説明する平面図である。FIGS. 5(1) and 5(2) are plan views illustrating the element arrangement and the pixel arrangement during display.
図において、(i、j)画素の第1フレーム出力は(2
i4,2j−1)、第2フレーム出力は(2112J−
1)、第3フレーム出力は(2i、2j)、第4フレー
ム出力は(2i−1,2j)画素として表示する。In the figure, the first frame output of the (i, j) pixel is (2
i4, 2j-1), the second frame output is (2112J-
1) The output of the third frame is displayed as (2i, 2j) and the output of the fourth frame is displayed as (2i-1, 2j) pixels.
以上により、出力画像は2N X 2Nとなり、X、Y
方向とも解像度が2倍になる。As a result of the above, the output image is 2N x 2N, and X, Y
The resolution is doubled in both directions.
以上詳細に説明したように本発明によれば、固体撮像素
子の画素数を増加することなく、X、Y2方向に解像度
を増加でき、固体撮像装置の性能向上に効果がある。As described in detail above, according to the present invention, the resolution can be increased in the two directions of X and Y without increasing the number of pixels of the solid-state imaging device, which is effective in improving the performance of the solid-state imaging device.
第1図(1)、(2)は本発明による固体撮像素子の平
面図、固体撮像装置の斜視図、
第2図は本発明の固体撮像装置の構成を示すブロック図
、
第3図はX、Y方向駆動電圧波形の位相を示す波形図、
第4図は固体↑最像素子の受光部の移動を時系列的に示
す平面図、
第5図(1)、(2)は素子配列と表示時の画素配列を
説明する平面図、
第6図は従来の2次元固体撮像素子の平面図である。
図に・おいて、
1は固体撮像素子、
2はX方向圧電変位素子
3はY方向圧電変位素子
4は圧電変位素子ドライバ、
5は固体撮像素子ドライバ、
6.7はフレームメモリ、
8はデータセレクタ
U、tXq、、氾
(2)固a曙耐f象耗lの、心[専10 。
、$J6ル町の浜手の乎面旧叫装置の心1・改すョ第1
図
Y方n蟻動妃斤波形
、駈1hモ圧り7Wπシ図
竿31望
○ ○〇−を刈)3
保シヒ笈V・・」鳴−金力f=示j稈I力U比べ一一1 (1) and (2) are a plan view and a perspective view of a solid-state imaging device according to the present invention, FIG. 2 is a block diagram showing the configuration of the solid-state imaging device according to the present invention, and FIG. 3 is a , a waveform diagram showing the phase of the Y-direction driving voltage waveform, Figure 4 is a plan view showing the movement of the light receiving part of the solid-state image element in time series, and Figures 5 (1) and (2) are the element arrangement and A plan view illustrating the pixel arrangement during display. FIG. 6 is a plan view of a conventional two-dimensional solid-state image sensor. In the figure, 1 is a solid-state image sensor, 2 is an X-direction piezoelectric displacement element, 3 is a Y-direction piezoelectric displacement element, 4 is a piezoelectric displacement element driver, 5 is a solid-state image sensor driver, 6.7 is a frame memory, and 8 is data. Selector U, tXq, Flood (2) solid a dawn resistance f wear l, heart , $J6 The heart of the old shouting device in Hamate of Le Town 1/Change 1
Diagram Y direction n ant movement hito waveform, cane 1h mo pressure 7Wπ shi figure rod 31 view ○ one
Claims (2)
てられている2次元固体撮像素子が、その受光面に平行
な2方向に変位可能なように、該2次元固体撮像素子に
圧電変位素子が配設されてなることを特徴とする固体撮
像装置。(1) The two-dimensional solid-state image sensor, in which the light-receiving portion of each pixel is two-dimensionally separated by a light-insensitive portion, is configured such that the two-dimensional solid-state image sensor is movable in two directions parallel to the light-receiving surface. A solid-state imaging device characterized in that a piezoelectric displacement element is disposed in the solid-state imaging device.
すことにより、前記受光部が変位前の前記光の不感部内
を順次移動し、移動した各位置での出力を1画素の出力
として表示することを特徴とする特許請求の範囲第1項
記載の固体撮像装置。(2) By shifting the phase of the waveform of the drive voltage of the piezoelectric displacement element, the light receiving section sequentially moves within the light insensitive area before displacement, and the output at each moved position is displayed as the output of one pixel. A solid-state imaging device according to claim 1, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60238917A JPS6298977A (en) | 1985-10-25 | 1985-10-25 | Solid state image pickup device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60238917A JPS6298977A (en) | 1985-10-25 | 1985-10-25 | Solid state image pickup device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6298977A true JPS6298977A (en) | 1987-05-08 |
Family
ID=17037192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60238917A Pending JPS6298977A (en) | 1985-10-25 | 1985-10-25 | Solid state image pickup device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6298977A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01137782A (en) * | 1987-11-24 | 1989-05-30 | Tokyo Electric Co Ltd | Image pickup device |
WO1992022982A1 (en) * | 1991-06-11 | 1992-12-23 | Seiko Epson Corporation | Photoelectric conversion device, image recording device and image recording/reproducing device |
JPH06181546A (en) * | 1991-05-29 | 1994-06-28 | Hoei:Kk | Image pickup device for still picture |
-
1985
- 1985-10-25 JP JP60238917A patent/JPS6298977A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01137782A (en) * | 1987-11-24 | 1989-05-30 | Tokyo Electric Co Ltd | Image pickup device |
JPH06181546A (en) * | 1991-05-29 | 1994-06-28 | Hoei:Kk | Image pickup device for still picture |
WO1992022982A1 (en) * | 1991-06-11 | 1992-12-23 | Seiko Epson Corporation | Photoelectric conversion device, image recording device and image recording/reproducing device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101262552A (en) | Imaging device and driving method thereof | |
JP2760639B2 (en) | Solid-state imaging device and driving method thereof | |
JP2931809B1 (en) | Imaging device | |
JPS6298977A (en) | Solid state image pickup device | |
JPS63284980A (en) | Solid-state image pickup device | |
JP3200276B2 (en) | Imaging device | |
KR930003411A (en) | Charge-coupled imaging device and camera having the imaging device | |
EP0876053A1 (en) | Method for driving a solid state image sensor | |
JP3222687B2 (en) | Solid-state imaging device | |
JPH01300685A (en) | Drive method for solid-state image pickup element | |
JP3983343B2 (en) | Imaging device | |
JP3731732B2 (en) | CCD imaging device and driving method thereof | |
JPH09233394A (en) | Image pickup device | |
JPS6041510B2 (en) | solid-state imaging plate | |
JP3277974B2 (en) | Solid-state imaging device | |
JPH02214817A (en) | Liquid crystal display device and its driving method | |
JP2799003B2 (en) | Driving method of solid-state image sensor | |
JPH01168171A (en) | Image sensor drive circuit | |
JPS63191483A (en) | Solid-state image pickup device | |
JP2666398B2 (en) | Solid-state imaging device and driving method thereof | |
JPH0595515A (en) | Solid-state image pickup element | |
JPH01238384A (en) | Solid-state image pickup device | |
JPH024092A (en) | Picture display device | |
JPH03201883A (en) | Image pickup device | |
JPH01170280A (en) | Solid-state image pickup device |