JPS6298783U - - Google Patents
Info
- Publication number
- JPS6298783U JPS6298783U JP19184285U JP19184285U JPS6298783U JP S6298783 U JPS6298783 U JP S6298783U JP 19184285 U JP19184285 U JP 19184285U JP 19184285 U JP19184285 U JP 19184285U JP S6298783 U JPS6298783 U JP S6298783U
- Authority
- JP
- Japan
- Prior art keywords
- boost compressor
- low pressure
- pipe
- bypass
- pressure air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 2
Description
図面は本考案の一実施例を示すもので、第1図
は圧縮機周辺の配管図、第2図は弁制御機構の回
路図である。
1……低圧空気配管、3……パイロツト弁、4
……昇圧圧縮機本体、5……モータ、6……空気
タンク、8……高圧空気配管、9……圧力スイツ
チ、11……スピードコントローラ、15……バ
イパス配管、16……電磁切替弁、18……圧力
スイツチ、19……タイマ。
The drawings show an embodiment of the present invention; FIG. 1 is a piping diagram around the compressor, and FIG. 2 is a circuit diagram of the valve control mechanism. 1...Low pressure air piping, 3...Pilot valve, 4
... Boost compressor main body, 5 ... Motor, 6 ... Air tank, 8 ... High pressure air piping, 9 ... Pressure switch, 11 ... Speed controller, 15 ... Bypass piping, 16 ... Solenoid switching valve, 18...pressure switch, 19...timer.
Claims (1)
縮して前記低圧空気配管内よりも高圧の空気を吐
出する昇圧圧縮機において、前記低圧空気配管と
昇圧圧縮機の空気タンクとの間に、昇圧圧縮機本
体を迂回するバイパス配管を設け、該バイパス配
管を開閉する切替弁を設け、前記昇圧圧縮機本体
の作動前に前記切替弁を一定時間に亙つて開放す
るとともに、低圧空気配管と昇圧圧縮機本体とを
遮断する制御回路を設けたことを特徴とする昇圧
圧縮機。 In a boost compressor that further compresses compressed air taken in from a low pressure air pipe and discharges air at a higher pressure than in the low pressure air pipe, a boost compressor is provided between the low pressure air pipe and an air tank of the boost compressor. A bypass pipe is provided to bypass the main body, and a switching valve is provided to open and close the bypass pipe, and the switching valve is opened for a certain period of time before the booster compressor main body is operated. A boost compressor characterized by being provided with a control circuit that shuts off the
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985191842U JPH037588Y2 (en) | 1985-12-13 | 1985-12-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985191842U JPH037588Y2 (en) | 1985-12-13 | 1985-12-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6298783U true JPS6298783U (en) | 1987-06-23 |
JPH037588Y2 JPH037588Y2 (en) | 1991-02-25 |
Family
ID=31146358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985191842U Expired JPH037588Y2 (en) | 1985-12-13 | 1985-12-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH037588Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015510254A (en) * | 2011-12-22 | 2015-04-02 | カティーバ, インコーポレイテッド | Gas enclosure assembly and system |
JP2015083782A (en) * | 2013-10-25 | 2015-04-30 | 株式会社日立産機システム | Pressure increasing device |
US10851450B2 (en) | 2008-06-13 | 2020-12-01 | Kateeva, Inc. | Method and apparatus for load-locked printing |
US11489119B2 (en) | 2014-01-21 | 2022-11-01 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
-
1985
- 1985-12-13 JP JP1985191842U patent/JPH037588Y2/ja not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10851450B2 (en) | 2008-06-13 | 2020-12-01 | Kateeva, Inc. | Method and apparatus for load-locked printing |
JP2015510254A (en) * | 2011-12-22 | 2015-04-02 | カティーバ, インコーポレイテッド | Gas enclosure assembly and system |
JP2018200887A (en) * | 2011-12-22 | 2018-12-20 | カティーバ, インコーポレイテッド | Gas enclosure assembly and system |
JP2015083782A (en) * | 2013-10-25 | 2015-04-30 | 株式会社日立産機システム | Pressure increasing device |
US11489119B2 (en) | 2014-01-21 | 2022-11-01 | Kateeva, Inc. | Apparatus and techniques for electronic device encapsulation |
Also Published As
Publication number | Publication date |
---|---|
JPH037588Y2 (en) | 1991-02-25 |
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