JPS6298285U - - Google Patents

Info

Publication number
JPS6298285U
JPS6298285U JP19015685U JP19015685U JPS6298285U JP S6298285 U JPS6298285 U JP S6298285U JP 19015685 U JP19015685 U JP 19015685U JP 19015685 U JP19015685 U JP 19015685U JP S6298285 U JPS6298285 U JP S6298285U
Authority
JP
Japan
Prior art keywords
board
sub
support frame
motherboard
bus line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19015685U
Other languages
Japanese (ja)
Other versions
JPH0427195Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19015685U priority Critical patent/JPH0427195Y2/ja
Publication of JPS6298285U publication Critical patent/JPS6298285U/ja
Application granted granted Critical
Publication of JPH0427195Y2 publication Critical patent/JPH0427195Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第3図はこの考案の一例の斜視図、第
4図〜第7図はその説明のための図である。 10はサブボード、11〜13,22,23は
マウント部品、20はマザーボード、30は支持
枠体である。
FIGS. 1 to 3 are perspective views of an example of this invention, and FIGS. 4 to 7 are illustrations for explaining the same. 10 is a subboard, 11 to 13, 22, and 23 are mounting components, 20 is a motherboard, and 30 is a support frame.

Claims (1)

【実用新案登録請求の範囲】 多相スルーホール基板により形成されたサブボ
ードと、支持枠体と、マザーボードとを有し、 上記サブボードは大きさが規格化され、 上記サブボードにはICないしチツプ部品など
がマウントされるとともに、 上記サブボードの側部に、このサブボードに設
けられている素子に接続された端子が設けられ、 上記支持枠体は上記サブボードに対応した大き
さとされるとともに、 上記支持枠体の内壁の所定位置には、バスライ
ンが設けられ、 上記支持枠体が上記マザーボードにマウントさ
れ、 上記支持枠体により上記サブボードの複数個が
多層構造に支持されるとともに、 上記サブボードが上記端子および上記バスライ
ンを通じて上記サブボードないし上記マザーボー
ドに電気的に接続されているプリント基板。
[Claims for Utility Model Registration] It has a sub-board formed of a multi-phase through-hole board, a support frame, and a motherboard, the sub-board has a standardized size, and the sub-board has an IC or an IC. Chip parts and the like are mounted, terminals connected to elements provided on the sub-board are provided on the side of the sub-board, and the support frame is sized to correspond to the sub-board. Also, a bus line is provided at a predetermined position on the inner wall of the support frame, the support frame is mounted on the motherboard, the plurality of sub-boards are supported by the support frame in a multilayer structure, and . A printed circuit board, wherein the sub-board is electrically connected to the sub-board or the motherboard through the terminals and the bus line.
JP19015685U 1985-12-10 1985-12-10 Expired JPH0427195Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19015685U JPH0427195Y2 (en) 1985-12-10 1985-12-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19015685U JPH0427195Y2 (en) 1985-12-10 1985-12-10

Publications (2)

Publication Number Publication Date
JPS6298285U true JPS6298285U (en) 1987-06-23
JPH0427195Y2 JPH0427195Y2 (en) 1992-06-30

Family

ID=31143114

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19015685U Expired JPH0427195Y2 (en) 1985-12-10 1985-12-10

Country Status (1)

Country Link
JP (1) JPH0427195Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006135088A (en) * 2004-11-05 2006-05-25 Fujitsu Ltd Module circuit unit and electronic apparatus equipped therewith

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006135088A (en) * 2004-11-05 2006-05-25 Fujitsu Ltd Module circuit unit and electronic apparatus equipped therewith
JP4533093B2 (en) * 2004-11-05 2010-08-25 富士通株式会社 MODULE CIRCUIT UNIT AND ELECTRONIC DEVICE MOUNTING IT

Also Published As

Publication number Publication date
JPH0427195Y2 (en) 1992-06-30

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