JPS6298207A - Detecting method for pattern cross-sectional shape - Google Patents
Detecting method for pattern cross-sectional shapeInfo
- Publication number
- JPS6298207A JPS6298207A JP23721485A JP23721485A JPS6298207A JP S6298207 A JPS6298207 A JP S6298207A JP 23721485 A JP23721485 A JP 23721485A JP 23721485 A JP23721485 A JP 23721485A JP S6298207 A JPS6298207 A JP S6298207A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- pattern
- sectional shape
- detected
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はＬＳＩウェハ上等に形成されている微細パター
ンの断面形状および寸法を正確に測定する方法および装
置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method and apparatus for accurately measuring the cross-sectional shape and dimensions of a fine pattern formed on an LSI wafer or the like.
ＬＳＩ等微細なパターンの寸法を測定するために従来公
知の「精密機械４４巻３号１９７８年３月発行Ｐ、 ３
８０〜３８５」に示す測定装置が市販されている。これ
らは第２図（ａ）に示すパターン１０幅ｌを測定するも
のであるが、パターン断面第２図（′ｂ）のどの位置（
例えば’ｌ ＋ ’ｔ ） をパターンの幅として検出
しているのか明確でない。To measure the dimensions of fine patterns such as LSI, there is a conventionally known method known as "Precision Machinery Vol. 44 No. 3 Published March 1978, P. 3.
80-385'' are commercially available. These are used to measure the width l of the pattern 10 shown in FIG. 2(a), but which position (
For example, it is not clear whether 'l + 't) is detected as the width of the pattern.
そこで、パターンの断面形状を測定する方法が特公昭５
９−１９４７９号公報に示されている。しがしこの方法
は、透明なパターンに対しては適用が困難である。Therefore, a method for measuring the cross-sectional shape of a pattern was developed in the
No. 9-19479. However, this method is difficult to apply to transparent patterns.
本発明はパターンの断面形状（すなわちパターンの幅）
を種々の性状のパターンに対しても測定できる方法およ
び装置を提供することにある。The present invention is based on the cross-sectional shape of the pattern (i.e., the width of the pattern).
The object of the present invention is to provide a method and an apparatus that can measure patterns of various properties.
従来の断面測定法を第３図に示す。レーザ光２ｔレンズ
３を通して対物レンズ５に入射させて、絞り込みレーザ
光６を得る。パターン１に′よる反射光はピンホール７
の上に結像し、光検出器８によって検出される。ここで
パターン１を乗せているＸ、△ＺＸステージ図示されて
いない）を第４図（ａ）に示すように△Ｚ方向に変位さ
せると、同図（ｂ）に示すようにあろΔＺの位置Ｚで検
出器８の出力が極大値を示す。このときレーザ光６はパ
ターン１０表面に焦点が合った状態となっている。従っ
てパターン１をＸ方向に移動し各Ｘの値に対してΔＺを
微動させ、検出器出力がピークになる△Ｚの値を求めれ
ば、パターンの断面形状を求めることができる。A conventional cross-sectional measurement method is shown in FIG. A laser beam 2t is made incident on an objective lens 5 through a lens 3 to obtain a focused laser beam 6. The reflected light from pattern 1 is pinhole 7.
is imaged on the photodetector 8 and detected by the photodetector 8. If the X, △ZX stage (not shown) on which pattern 1 is placed is displaced in the △Z direction as shown in Figure 4(a), the position of ΔZ will be as shown in Figure 4(b). At Z, the output of the detector 8 shows a maximum value. At this time, the laser beam 6 is focused on the surface of the pattern 10. Therefore, the cross-sectional shape of the pattern can be determined by moving the pattern 1 in the X direction, slightly moving ΔZ for each X value, and determining the value of ΔZ at which the detector output peaks.
しかしパターン１が（半）透明であるときは、パターン
１０基材９による反射光が強いために、パターン１の表
面で検出器８の出力が極大とならず基材面９で極大にな
る場合がある。この場合、パターン１０表面の断面形状
を求めることができない。However, when the pattern 1 is (semi-)transparent, the output of the detector 8 does not reach its maximum on the surface of the pattern 1 but reaches its maximum on the substrate surface 9 because the light reflected by the pattern 10 and the base material 9 is strong. There is. In this case, the cross-sectional shape of the surface of the pattern 10 cannot be determined.
そこで本発明では、次のように行う。すなわち△Ｚを動
かすと、第５図に示すようにいくつかの極値２． 、２
ｔ、 ２．・・・を有する検出器８の出゛力が求まる。Therefore, in the present invention, the following steps are taken. That is, when ΔZ is moved, several extreme values 2. ,2
t, 2. The output of the detector 8 having ... is determined.
従って上から第１番目にある検出器出力の位置２．を求
めれば、最上層のパターン１の断面形状を求めることが
できる。また第２、第３のピークを求めれば下層のパタ
ーン９゜１０の断面形状を求めることができる。ただし
、下層のパターンはパターン１におおわれているので、
パターン１の屈折率Ｎ、があらかじめ分っていれば、Ｎ
、を断面測定値ｚ２に乗することによって、真の断面形
状を測定することができる。Therefore, the position of the first detector output from the top is 2. By determining , the cross-sectional shape of pattern 1 on the top layer can be determined. Further, by determining the second and third peaks, the cross-sectional shape of the underlying pattern 9°10 can be determined. However, since the lower layer pattern is covered by pattern 1,
If the refractive index N of pattern 1 is known in advance, N
By multiplying the cross-sectional measurement value z2 by , the true cross-sectional shape can be measured.
第１図に実施例を示す。測定対象物１は△ＺＸステージ
０およびＸＹＸステージ１上に置かれている。ΔＺ −
ＸＹＸステージモータＭｚ９Ｍｘ９Ｍｙにより駆動され
る。モータへは駆動回路１２．［により電気信号が供給
される。またステージは位置検出器２１および２２によ
って位置が検出される。レーザ２４から出た光はビーム
拡大器２３によって径を拡大され、レンズ３によって対
物レンズ５に入射する。測定対象物１からの反射光は検
出器８によって検出される。全体系はマイクロコンピュ
ータ１５によって制御される。An example is shown in FIG. A measurement object 1 is placed on a ΔZX stage 0 and an XYX stage 1. ΔZ −
It is driven by an XYX stage motor Mz9Mx9My. Drive circuit 12 to the motor. An electrical signal is supplied by [. Further, the position of the stage is detected by position detectors 21 and 22. The beam emitted from the laser 24 is enlarged in diameter by a beam expander 23, and then enters an objective lens 5 through a lens 3. The reflected light from the measurement object 1 is detected by the detector 8. The entire system is controlled by a microcomputer 15.
測定は次のように行う。Ｘステージを駆動し、ある位置
Ｘに停止する。パターン１の断面位置２、 、２． 、
・・・を求めるためにΔ２ステージを駆動し、検出器８
の出力をＡＤ変換器１４を介して、信号ピーク検出回路
１６で信号のピークを検出する。ピーク値が検出される
と、Δ２ステージの値Ｚｉ（ｉ−１，２＋・・・）をカ
ウンタ徊に入力する。つぎに再びＸステージを動かし、
別の位置ＸにおけるＺｉ （ｉ−１，２，３・・・）を
求める。このようにして求めたＺｉをプロツトすること
により１パターンの断面形状を求めることができる。Measurement is carried out as follows. Drive the X stage and stop at a certain position X. Cross-sectional position 2 of pattern 1, , 2. ,
..., the Δ2 stage is driven, and the detector 8
The signal peak detection circuit 16 detects the peak of the signal via the AD converter 14. When the peak value is detected, the value Zi (i-1, 2+...) of the Δ2 stage is input to the counter. Next, move the X stage again,
Find Zi (i-1, 2, 3...) at another position X. By plotting the Zi thus obtained, the cross-sectional shape of one pattern can be obtained.
本発明により、微細パターンの断面形状を正確に測定し
、従ってパターンの寸法を精度良く検出することができ
る。パターンの寸法測定精度が向上することによってＬ
ＳＩをより歩留り高く製作することができる・
（図面の簡単な説明
第１図は本発明の一実施例の構成図、第２図は従来のパ
ターンの平面図および断面図、第３図は従来の測定装置
の構成図、第４図は第３図の一部の図および検出器出力
図、第５図はパターンの断面図である。According to the present invention, the cross-sectional shape of a fine pattern can be accurately measured, and the dimensions of the pattern can therefore be detected with high precision. L by improving pattern dimension measurement accuracy
SI can be manufactured with higher yield. FIG. 4 is a partial diagram of FIG. 3 and a detector output diagram, and FIG. 5 is a cross-sectional view of a pattern.
２・・・レーザ光、 ５・・・対物レンズ、８
・・・光検出器、１０・・・△ＺＸステージ１１・・・
ＸＹＸステージ１５・・・マイクロコンピュータ。2... Laser light, 5... Objective lens, 8
...Photodetector, 10...△ZX stage 11...
XYX Stage 15...Microcomputer.
、乙パ；・９、, Otsupa;・9,
Claims (1)
した光を光検出器で検出する光学系において、光学系あ
るいは対象物をレンズの光軸方向に移動した際、レーザ
光点の光量が極大に絞り込まれる光学系あるいは対象物
の位置を検出することにより、対象物の光軸方向の位置
を検出し、かつ対象物あるいは光学系をレンズ光軸と垂
直方向に移動しつつ、上述過程をくり返すことによって
対象物の断面形状を測定することを特徴とするパターン
断面形状検出法。1 In an optical system in which the laser beam is narrowed down by an optical system and the light reflected from the object is detected by a photodetector, when the optical system or the object is moved in the direction of the optical axis of the lens, the light intensity of the laser beam spot reaches its maximum. By detecting the position of the optical system or object to be narrowed down, the position of the object in the optical axis direction is detected, and the above process is repeated while moving the object or optical system in the direction perpendicular to the lens optical axis. A pattern cross-sectional shape detection method characterized by measuring the cross-sectional shape of an object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23721485A JPS6298207A (en) | 1985-10-25 | 1985-10-25 | Detecting method for pattern cross-sectional shape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23721485A JPS6298207A (en) | 1985-10-25 | 1985-10-25 | Detecting method for pattern cross-sectional shape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6298207A true JPS6298207A (en) | 1987-05-07 |
Family
ID=17012069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23721485A Pending JPS6298207A (en) | 1985-10-25 | 1985-10-25 | Detecting method for pattern cross-sectional shape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6298207A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08160306A (en) * | 1994-12-02 | 1996-06-21 | Keyence Corp | Optical microscope |
| KR100467307B1 (en) * | 2001-12-13 | 2005-01-24 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Laser drawing apparatus and laser drawing method |
-
1985
- 1985-10-25 JP JP23721485A patent/JPS6298207A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08160306A (en) * | 1994-12-02 | 1996-06-21 | Keyence Corp | Optical microscope |
| KR100467307B1 (en) * | 2001-12-13 | 2005-01-24 | 다이닛뽕스크린 세이조오 가부시키가이샤 | Laser drawing apparatus and laser drawing method |
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