JPS6296855U - - Google Patents
Info
- Publication number
- JPS6296855U JPS6296855U JP18809085U JP18809085U JPS6296855U JP S6296855 U JPS6296855 U JP S6296855U JP 18809085 U JP18809085 U JP 18809085U JP 18809085 U JP18809085 U JP 18809085U JP S6296855 U JPS6296855 U JP S6296855U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat
- semiconductor component
- back surface
- conducting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18809085U JPS6296855U (cs) | 1985-12-05 | 1985-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18809085U JPS6296855U (cs) | 1985-12-05 | 1985-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6296855U true JPS6296855U (cs) | 1987-06-20 |
Family
ID=31139132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18809085U Pending JPS6296855U (cs) | 1985-12-05 | 1985-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6296855U (cs) |
-
1985
- 1985-12-05 JP JP18809085U patent/JPS6296855U/ja active Pending
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