JPS629639Y2 - - Google Patents
Info
- Publication number
- JPS629639Y2 JPS629639Y2 JP17807279U JP17807279U JPS629639Y2 JP S629639 Y2 JPS629639 Y2 JP S629639Y2 JP 17807279 U JP17807279 U JP 17807279U JP 17807279 U JP17807279 U JP 17807279U JP S629639 Y2 JPS629639 Y2 JP S629639Y2
- Authority
- JP
- Japan
- Prior art keywords
- fuse element
- insulating tube
- resistance wire
- inner insulating
- display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000037431 insertion Effects 0.000 claims description 17
- 238000003780 insertion Methods 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17807279U JPS629639Y2 (it) | 1979-12-21 | 1979-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17807279U JPS629639Y2 (it) | 1979-12-21 | 1979-12-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5695050U JPS5695050U (it) | 1981-07-28 |
| JPS629639Y2 true JPS629639Y2 (it) | 1987-03-06 |
Family
ID=29688629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17807279U Expired JPS629639Y2 (it) | 1979-12-21 | 1979-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS629639Y2 (it) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8900995B1 (en) | 2010-10-05 | 2014-12-02 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US8981572B1 (en) | 2011-11-29 | 2015-03-17 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60147143U (ja) * | 1984-03-09 | 1985-09-30 | 株式会社明電舎 | 限流フユ−ズ |
-
1979
- 1979-12-21 JP JP17807279U patent/JPS629639Y2/ja not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8952522B1 (en) | 2002-11-08 | 2015-02-10 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9406645B1 (en) | 2002-11-08 | 2016-08-02 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US8937381B1 (en) | 2009-12-03 | 2015-01-20 | Amkor Technology, Inc. | Thin stackable package and method |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US8900995B1 (en) | 2010-10-05 | 2014-12-02 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
| US8981572B1 (en) | 2011-11-29 | 2015-03-17 | Amkor Technology, Inc. | Conductive pad on protruding through electrode semiconductor device |
| US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5695050U (it) | 1981-07-28 |
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