JPS629612A - Manufacture of plastic film capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a plastic film capacitor comprising at least a metallized plastic film.

BACKGROUND OF THE INVENTION In recent years, methods of manufacturing glass film capacitors have become lighter, thinner, and smaller in line with trends in electrical and electronic equipment. For this reason, it is necessary to reduce the area of the electrode lead-out part and to form the electrode lead-out part more reliably. among them,
The press molding process that ensures element strength and capacity stability determines the molding state of the electrode extension portion under conditions such as pressure and temperature.

Hereinafter, a method for manufacturing the conventional glass film capacitor as described above will be explained with reference to the drawings.

FIG. 4 shows a cross section of a conventional plastic film capacitor in a press molding process. In Fig. 4, numeral 1 represents a dielectric material that stores charge.

Reference numeral 2 designates a metal vapor deposited portion serving as an electrode, 3 designates a gap between the layers into which the sprayed metal as an electrode lead-out portion enters, and 4 designates a press molding die for press molding the plastic film capacitor constituting the 1.2°3. The purpose of the press molding process for plastic film capacitors is to bring the dielectric and metal vapor deposited parts into close contact with each other in the stacking direction using pressure, temperature, etc.

This is a method in which the entire projected area in the lamination direction is sandwiched and molded using a press mold.

Problems to be Solved by the Invention However, in the above method, since the entire projected area in the lamination direction is press-molded, the electrode extension part is also pressurized at the same time, reducing the gap into which the sprayed metal of the electrode extension part enters. , a non-existent φ state occurs, and the metal vapor deposited part and the sprayed metal become in an uncertain fused state. Therefore, there was a problem in that this portion had resistance, making the dielectric contact characteristics unstable.

In view of the above-mentioned problems, the present invention secures a reliable fusion state between the metal vapor deposited part and the sprayed metal by widening the gap between the layers of the electrode lead-out part into which the sprayed metal enters.

The present invention provides a method for manufacturing a plastic film capacitor that can stabilize dielectric loss tangent characteristics.

Means for Solving the Problems To achieve this objective, the method for manufacturing a plastic film capacitor of the present invention employs press molding in which both ends in the width direction facing the electrodes are chamfered in order to widen the gap between the layers into which the sprayed metal enters. It uses a mold.

Effect: This manufacturing method widens the gap between the layers in which the sprayed metal of the electrode lead-out portion enters, ensuring a reliable fusion state between the metal vapor deposited portion and the sprayed metal, and stabilizing the dielectric loss tangent characteristics.

EXAMPLES Hereinafter, examples of the present invention will be described with reference to five drawings. FIG. 1 shows a cross section of a plastic film capacitor in a press molding process according to an embodiment of the present invention. In FIG. 1, 11 is a partially bent dielectric, 12 is a partially bent metal vapor deposited part, 1
3 is the gap between the layers where the sprayed metal enters as the electrode lead-out part, and 14 is the gap between the electrode facing widths 1 and 14 for the purpose of press molding of the plastic film capacitor constituting 11.12.13.
Ensure a short distance of 16 from both ends of the electrode, and set the electrode facing width to 1.
This is a press molding die with chamfers 17 on both ends in five directions.

The press molding process of the above method for manufacturing a plastic film capacitor will be described below.

A one-turn or stacked element is placed between the upper and lower sides of the press molding die 14. Next, press molding is performed while ensuring a short distance from both ends of the electrode facing width 16 so that the sprayed metal part of the electrode extension part is not directly affected by press molding. When molding, apply at least pressure. As a result, the dielectric 11 is bent.

The molded state is such that the gap between the layers into which the sprayed metal of the electrode lead-out portion enters is enlarged.

Next, embodiments and comparative examples of the present invention in which the angle of the chamfer 17 in FIG. 1 is variously changed will be described.

Table 1 shows the trial production conditions of the examples of the present invention and comparative examples.

(Left below) Table 1 and Figure 2 show the dielectric loss tangent characteristics as the prototype results. In the prototype part, since the entire projected area in the lamination direction was press-formed, the electrode lead-out part was also pressurized at the same time, and the gap between the layers where the sprayed metal entered the electrode lead-out part was reduced or did not exist, resulting in poor dielectric contact characteristics. became unstable. In addition, similar to the prototype NIB, the dielectric loss tangent characteristics of the prototype NIB became unstable because the gap between the layers into which the sprayed metal entered was reduced.

Figure 3 shows the results of the DC boost breakdown test of the prototype film capacitor. In the prototype part G, the press-forming die caused stress due to pressure on the metal vapor deposited part at a position that was a short distance from both ends of the electrode facing width, and as a result, the breakdown voltage decreased. Similarly to G, the prototype NILF also suffered from stress due to the pressure of the metal vapor deposited portion, resulting in a decrease in breakdown voltage.

From the test results shown in Figures 2 and 3, the chamfer angle of the press molding die with stable dielectric loss tangent characteristics and withstand voltage characteristics is 5° to 8°.
It was in the range of 0.

In the embodiment shown in FIG. 1, the press molding die 4 is made of metal as the material of the molding means, but reinforced plastic or rubber may be used as the material of the molding means.

Effects of the Invention As described above, the present invention uses a press forming process that widens the gap between the layers in which the sprayed metal enters the electrode lead-out portion.

By using a press-forming mold with chamfered ends in the width direction facing the electrodes, the gap between the layers into which the sprayed metal enters in the electrode lead-out area is widened without significantly damaging the dielectric film, and the gap between the metal vapor deposited area and the sprayed metal layer is widened. It becomes possible to ensure that the metal is in a reliable fused state. As described above, according to the manufacturing method of the present invention, a plastic film capacitor with stable dielectric contact characteristics and high withstand voltage can be provided, and its practical effects are significant.

[Brief explanation of drawings]

Figure 1 is a sectional view of a plastic film capacitor in the press molding process according to an embodiment of the present invention, Figures 2 and 3 are characteristic diagrams for explaining the present invention in detail, and Figure 4 is a conventional plastic film capacitor. FIG. 3 is a cross-sectional view of a film capacitor during a press molding process. 11...Dielectric material, 12...Metal deposition part, 13...Gap, 14...Press molding mold, 15.Old...Electrode opposing width , 17... Chamfer. Name of agent: Patent attorney Toshio Nakao and 1 other person11
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Claims (2)

[Claims] (1) It has a press molding process in which the entire electrode facing width is press-formed with positions a short distance away from both ends of the electrode facing width as both ends of the press molding surface, and both ends in the electrode facing width direction are chamfered. A method for manufacturing a plastic film capacitor, characterized by using a press molding die. (2) The chamfer angle at both ends in the electrode facing width direction is 5° to 80°.
2. The method for manufacturing a plastic film capacitor according to claim 1, characterized in that a press molding die of 100 °C is used.