JPS6295000A - Handling device for pin -grid-array type ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a pin grid array (PIN-GRID-
7) A link device for A-RRAY (hereinafter referred to as PGA) type IC.

[Conventional technology]

When performing various functional tests on PGA type ICs, a handling device is used to take out the PGA type ICs from the pallet.
It is necessary to transport this to the measuring instrument.

By the way, as shown in FIG. 3, the leads 51 of the PGA type IC 50 are concentrated on one end surface, and it is necessary to avoid contact with the leads 51 during transportation.
The C50 uses a ceramic package, and it is necessary to prevent cracks and chips from occurring in the package.

Conventionally, IC lead bends, scratches, package cracks,
In order to avoid chips and the like, ICs were transported in a horizontal plane.

[Problem that the invention seeks to solve]

The lead is bent at right angles and DIP (DU
AL INLI to PAC island GE) type ICs are transported using a dead weight drop transport method, but PGA type ICs are transported in a horizontal plane, so compared to the dead weight drop transport method, the transport time is longer and the processing efficiency is lower. It was bad. Also, PGA type I
If the dead weight drop transport method is adopted as is for transporting ICs, the ICs being transported will collide with each other, causing cracks, chips, etc. in the package.

The present invention solves the above problems and improves processing efficiency.
[Means for solving the problem] The present invention takes out a pin grid array type IC with leads concentrated on one end surface from a pallet, and attaches it to a measuring instrument. In the handling device to be carried in, the conveyance path from the pallet to the measuring instrument is tilted downward, an IC support part is provided on the conveyance path to hold the IC while avoiding contact with the leads, and further, By separating the ICs individually, temporarily stopping them, and opening and closing them between the front and back, the ICs can be separated.
This is a pin grid array type IC handling device characterized by a stop block that sends the pins downward one pitch at a time.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIGS. 1 and 2, the conveyance path 8 is composed of two parallel rails 8α and 8cL, and as shown in FIG. installed in parallel,
Lead 5 of IC50 is attached to the inner end surface of rails 8cL and 8b.
I to fit and hold both edges of IC50 avoiding contact with 1.
A long groove 8b as a C support portion is provided, and the rail 8
A is arranged in a plurality of rows in an inclined position. As shown in FIGS. 4 to 6, an IC mounting table 7 is provided on the upper end side of the rail 8α so as to be convertible between a horizontal position and an inclined position. recessed portions 7a that support both side edges of the IC 500 while avoiding contact with the leads 51;
A gate 31 is provided in front of the IC mounting table 7 so as to be openable and closable. Furthermore, as shown in FIG. 7, the ICs 50 are individually separated along the conveyance path 8, temporarily stopped, and opened and closed between the front and back to feed the ICs 50 downward one pitch at a time. A plurality of them are provided, and the conveyance path 8 is penetrated into the constant temperature bath 9. 3 is a supply section loader that stores and supplies ICs 50 to the pallet 1, 4 is an empty pallet storage section unloader that stores the empty pallet 1, and 6 is a stack that picks up one horizontal row of ICs 50 in the pallet 1 and mounts them on the ICs. A suction pad 5 is used to transfer the empty pallet 1 to the concave portion 7α of the table 7 and to the unloader 4, and 5 is a supply transfer that drives the suction pad 6.

On the other hand, a supply conveyance chain 1° is laid horizontally at the lower end of the conveyance path 10. As shown in FIGS. 9 and 10, the supply conveyance chain 10 includes a pair of endless chains 10b.

10b, a support stand 10α that connects the chains 10b and 10b, a horizontal rod 10c that supports the support stand 10α, an upper end guide 10e that guides the upper end surface of the IC 50 supported on the support stand 1oα, and IC50
It consists of a side edge guide 42 that guides the side edge of the support base 1.
0a.

The chain 710b has the same pitch as the conveyance path 8.

10b and supports the side edge of the IC 50 below while avoiding contact with the leads 51 of the IC 50.
oa! are provided respectively.

Further, at the end of the supply conveyance chain 10, one conveyance path 11 having the same configuration as the conveyance path 8 is installed in an inclined position, and a measuring device 14 is installed in the middle of the conveyance path 11, and IC passage detection is performed. A section 34 is provided with a measuring section positioning block.

Further, at the end of the conveyance path 11, a conveyor chain 15 for storing good products and a conveyor chain 16 for storing defective products, which have the same configuration as the supply conveyor chain 1°, are installed horizontally and separated into left and right parts, and an IC stopper 35 is installed at the branching position. will be established.

Further, reference numerals 16 and 17 denote IC mounting tables which have the same structure as the above-mentioned mounting table 7. 27 is a good product storage pallet, 1 is an empty pallet, 19 and 20 are suction pads, 21 is a transfer for storing non-defective products, 22 is a transfer for storing defective products, O is an unloader for the good product storage pallet section, 24 is a loader for the empty pallet section, 25 is a A defective product storage pallet section unloader, 26 an empty pallet section loader, 29 a defective product storage pallet, and 30 an empty pallet. In the embodiment, a pallet 1 containing IC50 is stored in the supply section loader 3, and a suction pad 6 attached to the supply transfer 5 absorbs one row of I'C50. It is transported to the mounting table 7 and placed on the concave portion 7a thereof. On the other hand, when the top pallet 1 becomes empty, the suction pad 6
The empty pallet 1 is suctioned and conveyed to the empty pallet storage unloader 4 and placed there. Then, the supply section loader 3 uses an elevator mechanism (not shown) to load the pallet 1.
Increase by one piece. The empty pallet storage unit unloader 4 similarly descends by one pallet.

Next, the IC mounting table 7 is tilted diagonally and when it is aligned with the transport path 8 in the thermostatic chamber 9, the gate 31 is opened and the ICs of 50 rows are fed into the thermostatic chamber 9 by their own weight. . The IC 50 transferred from the IC mounting table 7 by falling under its own weight slides while contacting the IC main body with the transfer path 8.
It can be stopped by 2αl. Next, the air cylinder 32b1 operates, the stop block 32a1 opens, and the IC 50 begins to slide again until it is stopped by the lower stop block 32cL2. At this time, the next group of ICs 50 is placed on the IC mounting table 7. Stop block 32αl is closed and I
A group of ICs 50 on the C mounting table 7 is supplied by opening the gate 31, and is stopped by a stop block 32al. Thereafter, this operation is repeated to transport the IC 50 within the thermostatic oven 9 until the IC 50 is transported to the exit of the thermostatic oven 9. On the other hand, when performing a temperature (high temperature, low temperature) test, the space 9 in the constant temperature bath 9
Hot air or cold air circulates through b, indirectly heating or cooling the IC, and heating or cooling the IC to a set temperature by the time it reaches the outlet of the thermostatic oven 9.

One row of ICs 50 coming out of the thermostatic chamber 9 is put into a supply conveyance chain 10. Supply conveyor chain 10
The IC 50 that has entered is stopped by the IC guide 42, and when the supply conveyance chain 10 moves laterally, the IC 50 is conveyed laterally by the conveyance chain guide 10α. temperature(
In the case of a high-temperature, low-temperature test, heating or cooling is also carried out in this part (hot or cold air circulates in the spaces 9b, 10d).

The supply conveyor chain 10 conveys the IC50, and the IC50
When it reaches position 0 in FIG. 2, the IC guide 42 disappears, and the IC 50 begins to slide down the conveyance path 11 due to its own weight and is stopped by the measurement unit positioning block 33. Next, with the IC holding block 12, the IC50 is the IC socket of the measuring device 14) 13
(The IC socket 13 is mounted on a test board (not shown) mounted on the measuring instrument 14), and measurements are taken. In the case of temperature (high and low temperature) tests, heating or cooling is also performed at this time. After the measurement is completed, the IC 50 is returned to the transport path 11 by an IC pushing mechanism (not shown), the measurement section positioning block opens, and the IC 50 starts falling under its own weight again. When the IC 50 that has slipped from the measuring section due to its own weight falls passes the IC passage detector M, the measuring section positioning block 3
3 is closed, the supply conveyance chain 10 is fed horizontally by one frame, and the next IC 50 is supplied to the measurement section. When the IC taken out from the measurement section passes the IC passage detector 34,
Depending on the measurement result, the iC stop 35 is closed (when the measurement result is good) or opened (when the measurement result is bad). In the case of a non-defective product, the IC is stopped by the IC stopper 35, placed in the non-defective product storage conveyor chain 15, and transferred to the non-defective product storage conveyance chain 1.
5 is sent horizontally by one frame. IC is IC Guide 36
It is transported while being guided by the transport chain guide 15a.The structure is almost the same as the supply transport chain 10.

In the case of a defective product, the IC stopper 35 opens, the product enters the transport chain 16 for storing the defective product, and is sent horizontally by -frames.

The IC is transported while being guided by the IC guide 37 and the transport chain guide 16α, as in the case of a non-defective product.

The following operation is the same for both the non-defective and defective products, so it will be explained for the non-defective product side. A pallet-row of ICs is arranged on the conveyor chain 15 for storing non-defective products (however, in the case of a high temperature test,
Since the pallet may be deformed by the heat of C, the length of the conveyor chain is increased and air cooling is performed. In the case of low-temperature tests, nitrogen gas is sprayed to prevent frost from forming on the IC itself. ), the IC guide 38 is opened, and the IC guide 38 is placed in the lCaft: stand 17. Then, the work C mounting table 17 changes from the subject state to the horizontal state. Next, transfer 2 for storing good products
A suction pad 19 attached to the holder 1 picks up one row of ICs, transports them to a non-defective storage pallet 270, and stores them in a non-defective storage pallet 27. When the good product storage pallet 27 is full, the good product storage pallet unloader field is lowered by one pallet by an elevator mechanism (not shown). Next, the empty pallet 28 is picked up by the suction pad 19 from the empty pallet section loader 24, and then the non-defective storage pallet section unloader 23
Transport it to and place it there.

〔Effect of the invention〕

As explained above, the present invention allows a PGA packaged IC to be transported under its own weight using a transport path that contacts only the main body of the IC without contacting the leads of the IC.
It is possible to increase the transport speed of ICs, improving processing capacity per unit time, and by transporting individual ICs separately, it is possible to prevent IC cracks and chipping (especially in the case of ceramic packages) and ICs due to collisions between ICs. This has the effect of preventing them from getting caught on each other.

[Brief explanation of drawings]

Fig. 1 is a schematic side view of an embodiment of the present invention, Fig. 2 is a bottom plan view of the machine, Fig. 3 is a perspective view of a PGA package type IC, Fig. 4 is a sectional view taken along the line A-A in Fig. 1, Figures 5 and 6 are the first
A detailed view of the IC mounting table in the figure, FIG. 7 is an enlarged view of the stop block in FIG. 1, FIG. 8 is a sectional view taken along the line B-B in FIG. FIG. 10 is an enlarged view of the conveyor chain for use in the present invention, and is a sectional view taken along the line C--C in FIG. 9. 1. Pallet, 2. Empty pallet, 3. Supply section'-da, 4. Empty pallet storage section unloader, 5..
・Supply transfer, 6... Suction pad, 7...
Work C mounting table, 8... Conveyance path, 9... Constant temperature chamber, 10.
... Supply conveyance chain, 10α... Conveyance chain guide, 11... Conveyance path, 12... IC holding block, 13... IC socket, 1.1... Measuring instrument, 1
5... Conveyance chain for storing good products, 15a... Conveyance chain guide, 16... Conveyance chain for storing defective products,
16a...conveyance chain guide, 17.18...
IC mounting table, 19.20... Suction pad, 21...
Transfer for storing non-defective products, 22... Transfer for storing defective products, 23... Unloader for non-defective product storage pallet section,
24... Empty pallet section loader, 25... Defective product storage pallet section unloader, I... Empty pallet section loader,
27... Good product storage pallet, Public... Empty pallet, 2
9...Defective product storage pallet, 30...Empty pallet,
31-...Gate, 32a1r32a2.32a3~3
2an-=stop block, 32b1132b213
2b3~32-...Air cylinder, 33...Measuring part positioning guide,...IC passage detector, 35...
・IC stopper, 50... IC patent applicant NEC Corporation 1, agent Patent attorney Kanno Naka 1'σ"鵠＼゛ ・FIG. 3 FIG. 5 KEN 6

Claims (1)

[Claims] (1) In a handling device that takes out a pin grid array type IC with leads concentrated on one end surface from a pallet and carries it into a measuring instrument, the conveyance path from the pallet to the measuring instrument is tilted downward; An IC support part is provided on the transport path to hold the IC while avoiding contact with the leads, and further, the ICs are individually separated along the transport path, temporarily stopped, and the front and rear sides are opened and closed. A pin grid array type IC handling device characterized by being provided with a stop block that feeds the IC downward one pitch at a time.