JPS6294354A - Recording head - Google Patents

Abstract

PURPOSE:To obtain a high density line type high quality head easy to prepare, by setting the material quantity of a recording material to a high m.p. metal such as tungsten or molybdenum and forming a film comprising the material quality of the recording electrode to one entire flat surface of an electrode substance before forming the shape of the recording electrode by machine work. CONSTITUTION:A recording head 7 is constituted of a recording part 9, a drive part 10 and the connection part 11 electrically connecting the recording part 9 and the drive part 10. The recording part 9 is constituted of a recording electrode group 7 and an electrode substrate 12 being the support of a recording electrode and the drive part 10 is constituted of a drive circuit IC13 and a substrate 14 for mounting the drive circuit IC. The electrode substrate 12 of the recording part is formed of a machinable ceramics based on mica and a recording electrode 6 is made of a nickel plated tungsten foil. The substrate 14 is formed of a polyimide film and, as a conductor, a copper foil is used. When printing is performed using thus constituted recording head, high quality printed image is obtained on paper to be transferred at a high speed. Because the recording electrode is formed of tungsten, abrasion is reduced and a high quality printed image stable over a long period of time is obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application in Industry-1-] The present invention relates to a recording head used in a printing device using an electric thermal transfer recording method.

[Prior Art] As shown in Figures 3-A and 3-T3, the electrical thermal transfer recording method uses a resistive layer 1 on one side of a base 2 such as a polyethylene film, and a heat-melting ink on the other side. A thermal transfer filler plate 4 having a layer 3 formed thereon is used, and a recording head 7 in which recording electrodes 6 directly connected to a drive circuit 5 are arranged at regular intervals is used to transfer the tips of the recording electrodes 6 to a thermal transfer filler plate 11. A voltage is applied between the recording electrode 6 and the return electrode 8 to generate Joule heat in the resistance layer 1, which melts the ink layer 3 and prints a predetermined pattern in a dot configuration. . Further, regarding the structure of the above-mentioned recording head, there are Japanese Patent Applications No. 57-212078 and No. 59-9067.

[Problem that the invention attempts to solve] However, the above-mentioned conventional example has the following problems.

In the current thermal transfer recording method, it is essential that the material of the recording electrode be a high melting point metal such as tungsten or molybdenum, considering mechanical sliding with the resistance layer during long-term printing and abrasion due to discharge thermal shock during energization. There was a precondition that However, the above-mentioned high melting point metal is difficult to form into fine and complicated shapes by chemical etching due to its additive properties. Therefore, even if an attempt was made to manufacture a high-density line head, it was difficult to realize it due to the difficulties described below. For example, printing width 216
Assuming a line head with II1m (A4 size) and a recording density of 12 dat/mm, the first thing to do is to accurately form recording electrodes with a pitch of approximately 85 μm over a large area of 200 mm. It was a great turn of events. Second, the connection method between the recording electrode material and the drive circuit has not been established. As one option, an IC is installed on the electrode substrate-L.
Although it is conceivable to mount a drive circuit that has been made into an integrated circuit, forming a circuit pattern for mounting on the electrode substrate at the same time would further complicate the difficulty described in @1 above. However, if you connect the k[l+ open circuit configuration to the recording electrode on a separate board, it is new to connect all of the 2 fl 00 terminals lined up at a pitch of 85 μm in the 1-up/down configuration. The present invention is intended to solve these problems, and its eleventh purpose is to provide a high-quality electrically conductive thermal transfer recording head with a high-density liner that can be easily manufactured by lJJ. It is about providing.

[Means for Solving the Problems] A recording head is composed of at least a recording electrode and an electrode substrate serving as a support member for the recording electrode, the material of the recording electrode is a high melting point metal such as tungsten or molybdenum, and the recording head is made of a high melting point metal such as tungsten or molybdenum, and After forming a film of the material of the recording electrode on the entire surface of one plane of the substrate, the shape of the recording electrode is formed by machining, further comprising a drive circuit for applying a voltage to the recording electrode. The entire surface of the portion of the connection substrate to be connected to the recording electrode is formed of a conductor, and after a film of the material of the recording electrode is formed on the entire surface of one plane of the electrode substrate, the connection substrate is are connected by a metal medium, and at the same time, the shape of the self-recording electrode and the shape of the conductor of the connection board are formed.

[Example] FIG. 1 is a structural diagram in an example of the present invention. In this example, a line head with a recording density of 12 dat/mm and a recording width of 216 m was manufactured. The recording head 7 includes a recording section 9, a drive section 10, and a connection section 11 that electrically connects the recording section 9 and the drive section 10. The recording section 9 is composed of a recording electrode 11V7 and an electrode substrate 12 which is a support for the recording electrode, and the driving section 10 is composed of a driving circuit TC13 and a driving circuit IC.
It consists of a mounting board 14 for mounting. The electrode substrate 12 of the recording section was made of cuttable ceramics whose main component was Kumo No. 1. The recording electrode 6 used was a 50 μm thick tungsten foil plated with 5 μIn of nickel.

The base of the mounting board 14 was made of a polyimide film with a thickness of 25 μm, and the conductor was made of copper foil with a thickness of 15 μm.

The method for manufacturing the recording head of the present invention will be described below. First, the machinable ceramics and tungsten foil were
Cut into pieces and join with adhesive. In the Miyako-111C mounting board, the driving ICl3 is mounted on the mounting board 14 in advance by wire bonding. Next, as shown in FIG. 2, the entire surface of the recording section 9 and the driving section 10 are connected with solder 31. In this case, since the conductors of the recording section 9 and the driving section 10 have not yet been patterned, there is no need to strictly match the position accuracy of each. The process is as simple as gluing together two membranes that are entirely conductive inside. Figure 2(a) is an enlarged view of the area indicated by the broken line 30 in Figure 1.Figure 2(b)
2(a) is a cross-sectional view of FIG. 2(a). Reference numeral 11 denotes a connecting portion in which the recording portion and the driving portion are overlapped to form a two-way connection. The conductor pattern 32 of the mounting board 14 has already been patterned except for the connection portion. Reference numeral 33 denotes a marker for the machining device to recognize the machining position when forming the conductor pattern by machining later. After connecting as above, the diagonal line 34 in Fig.
The conductor of the recording part and the conductor of the mounting board were removed at the same time by special machining. The processing machine includes a grinding disk having a thickness of 45 μm and coated with diamond particles on the surface, a mechanism for rotating the grinding disk at high speed, a stage for fixing the workpiece, and a grinding disk that is horizontal with respect to the stage. It consists of a mechanism for precisely moving in the direction and perpendicular direction, a television camera, and a device that compares and recognizes the workpiece and image inputted from the television camera with a preset arbitrary pattern to be recognized. ” 1. The processing machine automatically performed processing while recognizing the marker 33 described above. In this example, the recording electrode pitch was 85 μm, and the width of the removed conductor 34 was 50 μm. By the way, the number of recording electrodes is approximately 25.1.
There are 0 pieces. Conventionally, wire bonding or solder bonding is used to electrically connect a large number of high-definition patterns of 200 μm or less to each other, but this requires precision of the patterns to be bonded and alignment precision, which is extremely difficult and requires time and effort. However, in the present invention, the connection could be made very easily as in the embodiment. “When we actually attempted to print using a printing device using the recording head with the above configuration, we were able to obtain high-quality prints on A4 size transfer paper at high speed.Also, when we conducted a durability test, we found that the recording head Since it is made of tungsten, there is little wear on the recording electrode, and stable, high-quality prints can be obtained over a long period of time.

[Effects of the Invention] As described above, the present invention is effective in making it possible to manufacture a large-scale line head using a highly durable high-melting point metal for the recording electrode. Also, as explained in the example, simultaneous connection of more than 2,500 patterns with a pitch of 85 μm is easily possible.

[Brief explanation of drawings]

FIG. 1 is a diagram showing an embodiment of the structure of an electrically conductive thermal transfer recording head according to the present invention. FIGS. 2(a) and 2(b) are diagrams illustrating the method for manufacturing the electrically conductive thermal transfer recording head of the present invention. 3-A and 3-8 are diagrams showing conventional electrical thermal transfer recording. 1... Resistance layer 2... Base layer 3... Ink layer 4... Thermal transfer film 5... Drive circuit 6... Recording electrode 7. ... Recording head 8 ... Return electrode 9 ... Recording section [0 ... Drive section 11 ... Connection section 12 ... Electrode substrate 13 ... Drive IC 14... Mounting board -〇- 3rd - Snake diagram

Claims (2)

[Claims] (1) Recording is obtained by applying a voltage to the resistive layer of an electrically conductive thermal transfer film having at least a resistive layer and an ink layer, causing the resistive layer to generate heat by energizing it, melting the ink layer, and transferring the ink to the printing medium. In the printing device, a recording head for contacting the resistance layer and applying voltage is composed of at least a recording electrode and an electrode substrate serving as a support member for the recording electrode, and the recording electrode is made of a high-quality material such as tungsten or molybdenum. A recording head characterized in that the recording electrode is made of a melting point metal, and the shape of the recording electrode is formed by machining after a film of the recording electrode material is formed on the entire surface of one plane of the electrode substrate. (2) A drive circuit for applying a voltage to the recording electrode and a connection substrate for connecting the recording electrode are formed entirely of a portion to be connected to the recording electrode, and the entire surface of one plane of the electrode substrate is formed of a conductor. Claim 1, wherein after a film of the material of the recording electrode is formed, the connection substrate is connected by a metal medium, and at the same time, the shape of the recording electrode and the shape of the conductor of the connection substrate are formed. Recording head as described.