JPS6293953A - Transfer device - Google Patents

Abstract

PURPOSE:To realize easy and accurate adsorption and to transfer a product by adsorption without inflicting damage on the product by a method wherein a adsorbing section shaped after a groove-like recess is formed in a collet and a portion of the adsorbing section to be in contact with the product is made of elastic material. CONSTITUTION:A collet 1 is formed solidly of silicone rubber and provided at its middle with an attachment section 2 that is a cylindrical protrusion. An adsorbing hole 3 provided on the attachment section 2 reaches an adsorbing section 1a. The adsorbing section 1a has a cross section that is a groove-shaped recess built of linear, angular forms. The transfer unit of this design is slidably inserted into a doughnut-shaped guide 5 connected to an XY driving section 4. The transfer unit itself is provided with a cylindrical arm 7 linked with a vertical driving unit 6. The cylindrical arm 7 mounts at its end the collet 1. A semiconductor pellet 9 is adsorbed to the collet 1 for transfer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to conveyance technology, and in particular to a technology that is effective when applied to the conveyance of precision products such as semiconductor pellets.

[Background technology]

One of the manufacturing processes for semiconductor devices is a so-called die bonding process. This is to attach a 4'-conductor pellet to one part of the Pereno I/receptacle of a lead frame, vano gauge board, etc. In this case, a conveyance device having a collet, which is a suction jig, attached to the tip of the terminal can be used to move the semiconductor belenoid from its storage section to the pellet mounting section.

The above-mentioned collen h has a protrusion which is a mounting part in the center thereof, and a suction hole is formed in the protrusion that passes through the suction part located on the back side of the protrusion.

By attaching the mounting portion to the tip of a cylindrical arm connected to the J1 empty pump, the semiconductor pellet is attracted to the suction portion by the suction force from the suction hole and is moved.

The structure of the suction part of the L collet includes a flat type in which the end of the suction hole and the contact part of the semiconductor pellet are on the same surface, and a type in which the end of the suction hole is lower than the contact part. However, since normal kore and t are made of metal, in ancient times, t was used on the circuit forming surface of the rl-conductor pellet.
In addition, due to the conical shape in the subsequent stroke, there is a problem that there is a large contact surface between the p- and the body beret, and it is easy to cause damage such as chips to the end of the semiconductor pellet. The present inventor has discovered that.

The technology for suctioning and transporting semiconductor pellets in the guiponding process is described in Japan Microelectronics Association WrlC Mounting Technology JPIOI, published by Kogyo Kenkyukai Co., Ltd., January 15, 1980.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a technology that allows a product to be suctioned and transported without causing any damage to the product.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, regarding the collet attached to the tip of the movable cylindrical arm of the transfer device, the suction part is a groove-like recess, and 1
1☆ When pulling and suctioning, press the contact part of the bitten object with the 11 material F.
1, the suction state is a line contact between two opposing sides, making suction easy and accurate. At the same time, the impact during suction can be reduced by 81, achieving the objective described in item 1. It is something that will be done.

[Embodiment 1] FIG. 1(3) is a perspective view showing a collet applied to a conveying device according to Embodiment 1 of the present invention, and FIG.
is a 141i plane view of the collet.

Further, FIG. 2 is a schematic explanatory diagram of the conveying device of the first embodiment.

The collet 1 of Example 1 is made of silicone rubber (elastic material ↓
), and has a mounting part 2 consisting of a cylindrical protrusion in the center thereof, and a suction hole 3 formed in the mounting part 2 penetrates into the suction part 1a. . and,
The suction portion 1a is formed as a linearly extending groove-like recess with a rectangular cross section.

As shown in FIG. 2, the conveyance device of the first embodiment is slidably inserted into a donut-shaped guide 5 connected to an XY drive section 4, and is itself connected to a vertical drive section 6. It is equipped with a cylindrical arm 7, and the collet 1 is attached to the tip of the arm 7. Also, the opposite end (upper end) of the cylindrical arm 7 is a vacuum pump 1 for vacuum suction.
Connected to 0.

When mounting the collet 1, the mounting portion 2 is attached to the arm 7.
The air intake hole 7a is fitted into the air intake hole 7a, and it can be easily attached and detached.

Next, the operation of the first embodiment will be explained.

In FIG. 2, when the semi-solid pellet 9 held on the adhesive sheet 8 is pink-amplified and the pellet 9 is moved to the pellet attachment part (not shown), first the back side of the adhesive sheet 8 is Then, the semiconductor pellet 9 is pushed up using a pushing up jig 11 to partially fix the semiconductor pellet 9 as shown in the figure. After that, the arm 7 that was located above is lowered,
The collet 1 attached to the tip of the collet 1 is brought into contact with the semiconductor pellet 9, and the pellet 9 is simultaneously sucked by the vacuum pump 10 to pick up the pellet 9. The semiconductor pellet 9 thus picked up can be moved to a predetermined position by the action of the XY drive unit 4 and the vertical VA drive unit, and by releasing the suction at this position, the transport of the pellet 9 can be completed. It is something.

As explained above, the transportation of the semi-quartet pellets 9 is carried out by sucking the semiconductor pellets 9 into the collet 1.

Therefore, when the collet l of the semiconductor base 1/nod 9 contacts the suction part 1a? Jif8 strength and contact conditions are important in the reliability of the pellet 9.

The collet 1 shown in Example 1 is entirely made of an elastic material, so that when the semiconductor pellet 9 comes in contact with the collet 1, the collet 1 is made of an elastic material.
It is possible to sufficiently alleviate F. Also,"
1. Since the suction part la of the collet 1 is formed of a groove-like recess that extends linearly, a part of the collet 1 may come into contact with the circuit forming surface of the semiconductor pellet 9, causing damage to the circuit, etc. do not have. Similarly, since the four parts are groove-shaped, the semiconductor pellet 9 is adsorbed while the two opposing sides of the pellet 9 are in line contact. This is compared to Koren I, which has a quadrangular pyramidal concave suction part where suction is performed by line contact on four sides.
The semiconductor pellet 9 can be easily and accurately adsorbed, and damage to the semiconductor pellet 9 by one member can be reduced.

[Embodiment 2] FIG. 3 is a sectional view showing a collet applied to a feeding device, which is a second embodiment of the present invention.

The collet I of the second embodiment is similar to the collet I of the above-mentioned embodiment I in that the suction portion 1a is formed as a groove-like recess. However, in the case of the second embodiment, the recess has a groove structure with a trapezoidal cross section, and the suction portion 1a is formed of an elastic material separate from the collet body.
A is bonded to a metallic collet body 1b.

Therefore, the collet of the second embodiment has the same effect as the first embodiment, and at the same time, only the suction part 1a can be replaced. :l This has the advantage that the reproduction of Correa To 1 can be carried out easily.

[Embodiment 3] FIG. 4 is a sectional view showing a collet applied to a conveying device according to Embodiment 3 of the present invention.

This example 3-1 has a suction portion formed of a groove-like concave portion having an arc-shaped cross section. In addition to the same effects as in Example 1, the above collet has the following advantages:
It also has the following advantages: That is, since the four parts are arcuate, the semiconductor pellet 9 and the suction part 1a during suction are
The distance between the two surfaces can be further narrowed while ensuring line contact between the two. Therefore, since the inflow of air from the outside can be reduced, the semiconductor pellet 9 can be strongly and reliably attracted.

〔effect〕

(+1. B bag feeding: By making the suction part of the collet installed at the tip of the movable cylindrical arm of η into a groove-like recess, and at least the contact part of the object to be suctioned during suction, by forming it with an elastic material, The adsorption of the object to be adsorbed can be achieved through line contact between two opposing sides, and the contact impact between the two sides during adsorption can be alleviated.

(21, 1jii (1)) allows easy and accurate suction and conveyance without causing damage or destruction to the product, which is the suction target.

(3) By alleviating the contact impact, it is possible to increase the impact force to some extent, thereby increasing the speed of the conveyance operation.

(4) By forming the suction part from an elastic material separate from the collet body, replacement and regeneration can be easily and inexpensively performed.

(5) By making the suction part so that the cross section of the groove-like recess is arc-shaped, the distance between the suction part surface and the object to be attracted can be narrowed, so that the object to be attracted can be strongly attracted. be able to.

Although the invention made by the present inventor has been specifically explained based on examples, the present invention is not limited to the above-mentioned examples, and may be modified at any time without departing from the gist of the invention. Needless to say.

For example, although the groove-like recesses of the collet suction portion have been described as having rectangular and trapezoidal cross sections, it goes without saying that the present invention is not limited to this as long as the groove-like recesses have four sections extending in a groove shape.

In addition, the elastic material is not limited to silicone rubber, but also has so-called rubber-like elasticity.
Tree j1(1
It may be a material.

[Application field]

In the above explanation, the invention made by the present inventor is mainly applied to the die bonding process, which is the background application field, and the case in which the invention is applied to the transportation of semiconductor pellets in a cage, but the present invention is not limited to this. ,For example, 6 pieces ξ is effective even when applied to the semiconductor beret, 1, and expulsion after dynoning in Guisongwe culm.
The objects to be transported are not limited to semiconductor pellets, but also products with two opposing sides, especially 1. ? secret product 1
This is an effective technology that can be applied to transportation.

[Brief explanation of drawings]

FIG. 1 (Al is a perspective view showing a collet applied to the conveying device according to the first embodiment of the present invention, first appearance) is a sectional view of the collet, and FIG. 2 is a cross-sectional view of the collet applied to the conveying device according to the first embodiment A schematic explanatory diagram, FIG. 3 is a sectional view showing a collet applied to a conveying device according to a second embodiment of the present invention, and FIG. 4 is a cross-sectional view showing a collet applied to a conveying device according to a third embodiment of the present invention. It is a diagram. DESCRIPTION OF SYMBOLS 1... Collet, la... Adsorption part, 2... Mounting part, 3... Suction hole, 4... XY drive part, 5... Guide, 6... Vertical drive part, 7 ...Cylindrical arm, 7a・
...Intake hole, 8...Adhesive sheet, 9...Semiconductor platen, 10...Vacuum pump, 11...Pushing jig. Agent Patent attorney Masaru Ogawa Younger brother 1h (11,) 3, gu Figure 3 Figure 4 Figures 3 and 8

Claims (1)

[Scope of Claims] 1. A conveying device in which a cylindrical arm having a collet attached to its tip is connected to a drive unit, wherein the collet has a groove-like recess formed as a suction part, and the groove-like recess A conveying device, at least a portion of which comes into contact with an adsorbed object, is made of an elastic material. 2. The conveying device according to claim 1, wherein the entire collet is made of an elastic material. 3. The conveying device according to claim 1, wherein the groove-like recess is formed of an elastic material separate from the collet body.