JPS6291445U - - Google Patents
Info
- Publication number
- JPS6291445U JPS6291445U JP18234785U JP18234785U JPS6291445U JP S6291445 U JPS6291445 U JP S6291445U JP 18234785 U JP18234785 U JP 18234785U JP 18234785 U JP18234785 U JP 18234785U JP S6291445 U JPS6291445 U JP S6291445U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heat dissipation
- dissipation section
- resin
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 3
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18234785U JPS6291445U (id) | 1985-11-26 | 1985-11-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18234785U JPS6291445U (id) | 1985-11-26 | 1985-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6291445U true JPS6291445U (id) | 1987-06-11 |
Family
ID=31128059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18234785U Pending JPS6291445U (id) | 1985-11-26 | 1985-11-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6291445U (id) |
-
1985
- 1985-11-26 JP JP18234785U patent/JPS6291445U/ja active Pending