JPS6290951A - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPS6290951A JPS6290951A JP60231702A JP23170285A JPS6290951A JP S6290951 A JPS6290951 A JP S6290951A JP 60231702 A JP60231702 A JP 60231702A JP 23170285 A JP23170285 A JP 23170285A JP S6290951 A JPS6290951 A JP S6290951A
- Authority
- JP
- Japan
- Prior art keywords
- electrode plate
- hollow insulator
- semiconductor element
- insulator
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W76/138—
-
- H10W72/00—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60231702A JPS6290951A (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60231702A JPS6290951A (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6290951A true JPS6290951A (ja) | 1987-04-25 |
| JPH0342701B2 JPH0342701B2 (cg-RX-API-DMAC10.html) | 1991-06-28 |
Family
ID=16927660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60231702A Granted JPS6290951A (ja) | 1985-10-16 | 1985-10-16 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6290951A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1906443A2 (en) | 2006-09-26 | 2008-04-02 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
-
1985
- 1985-10-16 JP JP60231702A patent/JPS6290951A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1906443A2 (en) | 2006-09-26 | 2008-04-02 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
| EP1906443A3 (en) * | 2006-09-26 | 2008-12-03 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
| US8456001B2 (en) | 2006-09-26 | 2013-06-04 | Mitsubishi Electric Corporation | Pressure-contact semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0342701B2 (cg-RX-API-DMAC10.html) | 1991-06-28 |
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