JPS6286903A - Structure of ultra high frequency filter - Google Patents

Abstract

PURPOSE:To facilitate miaturizing of a microwave receiver by connecting an upper layer strip line and a lower layer strip line by a central conductor covered with a dielectric in which a part from the lower face of an upper dielectric substrate to the upper face of a lower layer dielectric substrate can be fitted to a hole of a middle layer metallic plate. CONSTITUTION:A central conductor 12a is inserted in a hole 7a of an upper layer dielectric substrate 7 and a hole 5a of a middle layer metallic plate 5 and a hole 2a of a lower layer dielectric substrate 2, and the upper end part is connected to an upper layer strip line 8 and the lower end part is connected to a lower layer strip line 3. In a dielectric 12, a part projected from the hole 7a of the upper layer dielectric substrate 7 is in contact with the lower face of an upper layer metallic plate 10 excluding a part necessary for connecting the central conductor 12a to the upper layer strip line 8, and a part projected from the hole 2a of the lower layer dielectric substrate 2 is in contact with the upper face of a lower layer metallic plate 1 excluding a part necessary for connecting the central conductor 12a to the lower layer strip line 3, and further, a part from the lower face of the upper layer dielectric substrate 7 to the upper face of the lower layer dielectric substrate 2 is made to columnar shape that can be inserted to the hole 5a of the middle layer metallic plate 5.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of an ultra-high frequency filter formed by strip lines.

[Conventional technology]

To receive microwaves in a wide frequency band used for radar, these microwaves are filtered through multiple ultra-high frequency filters with different wave frequencies, and the resulting microwaves at each frequency are transmitted to a local oscillator. A commonly used method is to convert it to an intermediate frequency by At this time, multiple ultra-high frequency filters are connected to each other on the same stripline plane or via coaxial cables.

Such a super high-rise 11Jl filter is formed on a dielectric substrate using strip lines. In this case, the capacitive element constituting the ultra-high frequency filter can be obtained by widening the pattern width of the strip line, and the inoguctance can be obtained by narrowing the pattern width of the strip line. Furthermore, it is well known that a series capacitive element is formed by overlapping strip lines with dielectric substrates sandwiched therebetween.

[Problem that the invention seeks to solve]

By the way, by forming an ultra-high frequency filter using a strip line, it is possible to miniaturize a microwave receiver. There has been a problem in that it may be difficult to downsize the device.

The present invention has been made to solve the above problems,
An object of the present invention is to provide a structure of an ultra-high frequency filter that facilitates miniaturization of a microwave receiver.

[Means for solving problems]

Therefore, in this Komei, the lower layer metal plate is arranged above the lower layer metal plate at a predetermined distance from the lower layer metal plate, and an ultra-high frequency filter is formed by the lower layer strip line on the lower surface, and the starting end of the lower layer strip line A lower dielectric substrate is provided with a hole of a predetermined size formed at a position facing the lower dielectric substrate. The middle layer metal plate has a hole larger than the hole in the lower dielectric substrate at a position corresponding to the installation position, and the middle layer metal plate is arranged above the middle layer metal plate at a predetermined distance from the middle layer metal plate, and has an upper layer metal plate on the top surface. ) - An ultra-high frequency filter is formed by a lip line, and a hole in the lower dielectric substrate is formed at a position facing the terminal end of the upper layer strip line and corresponding to the hole drilling position in the lower dielectric substrate. An upper dielectric substrate with holes of the same size, an upper metal plate placed above the upper dielectric substrate at a predetermined distance from the upper dielectric substrate, and holes in the lower dielectric substrate, a middle layer of the upper dielectric substrate, except for the center conductor that connects the upper strip line and the lower strip line through the hole in the metal plate and the hole in the lower dielectric substrate, and the part necessary for connecting the center conductor to the upper strip line. The protruding part from the hole touches the bottom surface of the upper metal plate, and the protruding part from the hole of the lower dielectric substrate touches the top surface of the lower metal plate, except for the part necessary for connecting the center conductor to the lower strip line. The structure of the ultra-high frequency filter is constituted by a connection member made of a dielectric material that is in contact with the dielectric material and has a shape that allows the portion from the lower surface of the upper dielectric substrate to the upper surface of the lower dielectric substrate to be inserted into a hole in the intermediate layer metal plate.

[For production]

The structure of the ultra-high frequency filter having the above configuration is that a lower metal plate, a lower dielectric substrate, a middle metal plate, an upper dielectric substrate, and an upper metal plate are laminated at predetermined intervals (7),
The protruding part from the hole of the upper PJ dielectric substrate comes into contact with the lower surface of the upper layer metal plate (7. The protruding part from the hole of the lower layer dielectric substrate comes into contact with the upper surface of the lower layer metal plate, and The upper layer strip line and the lower layer strip line are connected by a center conductor coated with a dielectric material whose portion up to the upper surface of the lower layer dielectric substrate can be inserted into a hole in the middle layer metal plate.

〔Example〕

Hereinafter, one embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of the structure of an ultra-high frequency filter according to the present invention, with FIG. 1(a) being a side view and FIG. 1(b) being a front view. In FIG. 1, 1 is a lower metal plate, 2 is a lower dielectric substrate placed above the lower metal plate 1 at a predetermined distance from the lower metal plate 1, and 3 is formed on the lower surface of the lower dielectric substrate 2. 2a is a hole of a predetermined size drilled at a position facing the starting end of the lower layer stripline 3, 4 is a hole between both ends of the lower surface of the lower dielectric substrate 2 and the lower layer metal. A spacer is interposed between both ends of the upper surface of the plate 1, 5 is a middle layer metal plate placed above the lower dielectric substrate 2 at a predetermined distance from the lower dielectric substrate 2, and 5a is a lower dielectric substrate. A hole 6 larger than the hole 2a of the lower dielectric substrate 2 is bored at a position corresponding to the hole drilling position 2, and a hole 6 is formed between both ends of the lower surface of the middle layer metal plate 5 and both ends of the upper surface of the lower dielectric substrate 2. A spacer 7 is interposed between the intermediate metal plates 5 and an upper dielectric substrate disposed above the intermediate metal plate 5 at a predetermined distance from the intermediate metal plate 5. 8 is an upper layer l? 1. An upper layer strip line forming an ultra-high frequency filter formed on the upper surface of the electric substrate 7; 7a is an upper layer strip line; Boline 8
The lower dielectric substrate 2 is located at a position facing the end portion of the lower dielectric substrate 2 and is bored at a position corresponding to the hole drilling position of the lower dielectric substrate 2.
A hole of the same size as the hole 2a, 91 is a spacer interposed between both ends of the lower surface of the upper dielectric substrate 7 and both ends of the upper surface of the middle layer metal plate 5; An upper metal plate 11 is arranged at a predetermined distance from the upper dielectric substrate 7, and reference numeral 11 indicates both ends of the upper surface of the upper dielectric substrate 7 and the upper metal plate I.
12 is the upper layer spacer I-IJ
This is a connecting member that connects the tube line 8 and the lower strip line 3. As shown in FIG. 2, the connecting member 12 includes a center conductor 12a that connects the upper strip line 8 and the lower strip line 3, and a dielectric 12b covering the center conductor 12a. - Center conductor 12a
are inserted into the hole 7a of the upper B dielectric substrate 7, the hole 5a of the middle layer metal plate 5, and the hole 2a of the lower dielectric substrate 2, with the upper end connected to the upper strip line 8 and the lower end connected to the lower layer strip line 8). - each connected to the lip line 3; Also, the dielectric 12
Excluding the part necessary to connect the center conductor 12a to the upper strip line 8, the protruding part from the hole 7a of the upper dielectric substrate 7 contacts the lower surface of the upper metal plate O, and the center conductor 12a is connected to the lower strip line 8. Except for the part necessary for connecting to the line 3, the protruding part from the hole 2a of the lower N dielectric substrate 2 comes into contact with the upper surface of the lower metal plate 1, and then from the lower surface of the upper dielectric substrate 7 to the lower dielectric substrate 2 has a cylindrical shape that can be inserted into the hole 5a of the middle layer gold rA plate 5.

The microwave propagated through the upper strip line 8 is transmitted from the terminal end of the upper strip line 8 to the center conductor 12a.
The signal is propagated to the starting end portion of the lower strip line 3 via the lower strip line 3, and is further propagated through the lower strip line 3.

Note that the connection between the upper layer strip line 8 and the center conductor 12a and the connection between the lower layer strip line 3 and the center conductor 12a are made by soldering or the like. Also, dielectric 1
Use Teflon or the like as the material for 0.

In this embodiment, a two-layer ultra-high frequency filter has been described, but the present invention is not limited to this, and an ultra-high frequency filter having three or more layers may be constructed.

〔Effect of the invention〕

As explained above, according to the present invention, the lower metal plate, the lower dielectric substrate, the middle metal plate, the upper dielectric substrate, and the upper metal plate are stacked and arranged at predetermined intervals, and the upper dielectric substrate A center conductor that is inserted into the hole, the hole of the middle layer metal plate, and the hole of the lower layer dielectric substrate and connected to the upper layer strip line and the lower layer strip line, and the center conductor that covers this center conductor and is inserted into the hole of the middle layer metal plate and the hole of the lower layer dielectric substrate. The protruding part from the hole contacts the lower surface of the upper metal plate, the protruding part from the hole of the lower dielectric substrate contacts the upper surface of the lower metal plate, and the distance extends from the lower surface of the upper dielectric substrate to the upper surface of the lower dielectric substrate. By connecting the upper layer strip line and the lower layer strip line with a connecting member made of a dielectric material having a shape that can be inserted into the hole of the middle layer metal plate, a stacked ultra-high frequency filter structure can be obtained. It is possible to downsize a microwave receiver using the structure of an ultra-high frequency filter.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of the structure of an ultra-high frequency filter according to the present invention, and FIG. 2 is a perspective view of the members shown in FIG. 1. 1 lower metal plate, 2 lower Wg dielectric substrate, 3,8 1,
Lip line, 4, 6, 9.11 Spacer, 5 Middle layer metal plate, 7 Upper layer dielectric substrate, 10・Upper layer metal plate, 1
2. Connection member.

Claims (2)

[Claims] (1) A lower metal plate, which is arranged above the lower metal plate at a predetermined distance from the lower metal plate, and has an ultra-high frequency filter formed by a lower strip line on its lower surface, and a super high frequency filter formed by a lower strip line. a lower dielectric substrate in which a hole of a predetermined size is bored at a position facing the starting end portion; an intermediate metal plate in which a hole larger than the hole in the lower dielectric substrate is bored at a position corresponding to the hole boring position in the substrate; A super high frequency filter is formed on the upper surface of the upper layer strip line, and the lower layer is located at a position facing the terminal end of the upper layer strip line and corresponding to the hole drilling position of the lower dielectric substrate. an upper dielectric substrate provided with a hole approximately the same size as the hole in the dielectric substrate; an upper metal plate disposed above the upper dielectric substrate at a predetermined distance from the upper dielectric substrate; A center conductor connecting the upper layer stripline and the lower layer stripline through a hole in the upper layer dielectric substrate, a hole in the middle layer metal plate, and a hole in the lower layer dielectric substrate, and a center conductor connecting the center conductor to the upper layer stripline. The protruding portion of the upper dielectric substrate from the hole contacts the lower surface of the upper metal plate, excluding the portion necessary for connection, and excluding the portion necessary for connecting the center conductor to the lower strip line. , a protruding portion of the lower dielectric substrate from the hole contacts the upper surface of the lower metal plate, and a portion from the lower surface of the upper dielectric substrate to the upper surface of the lower dielectric substrate fits into the hole of the middle metal plate. 1. A structure of an ultra-high frequency filter, comprising a connecting member made of a dielectric material having a shape that can be inserted. (2) the lower dielectric substrate has spacers interposed between both ends of the lower surface of the lower dielectric substrate and both ends of the lower metal plate;
The middle layer metal plate is a spacer interposed between both ends of the lower surface of the middle layer metal plate and both ends of the upper surface of the lower dielectric substrate, and the upper dielectric substrate is interposed between both ends of the lower surface of the upper dielectric substrate and the middle layer metal plate. The distance between the spacer and the upper layer metal plate is maintained between the upper layer metal plate and the upper layer dielectric substrate by the spacer interposed between the lower surface of the upper layer metal plate and the upper layer dielectric substrate. The structure of an ultra-high frequency filter according to claim 1.