JP3100232B2 - Signal lines for high-frequency electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a signal line for a high-frequency electronic component, particularly a signal line for a high-frequency electronic component capable of efficiently transmitting an ultra-high-speed signal of 10 GHz or more with little transmission loss (hereinafter referred to as a high-frequency signal). Track).

[0002]

2. Description of the Related Art As the high-frequency signal line, there is a signal line as shown in FIGS.

[0003] In this signal line, vias (hereinafter referred to as vias) comprising conductor poles such as metallized layers are formed on a substrate 12 formed by laminating a plurality of (four in the figure) dielectric layers 10 made of ceramic or the like. The substrate 20 is provided vertically through the substrate 12, and the via 20 is formed as a high-frequency signal line for transmitting a high-speed signal.

At the same time, a plurality of dielectric layers 1
A ground plane 30 made of metallization or the like surrounding the via 20 between 0, as shown by a broken line in FIG.
It is provided in a wide layer with a space of 0 and a circle. The ground plane 30 provided between the plurality of dielectric layers 10 forms a high-frequency signal line composed of the via 20 into a pseudo coaxial line structure.
The characteristic impedance of the high-frequency signal line made of is matched to a constant value of 50Ω or the like.

[0005] On the upper surface of the substrate 12 and on the lower surface thereof, strip-shaped signal lines 22 and 2 made of metallization or the like extending in opposite directions (left and right directions in the figure), respectively.
4 is provided. The signal lines 22 and 24 are formed into a microstrip line structure by a ground plane 30 widely provided between the dielectric layer 10 above and below the substrate 12, and the characteristic impedance of the signal lines 22 and 24 is set to a constant value. Matched to 50Ω or the like.

The inner ends of the signal lines 22 and 24 on the upper and lower surfaces of the substrate 12 are connected to the upper end and the lower end of the via 20 exposed on the upper surface and the lower surface of the substrate 12, respectively.

The via 2 having a pseudo coaxial line structure
A high-frequency signal line, which is formed by connecting the signal lines 22 and 24 having a microstrip line structure connected to the signal line 0 and a microstrip line structure, is capable of efficiently transmitting a high-speed signal with little transmission loss.

[0008]

However, in the high-frequency signal line, the inner ends of the signal lines 22 and 24 connected to the upper end and the lower end of the via 20 and the signal lines 22 and 24 having a microstrip line structure are used. A ground plane is not provided between the dielectric layers 10 of the substrate 12 below or above the intermediate signal line portions 22a and 24a (hereinafter, referred to as intermediate signal line portions) connecting the
The intermediate signal line portions 22a and 24a have a microstrip line structure, and the intermediate signal line portions 22a and 22a
The characteristic impedance of 4a was not matched to a fixed value of 50Ω or the like.

Therefore, when a high-speed signal is transmitted to a high-frequency signal line composed of the via 20 and the signal lines 22 and 24 on the upper and lower surfaces of the substrate 12 connected to the via 20, the high-speed signal transmitted through the intermediate signal line portions 22a and 24a is transmitted. Transmission loss was large, and the high-frequency signal line could not efficiently transmit high-speed signals with little transmission loss. This is particularly remarkable when an ultra-high-speed signal such as 10 GHz or more is transmitted through the high-frequency signal line.

The present invention has been made in view of the above problems, and provides a high-frequency signal line in which the intermediate signal line portion is reduced so that a high-speed signal can be transmitted efficiently with little transmission loss. What you want to do.

[0011]

In order to achieve the above object, a first high-frequency signal line according to the present invention is provided with a substrate made of a dielectric and having vias penetrating the substrate up and down, and surrounding the via. A plurality of ground planes surrounding the vias at intervals of a circular shape or a shape close thereto are arranged side by side at predetermined intervals above and below the substrate made of a dielectric material, and the vias have a pseudo-coaxial line structure, and the upper surface of the substrate and The signal lines provided on the lower surface thereof and extending in opposite directions are formed into a microstrip line structure by the ground planes provided on the upper and lower portions of the substrate, respectively, and the inner ends of the signal lines on the upper and lower surfaces of the substrate are respectively formed as described above. In the signal line of the high-frequency electronic component connected to the upper end and the lower end of the via, the plurality of ground planes Edge is characterized in that arranged eccentrically in order stepwise against the via from the opposite side of the substrate upper surface of the signal line to the opposite side of the signal line of the lower surface of the substrate as it goes to the lower from above the substrate.

A second high-frequency signal line according to the present invention comprises a dielectric substrate having vias vertically penetrating the substrate, and a via formed in the dielectric substrate surrounding the via in a circular shape or close thereto. A plurality of ground planes enclosing at intervals of the shape are arranged vertically at predetermined intervals, the vias have a pseudo coaxial line structure, and signal lines extending in opposite directions provided on the upper surface of the substrate and the lower surface thereof. And a ground plane provided on the upper and lower portions of the substrate, respectively, to form a microstrip line structure, and the inner ends of the signal lines on the upper and lower surfaces of the substrate are connected to the upper end and the lower end of the via, respectively. In a signal line of an electronic component, a plurality of ground planes surrounding the via are overlapped with each other vertically as viewed from above. The upper end of the via is disposed close to the inner peripheral edge of the ground plane on the upper part of the substrate located on the inner end side of the signal line provided on the upper surface of the substrate, and the lower end of the via is disposed on the substrate. The via extends from the signal line side of the upper surface of the substrate to the signal line side of the lower surface of the substrate so as to be disposed close to the inner peripheral edge portion of the ground plane below the substrate located on the inner end side of the signal line provided on the lower surface. Is provided so as to penetrate the substrate obliquely up and down.

[0013]

In the first high-frequency signal line, the ground plane extends from the upper side of the substrate to the lower side of the signal line on the lower side of the substrate from the upper side to the lower side of the inner side facing the via. It is arranged eccentrically to the side in a stepwise fashion with respect to the via. Then, of the inner peripheral edges of the ground plane between the upper part and the lower part of the substrate facing the via, the inner peripheral parts located on the signal line side of the upper and lower surfaces of the substrate are brought closer to the upper part and the lower part of the via, respectively.

In the second high-frequency signal line, a plurality of ground planes surrounding the via are arranged so that their inner peripheral edges are vertically overlapped with each other when viewed from above. And vias extending obliquely up and down from the substrate to the signal line side on the lower surface of the substrate. The upper end of the via is arranged close to the inner peripheral edge of the ground plane on the upper portion of the substrate located on the inner side of the signal line provided on the upper surface of the substrate. At the same time, the lower end of the via is arranged close to the inner peripheral edge of the ground plane at the lower part of the substrate located on the inner end side of the signal line provided on the lower surface of the substrate. Then, of the inner peripheral edge of the ground plane between the upper portion of the substrate facing the via and the lower portion thereof,
Inner peripheral portions located on the signal line side of the upper and lower surfaces of the substrate are brought closer to the upper portion and the lower portion of the via, respectively.

Therefore, in the first and second high-frequency signal lines, the microstrip line structure is formed by the inner end of the signal line connected to the upper end and the lower end of the via, and the ground plane of the upper and lower parts of the substrate. The intermediate signal line portion connecting between the signal line and the established signal line can be shortened. Then, the transmission loss of the high-speed signal transmitted through the intermediate signal line can be reduced.

In the first and second high-frequency signal lines, the diameter of the inner periphery surrounding the vias of the plurality of ground planes provided on the substrate made of a dielectric is adjusted to be large or small, or the shape of the inner periphery is adjusted. , The characteristic impedance of a via having a pseudo-coaxial line structure with the plurality of ground planes can be matched to a fixed value of 50Ω or the like.

[0017]

Next, an embodiment of the present invention will be described with reference to the drawings. 1 and 2 show a preferred embodiment of a first high-frequency signal line according to the present invention. FIG. 1 is a front sectional view thereof, and FIG. 2 is a plan view thereof. Hereinafter, the first high-frequency signal line will be described.

In the figure, reference numeral 12 denotes a dielectric substrate formed by integrally laminating a plurality of dielectric layers 10 (four layers in the figure). The dielectric layer 10 is made of Al ₂ O ₃
And a ceramic having a dielectric constant ε of about 9.5, which is a main component.

The substrate 12 is provided with a via (hereinafter referred to as a via) 20 made of a conductor pole such as metallization.
2 penetrating vertically.

The plurality of dielectric layers 1 constituting the substrate 12
As shown by broken lines in FIG. 2, ground planes 30 are formed between the zeros and are made of metallization or the like surrounding the vias 20 at intervals such as circular or elliptical shapes. In other words, a plurality of ground planes 30 are arranged on the substrate 12 made of a dielectric material at predetermined intervals above and below.
The plurality of ground planes 30 make the signal line composed of the via 20 a pseudo coaxial line structure, and its characteristic impedance is matched to a constant value of 50Ω or the like.

On the upper surface of the substrate 12 and on the lower surface thereof, there are provided narrow signal lines 22, 2 made of metallization or the like extending in opposite directions (left and right directions in the figure).
4 is provided. Then, the signal lines 22 and 24 are
A microstrip line structure is provided by a ground plane 30 widely provided between the dielectric layer 10 above and below the substrate 12.

The inner ends of the signal lines 22 and 24 provided on the upper surface and the lower surface of the substrate 12 are connected to the upper end and the lower end of the via 20, respectively. Specifically, the upper end and the lower end of the via 20 are connected to the signal lines 22 and 2 on the upper surface of the substrate 12 and the lower surface thereof.
4 with the inner end.

The above configuration is the same as that of the conventional high-frequency signal line. However, in the first high-frequency signal line shown in the figure, the ground plane 30 is formed by connecting the inner peripheral edge 32 facing the via 20 to the upper part of the substrate 12. From the opposite side of the signal line 22 on the upper surface of the substrate 12 to the opposite side of the signal line 24 on the lower surface of the substrate 12, the eccentricity with respect to the via 20 is increased in a stepwise manner. It is located between layers 10. In other words, the plurality of ground planes 30 are formed such that the inner peripheral edge 32 of the ground plane facing the via 20 intermittently forms a cylindrical body in the substrate 12 obliquely up and down.
Are arranged between the plurality of dielectric layers 10 of the substrate 12.

Then, of the inner peripheral edge 32 of the ground plane 30 provided between the dielectric layers 10 above the substrate 12 and facing the via 20, the inner peripheral edge 32 located on the signal line 22 side on the upper surface of the substrate 12 is Close to the top of via 20. At the same time, of the inner peripheral edge 32 of the ground plane 30 provided between the dielectric layers 10 below the substrate 12 and facing the via 20, the inner peripheral edge 32 located on the signal line 24 side of the lower surface of the substrate 12 is connected to the via 20. Close to the bottom. The intermediate signal line portion 22a connecting the inner end of the signal line 22 connected to the upper end of the via 20 and the signal line 22 having the microstrip line structure by the ground plane 30 on the substrate 12 is shortened. At the same time, the inner end of the signal line 24 connected to the lower end of the via 20 and
The intermediate signal line portion 24a connecting the signal line 24 having the microstrip line structure with the ground plane 30 under the substrate 12 is shortened.

The diameter of the inner peripheral edge 32 of the plurality of ground planes 30 facing the via 20 between the plurality of dielectric layers 10 around the via 20 can be adjusted to be large or small.
2, the characteristic impedance is matched to a fixed value of 50Ω or the like.

The first high-frequency signal line shown in FIGS. 1 and 2 is configured as described above, and the first high-frequency signal line does not have a microstrip line structure on the upper and lower surfaces of the substrate 12. The intermediate signal line portions 22a and 24a can be shortened, and transmission loss of a high-speed signal transmitted through the intermediate signal line portions 22a and 24a can be reduced.

FIGS. 3 and 4 show a preferred embodiment of the second high-frequency signal line according to the present invention. FIG. 3 is a front sectional view and FIG. 4 is a plan view thereof. Hereinafter, the second high-frequency signal line will be described.

In the second high-frequency signal line shown in the figure, a plurality of ground planes 30 surrounding the via 200 are laid on the substrate 12 such that the inner peripheral edges 32 facing the via 200 overlap each other vertically when viewed from above. It is arranged between the plurality of dielectric layers 10. In other words, the plurality of ground planes 30 are interposed between the plurality of dielectric layers 10 of the substrate 12 such that the inner peripheral edge 32 of the ground plane facing the via 200 intermittently forms a tubular body in the substrate 12 vertically. Have been placed.

Vias (hereinafter referred to as vias) 2 formed of conductor poles such as metallization provided in the vertical direction of the substrate 12.
3, the substrate 12 extends obliquely up and down from the signal line 22 on the upper surface of the substrate 12 to the signal line 24 on the lower surface of the substrate 12, as shown in FIG. The upper end of the via 200 is arranged close to the inner peripheral edge 32 of the ground plane above the substrate 12 located on the inner end side of the signal line 22 provided on the upper surface of the substrate 12. With it
The lower end of the via 200 is arranged close to the inner peripheral edge 32 of the ground plane below the substrate 12 located on the inner end side of the signal line 24 provided on the lower surface of the substrate 12.

Then, of the inner peripheral edge 32 of the ground plane 30 provided between the dielectric layers 10 above the substrate 12 and facing the via 200, the inner peripheral edge 32 located on the signal line 22 side of the upper surface of the substrate 12 is Close to the top of Via 200. At the same time, of the inner peripheral edge 32 of the ground plane 30 provided between the dielectric layers 10 below the substrate 12 and facing the via 200, the inner peripheral edge 32 of the lower surface of the substrate 12 located on the signal line 24 side is connected to the via 200. Close to the bottom. An intermediate signal line portion 2 connecting between the inner end of the signal line 22 on the upper surface of the substrate 12 connected to the upper end of the via 200 and the signal line 22 having a microstrip line structure by the ground plane 30 on the upper surface of the substrate 12.
2a has been shortened. At the same time, the inner end of the signal line 24 on the lower surface of the substrate 12 connected to the lower end of the via 200 and the substrate 1
The intermediate signal line portion 24a connecting the signal line 24 with the microstrip line structure is shortened by the ground plane 30 below the second ground plane 30.

The via 200 has a plurality of vias 200 of the plurality of ground planes 30 between the plurality of dielectric layers 10 around the via 200.
The characteristic impedance of the inner peripheral edge 32 is adjusted to a fixed value of 50Ω or the like by adjusting the diameter of the inner peripheral edge 32 opposing to the size or changing the shape of the inner peripheral edge 32.

In the second high-frequency signal line, a plurality of ground planes 30 are formed with great effort and time.
From the upper side of the substrate 12 to the lower side thereof, the eccentricity of the via 200 in a stepwise manner from the opposite side of the signal line 22 on the upper surface of the substrate 12 to the opposite side of the signal line 24 on the lower surface of the substrate 12 is sequentially increased. The arrangement between the dielectric layers 10 can be eliminated.

Others are the same as those of the first embodiment shown in FIGS.
And the operation thereof is the same as that of the above-described first high-frequency signal line shown in FIGS. 1 and 2, and the same members are denoted by the same reference numerals. Description is omitted.

[0034]

As described above, according to the first and second high-frequency signal lines of the present invention, the inner end of the signal line connected to the upper and lower ends of the via and the substrate having the microstrip line structure are formed. An intermediate signal line portion that connects between the upper and lower signal lines, which is not a microstrip line structure, is shortened to reduce transmission loss of a high-speed signal transmitted through the intermediate signal line portion. Can be.

At the same time, the diameter of the inner peripheral edge facing the via of the plurality of ground planes provided between the plurality of dielectric layers of the substrate is adjusted to be large or small, or the shape of the inner peripheral edge is changed to change the shape of the inner peripheral edge. Thus, the characteristic impedance of the via having the quasi-coaxial line structure can be accurately matched to a constant value of 50Ω or the like.

A high-frequency circuit in which the via having the pseudo coaxial line structure and the signal lines on the upper and lower surfaces of the substrate having a microstrip line structure connected to upper and lower ends of the via via short intermediate signal line portions are connected. Signal line
High-speed signals including ultra-high-speed signals of 0 GHz or more can be transmitted efficiently with little transmission loss.

In the second high-frequency signal line according to the present invention, the ground plane is extended from the upper side of the substrate to the lower side of the substrate with a great deal of trouble and time, from the opposite side of the signal line on the upper surface of the substrate. The eccentricity of the via on the lower surface of the substrate to the opposite side of the signal line in a stepwise manner is eliminated, and it is not necessary to dispose the via between a plurality of dielectric layers of the substrate, thereby facilitating the operation of forming the substrate.

[Brief description of the drawings]

FIG. 1 is a front sectional view of a first high-frequency signal line of the present invention.

FIG. 2 is a plan view of a first high-frequency signal line according to the present invention.

FIG. 3 is a front sectional view of a second high-frequency signal line according to the present invention.

FIG. 4 is a plan view of a second high-frequency signal line according to the present invention.

FIG. 5 is a front sectional view of a conventional high-frequency signal line.

FIG. 6 is a plan view of a conventional high-frequency signal line.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Dielectric layer 12 Substrate 20, 200 Via 22, 24 Signal line 22a, 24a Intermediate signal line part 30 Ground plane 32 Inner periphery of ground plane

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-288446 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 23/12 301 H05K 3/46

Claims (2)

(57) [Claims] 1. DielectricConsists ofOn the boardPenetrate the substrate up and down
KuViaBe preparedAlong withFrom the dielectric around the via
Circular vias on a substrate
Open multipleGround planeUp and downPredetermined interval
KakeLine upThe via is provided with a pseudo coaxial line structure.When
And between the upper surface of the substrate and the lower surface thereof.EquippedOpposite to each other
In the directionExtendSignal lineRespectivelyThe upper part of the substrate and its lower part
Prepared forThe ground planeByMicro strip
Line structureWhenAlong withThatsubstrateofUpper and lower signal lines
WithinThe endRespectivelyThe upper end of the via and its lower endContactContinued
In the signal line of the high frequency electronic component comprising:pluralGround plane facing the via
As the inner edge goes from the top of the substrate to the bottom,
From the opposite side of the signal line on the surface to the opposite side of the signal line on the lower surface of the board
Against viaStepwiseIn orderEccentricPlaceWhat you did
Characteristic signal line for high-frequency electronic components. Wherein the substrate vertically to the substrate made of a dielectric
With obtaining Bei vias penetrating the dielectric surrounding the via
A via on a substrate made of
A plurality of ground plane surrounding spaced intervals side by side spaced a predetermined distance in the vertical direction, the via pseudo coaxial line structure
And, and, together with the microstrip line structure by the substrate top surface and the ground plane lower surface thereof and a signal line extending in opposite directions with the a provided above the substrate, respectively and its lower, upper and lower surfaces of the substrate in the inner end of the signal line respectively the via upper and high-frequency use electronic parts of the signal line formed by connecting to the lower end thereof, a plurality of ground plane surrounding the via surrounding the
Arranged so that the inner peripheral edges overlap each other when viewed from above.
And the upper end of the via is a signal line provided on the upper surface of the substrate.
Inner perimeter of the ground plane above the board located on the inner side of the
The lower end of the via is located close to the edge and
Is a substrate located on the inner end side of the signal line provided on the lower surface of the substrate
It is located close to the inner periphery of the lower ground plane.
From the signal line side of the upper surface of the substrate to the lower surface of the substrate
Pass the via up and down diagonally through the board over the signal line side
High-frequency use electronic parts of the signal line, characterized in that it comprises in are.